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Thursday 24 September 2020
ASE set to volume produce chip-last FOCoS process in 2021
ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...
Wednesday 23 September 2020
PCB equipment supplier Symtek optimistic about 2021
PCB equipment supplier Symtek Automation Asia (SAA) expects higher sales in second-half 2020 than in first-half 2020, with even brighter market prospect for 2021.
Tuesday 15 September 2020
ABF substrate supply to stay tight despite no shipments for Huawei
Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...
Wednesday 9 September 2020
OSAT providers to enjoy impressive SiP sales growth in 2020
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
Tuesday 8 September 2020
Chips R&D matters: Q&A with iST chairman Danny Yu
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...
Friday 4 September 2020
CHPT, Sporton and Sigurd post double-digit revenue increases in August
Taiwan-based IC test interface solutions provide Chunghua Precision Test Tech (CHPT), mobile device certification specialist Sporton International, and testing house Sigurd Microelectronics...
Friday 4 September 2020
SiP demand to boom in 2021
System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.
Monday 24 August 2020
TSMC packaging development to remain focused on SoIC, organic interposer in 2021
TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...
Monday 24 August 2020
Samsung stepping up efforts for advanced chip packaging
Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...
Wednesday 19 August 2020
Taiwan PCB makers concerned about demand gap left by Huawei
Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.
Tuesday 18 August 2020
IC distributor Macnica Galaxy sees 1H20 profit hit 4-year high
Macnica Galaxy, a Taiwan-based IC distribution arm of Japan's Macnica Group, has reported its first-half 2020 net profits soared 87.6% on year to a four-year high of NT$130 million...
Thursday 13 August 2020
IC material suppliers see clear order visibility through 2021
Taiwan-based semiconductor material suppliers and distributors have enjoyed strong demand from their foundry clients for advanced-node manufacturing, and have seen clear order visibility...
Tuesday 11 August 2020
Nan Ya PCB sees 2Q20 profit rise 80% sequentially
Taiwan-based Nan Ya PCB saw its net profits soar nearly 80% sequentially to NT$833 million (US$28.36 million) in the second quarter of 2020, a sharp improvement from operating losses...
Monday 10 August 2020
Nan Ya, Kinsus to see 3Q20 revenue gains from ABF substrate shipments for HPC chips
Taiwan's IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology are optimistic that their revenues for the third quarter of 2020 may grow 20% sequentially and profits may...
Monday 10 August 2020
TSMC posts decreased July revenue
TSMC saw its July revenue decline 12.3% on month but remain above NT$100 billion (US$3.4 billion).
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research