Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...
Since the beginning of 2025, despite disruptions from US President Donald Trump's trade protectionism, the AI wave has driven American cloud service providers (CSPs) to continuously...
In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking...
The 26th China International Optoelectronic Exposition (CIOE 2025) opened in Shenzhen on September 10, attracting over 3,800 global companies across communications, optics, lasers,...
In a keynote speech delivered at the SEMICON Taiwan 2025, NXP CEO Kurt Sievers stressed that AI has ushered the semiconductor industry into a period of exponential expansion. Addressing...
After securing orders from electric vehicle maker Tesla for autonomous driving AI chips, Samsung Electronics' foundry division is reportedly in talks with xAI, an artificial intelligence...
Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its...
The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International...
Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented...
NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will...
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Czech Minister for Science, Research and Innovation Marek Ženíšek recently visited Taiwan to meet with National Science and Technology Council (NSTC) minister Cheng-wen...
Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...
The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies...
India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...
