High-speed transmission of AI servers has become a critical factor for major chipmakers and their supply chain partners to improve cloud computing performance, significantly driving...
Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy...
London Tech Week has brought significant attention to generative AI and the UK's evolving semiconductor industry. This event underscores Britain's ambition to enhance its position...
Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tape-outs.
Kunlunxin, a spin-off of Baidu's chip and architecture department, has just received investments from Beijing's Municipal AI Industry Investment Fund. It is the sixth AI-related investment...
Egis Technology has entered into an exclusive partnership agreement with Fingerprint Cards (Fingerprints), one of the world's top biometric sensor solution providers, allowing Egis...
Fan-out panel-level (FOPLP) packaging is gaining attention from semiconductor firms seeking extra capacity support, and two AI chip companies are in talks with OSATs about potential...
Taiwan's Central Bank announced to raise the Gross Domestic Product (GDP) growth rate forecast for the entire year of 2024 to 3.77% in the second quarter's quarterly Monetary Policy...
Cloud AI not only received major attention at Computex 2024 but the network communication chip business opportunities arising from cloud AI data centers were also further pushed to...
IC distributor and OEM Audix held its shareholder meeting on June 12, during which Audix Group chairman and president Chung Yuan-Kai shared his optimistic outlook for 5G NR/6G communications,...
Taiwan is expected to witness a significant surge in the number of data centers and supercomputers in the next few years, which will result in high electricity consumption.
