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NEWS TAGGED HPC
Tuesday 3 April 2018
TSMC advanced packaging seen crucial for HPC chips
The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...
Thursday 29 March 2018
Ardentec seeing orders for auto MCU ramp up
Taiwan-based Ardentec is expected to enjoy growing revenues generated from orders for automotive MCUs in 2018, according to industry sources. The IC testing company has seen orders...
Friday 23 February 2018
Samsung breaks ground on new EUV line in Hwaseong
Samsung Electronics has announced that it has broken ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to maintain its leadership in state-of-the-art semiconductor...
Tuesday 13 February 2018
NVM IP provider eMemory posts record revenues and profits for 2017
Taiwan-based eMemory, a developer and provider of embedded non-volatile memory (eNVM) technology, has reported net profits of NT$598 million (US$20.4 million) on consolidated revenues...
Thursday 8 February 2018
China IC backend houses vying for orders for mining ASICs
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
Wednesday 31 January 2018
CoWoS, SiP to be key packaging processes for AI chips
High performance computing (HPC) will become the most crucial platform in the development of process technologies for AI (artificial intelligence) chips, and CoWoS (chip on wafer...
Friday 19 January 2018
TSMC to see revenues rise 10-15% on HPC, IoT, 7nm orders in 2018
Taiwan Semiconductor Manufacturing Company (TSMC) will see its revenues grow 10-15% on year in 2018, mainly driven by the three major sectors of HPC (high performance computing),...
Tuesday 2 January 2018
TSMC lands short lead-time HPC chip orders from China, says paper
Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly landed short lead-time orders for HPC (high-performance computing) chips from China-based clients, according to a...
Thursday 28 December 2017
Acer to develop AI applications for FinTech, medical care, autonomous driving
With AI becoming a major focus of the IT industry, Acer is planning to develop AI applications including those for FinTech, autonomous driving and medical care, according to Maverick...
Wednesday 27 December 2017
Foxconn unveils commercial HPC in Taiwan
Foxconn Electronics has unveiled what it claims as Taiwan's first commercial HPC (high performance computing) system capable of delivering up to 4.13Gflops/sec per watt, in cooperation...
Wednesday 27 December 2017
Data is like crude oil in new tech era, says Applied Materials VP Erix Yu
After progressing from the PC and network generation in 2000-2010 to the mobile device and social networking generation during 2010-2020, the ever-advancing tech development will...
Wednesday 13 December 2017
TSMC still upbeat about HPC chips, says chairman
Clients' demand for HPC (high-speed computing) chips at TSMC (Taiwan Semiconductor Manufacturing Company) has remained strong without signs of ebbing, according to company chairman...
Friday 20 October 2017
TSMC raises IC market forecasts for 2017
Taiwan Semiconductor Manufacturing Company (TSMC) has revised upward its forecasts for global foundry and overall IC market outlook for 2017 to a 7% and 16% growth, respectively,...
Monday 2 October 2017
Staying focused on profitability: Q&A with UMC co-president SC Chien
United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...
Wednesday 13 September 2017
ASML EUV equipment production to almost double in 2018
ASML has disclosed annual production of its extreme ultraviolet (EUV) lithography systems will increase to 20 units in 2018 from the current 12.
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research