News tagged IC design, distribution at DIGITIMES

NEWS TAGGED IC DESIGN, DISTRIBUTION

Thursday 30 October 2025

STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era

IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...

Thursday 30 October 2025

Pichai outlines Alphabet’s next act: scaling AI from cloud to cars

Alphabet CEO Sundar Pichai underscored the company's accelerating progress in artificial intelligence infrastructure, product leadership, and autonomous mobility during its third...

Thursday 30 October 2025

Egis Technology unveils AI vision, robotics, and 3nm computing platforms at 2025 Tech Day

Taiwanese semiconductor group Egis Technology held its annual "2025 Egis Tech Day" on October 28, 2025, unveiling a suite of cutting-edge innovations under the theme of "fully activated...

Thursday 30 October 2025

Pegatron eyes 1Q26 production launch for Texas plant with Nvidia GB300 servers

Pegatron has revealed progress on its US manufacturing expansion, announcing that its Texas factory is set to begin mass production in March 2026. The facility will produce Nvidia's...

Wednesday 29 October 2025

Skyworks–Qorvo tie-up signals new phase of US semiconductor consolidation

Skyworks Solutions and Qorvo have agreed to merge in a cash-and-stock transaction valued at about US$22 billion, forming a US-based leader in high-performance radio frequency (RF),...

Wednesday 29 October 2025

South Korean tycoons meet Nvidia CEO as part of APEC corporate diplomacy

Leading South Korean conglomerate heads are set to engage in intensive "corporate diplomacy" during the 2025 Asia-Pacific Economic Cooperation (APEC) summit, meeting with global leaders...

Wednesday 29 October 2025

WPG launches smart warehousing to strengthen semiconductor supply chain services

In response to the surge in AI- and HPC-driven market demand, WPG Holdings' board of directors has approved an adjustment to its investment structure to further advance its semiconductor...

Wednesday 29 October 2025

Unified packaging standards seen as key to meeting AI and automotive demands

Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...

Wednesday 29 October 2025

A-SSCC to take place in South Korea, with 6 papers from Taiwan accepted

The IEEE Asian Solid-State Circuits Conference (A-SSCC), a major annual event in the semiconductor field, recently announced its paper selection results, with six papers from Taiwan...

Wednesday 29 October 2025

Commentary: With new AI chips, Qualcomm joins race to challenge Nvidia in the cloud

Qualcomm on Tuesday unveiled its latest AI accelerator cards, the AI200 and AI250, along with corresponding rack-level system designs,...

Wednesday 29 October 2025

Intel's 18A and advanced packaging boost Taiwanese IP design firms

Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service...

Wednesday 29 October 2025

Jensen Huang hails AI as 'America's next Apollo moment,' unveils US-built Blackwell supercomputers

Nvidia CEO Jensen Huang declared that the US is entering "America's next Apollo moment," framing the rise of artificial intelligence...

Wednesday 29 October 2025

Nvidia stakes US$1 billion in Nokia to build AI-native 6G networks

In a landmark announcement marking what leaders are calling the beginning of the AI-native wireless era, Nvidia and Nokia have established...

Tuesday 28 October 2025

AMD MI355X to power US Department of Energy's new supercomputers

AMD and the US Department of Energy (DOE) have announced two next-generation supercomputing systems to be built at Oak Ridge National Laboratory (ORNL) — the Lux AI supercomputer...

Tuesday 28 October 2025

India's semiconductor ecosystem expands beyond fabs with software-IP firms

As India prepares to begin commercial chip production by late 2025, much of the discussion has focused on new fabs in Gujarat.

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Nov 26, 08:00

Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation

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