Taiwan-based eMemory has verified its latest on-chip security IP on several of UMC's advanced nodes, according to the embedded NVM IP provider. The IP, based on unique IC biometrics,...
United Microelectronics (UMC) is looking to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, which will become available in 2018. The foundry also plans...
Samsung Electronics has increased the production volume of its 8GB high bandwidth memory-2 (HBM2) to meet growing market needs across a wide range of applications including AI, high-performance...
Taiwan Semiconductor Manufacturing Company (TSMC) expects sales generated from 10nm process technology to account for 10% of its overall revenues for 2017.
With Intel releasing its new Xeon scalable processors, server suppliers have begun unveiling their latest products using the CPUs. Dell has announced the full series of its 14th-generation...
Intel has launched its new Intel Xeon scalable processors, providing businesses with performance to handle compute-hungry tasks including real-time analytics, virtualized infrastructure...
Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high...
IC testing solution provider Chunghwa Precision Test Technology (CHPT) has reported consolidated revenues of NT$278 million (US$9.2 million) for May 2017, hitting a monthly record...
Taiwan Semiconductor Manufacturing Company (TSMC) has landed orders for high performance computing (HPC) chips for AI applications from Nvidia and Qualcomm, respectively, according...
Worldwide factory revenues for the high performance computing (HPC) technical server market grew by 3.9% to US$2.8 billion in the third quarter of 2016, compared with US$2.7 billion...
TSMC has certified the complete suite of Synopsys' digital, signoff and custom implementation tools for the foundry's most-advanced 7nm FinFET technology node, according to the EDA...
Cadence Design Systems has announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing (HPC) platf...
Samsung Electronics has begun mass production of 4GB DRAM package based on the second-generation high-bandwidth memory (HBM2) interface for use in high-performance computing (HPC),...
Imagination Technologies (IMG.L) and PEZY Computing K.K. announce a strategic partnership focused on development of next-generation efficient high performance computing (HPC) systems...
Worldwide factory revenues for the high performance computing (HPC) technical server market declined modestly on year by 2.6% to US$2.45 billion in the second quarter of 2014, down...
