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NEWS TAGGED HPC
Monday 24 August 2020
TSMC packaging development to remain focused on SoIC, organic interposer in 2021
TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...
Monday 24 August 2020
Samsung stepping up efforts for advanced chip packaging
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
Wednesday 19 August 2020
Taiwan PCB makers concerned about demand gap left by Huawei
Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.
Tuesday 18 August 2020
IC distributor Macnica Galaxy sees 1H20 profit hit 4-year high
Macnica Galaxy, a Taiwan-based IC distribution arm of Japan's Macnica Group, has reported its first-half 2020 net profits soared 87.6% on year to a four-year high of NT$130 million...
Thursday 13 August 2020
IC material suppliers see clear order visibility through 2021
Taiwan-based semiconductor material suppliers and distributors have enjoyed strong demand from their foundry clients for advanced-node manufacturing, and have seen clear order visibility...
Tuesday 11 August 2020
Nan Ya PCB sees 2Q20 profit rise 80% sequentially
Taiwan-based Nan Ya PCB saw its net profits soar nearly 80% sequentially to NT$833 million (US$28.36 million) in the second quarter of 2020, a sharp improvement from operating losses...
Monday 10 August 2020
Nan Ya, Kinsus to see 3Q20 revenue gains from ABF substrate shipments for HPC chips
Taiwan's IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology are optimistic that their revenues for the third quarter of 2020 may grow 20% sequentially and profits may...
Monday 10 August 2020
TSMC posts decreased July revenue
TSMC saw its July revenue decline 12.3% on month but remain above NT$100 billion (US$3.4 billion).
Friday 31 July 2020
Chroma Ate posts profit increase in 2Q20
Chroma Ate, which provides integrated and customized solutions for test and measurement instruments, has reported net profits increased 24% sequentially to NT$580 million (US$19.8...
Wednesday 29 July 2020
Semiconductor packaging materials to see 3.4% CAGR during 2019-2024
The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...
Tuesday 28 July 2020
Unimicron new plant set to produce ABF substrates for Intel in early 2022
IC substrate maker Unimicron Technology is slated to complete construction of a new plant in Yangmei, northern Taiwan by the end of 2020, followed by process optimization and validation...
Monday 27 July 2020
Taiwan ICT exports see potential negative variables in 2H20
Taiwan's ICT exports are expected to gain growth momentum in the second half of the year from rollouts of new consumer electronics devices, acceleration of 5G infrastructure construction,...
Friday 24 July 2020
ABF substrate suppliers see clear order visibility through 2021
ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all seen their order visibility extend into 2021, thanks to continued robust...
Thursday 23 July 2020
Sage Microelectronic achieves high reliability and performance with SSD controllers
From life sciences to astrophysics to quantum physics, advanced computation in every field heavily relies on high-performance computing (HPC) storage systems. While most enterprise...
Tuesday 21 July 2020
IC analysis lab iST posts sharp profit surge in 1H20
IC materials analysis specialist Integrated Service Technology (iST) saw its profits for the first half 2020 exceed those for all of 2019, driven by strong demand for advanced fabrication...