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Friday 17 July 2026
Laser Tek says AI demand is driving orders, but parts shortages are delaying shipments
Taiwanese laser processing equipment maker Laser Tek said that artificial intelligence(AI)-led investment in advanced packaging, testing, and passive components is boosting orders...
Friday 17 July 2026
WST targets AI optical boom as high-power CW laser shipments begin in 4Q26
Buoyed by robust shipments of optical communications products, Taiwanese optical communications company WaveSplitter Technologies (WST) nearly doubled its first-quarter revenue in...
Thursday 16 July 2026
InP substrates emerge as strategic asset as optical engine supply chain heads for reshuffle
As AI server interconnects advance toward 1.6T and co-packaged optics (CPO), high-power continuous-wave (CW) lasers are becoming a strategic battleground for global technology companies...
Friday 10 July 2026
E&R Engineering advances glass substrate pilot production to 2H27
E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global...
Monday 15 June 2026
China eases InP substrate exports, lifting compound semiconductor supply

China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026...

Tuesday 9 June 2026
PCL Technologies targets CPO as Penang plant nears completion
Optical communications maker PCL Technologies is expanding into high-power laser packaging, with its new Malaysia plant on track to pass customer certification by the end of 2026....
Wednesday 27 May 2026
Aixtron wins orders from Lumentum for G10-AsP systems to expand InP production
Aixtron has received multiple orders from Lumentum for its G10-AsP MOCVD systems, a move that could boost global production of indium phosphide (InP) lasers and detectors for 800G...
Tuesday 26 May 2026
Lightmatter joins TSMC on COUPE for 3D optical engines
AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
Friday 15 May 2026
InP compound semiconductors break AI power and bandwidth barriers
Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their...
Friday 15 May 2026
Column: The new space arms race is being fought with AI, lasers, and autonomous satellites
The emerging space arms race toward 2030 is no longer defined simply by the number of satellites nations can launch into orbit. Increasingly, it is being shaped by breakthroughs in...
Monday 4 May 2026
AI's 1.6T shift turns InP into optical supply chain bottleneck

The transition from 800G to 1.6T optical modules is no longer an upgrade cycle — it is a physics-driven inflection point.

Monday 20 April 2026
LEO satellites set to transform in-flight connectivity
For years, one of the most frustrating aspects of long-haul travel has been expensive, slow, and often unreliable in-flight Wi-Fi. With the rapid rise of low Earth orbit (LEO) satellite...
Monday 20 April 2026
MSP+ eyes 2026 growth with new Yangmei plant, advances in Micro LED and CPO
Micraft System Plus (MSP+), a supplier of mass transfer and laser technology equipment, will officially open its new Yangmei factory in northern Taiwan in May 2026, significantly boosting...
Thursday 16 April 2026
Samsung pushes HBM4 yields as advanced testing and cutting technologies emerge
Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According...
Thursday 26 March 2026
SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...