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Monday 30 December 2024
GB200 NVL shipments expected to accelerate amid KYEC's capex increase
According to a report by Mizuho, shipments of the GB200 NVL are on track to meet the late 2024 schedule, even though production volumes have initially been lower due to bottlenecks...
Friday 27 December 2024
Ensilience, Shin-Shin Bus partner on Taiwan's first EV virtual power plant
Ensilience, a subsidiary of the Yuen Foong Yu (YFY) Group, announced on December 26 a partnership with Shin-Shin Bus to launch a groundbreaking "Smart Charging and Storage System...
Friday 27 December 2024
GaNrich launches mass production of sapphire-based GaN components, introduces pin-to-pin solution
GaNrich Semiconductor, a compound semiconductor manufacturer, has begun mass production of gallium nitride (GaN) power devices on sapphire substrates. The company has also launched...
Friday 27 December 2024
iPhone 18 rumored to feature variable aperture, Sunny Optical to benefit
Apple plans to introduce variable aperture lens technology in the iPhone 18 when it launches in 2026, according to industry sources. The advancement is expected to significantly enhance...
Thursday 26 December 2024
Taiwan govt launches AI robotics initiative for July 2025 deployment
The National Science and Technology Council (NSTC) has unveiled its "AI-Driven Next Generation Robotics Technology Project" for 2025, as robotics development continues to gain prominence...
Thursday 26 December 2024
Samsung to reportedly slash 2025 foldable phone targets amid weak Galaxy Z6 sales
Samsung Electronics (Samsung) plans to boost shipments of its Galaxy S series in 2025 while scaling back targets for the Galaxy Z series, as the company shifts focus to its flagship...
Wednesday 25 December 2024
Mitsubishi Electric unveils 6th QZSS satellite, advancing smartphone positioning precision to one meter
Mitsubishi Electric has unveiled the sixth satellite in Japan's Quasi-Zenith Satellite System (QZSS) at its Kamakura Works facility. Scheduled for launch by the H3 rocket by the end...
Wednesday 25 December 2024
Samsung's Galaxy Unpacked 2025 to unveil Galaxy S25 series, Ring 2, and AR smart glasses
Samsung Electronics is preparing to unveil its latest products at the Galaxy Unpacked event scheduled for January 2025. This event is set to feature the launch of the flagship Galaxy...
Wednesday 25 December 2024
India RISC-V startup secures US$8 million, plans mass-producing first MCU by 2025
Mindgrove Technologies, an India-based IC design house, has secured US$8 million in funding, positioning the startup to commercialize its RISC-V products amid the Indian government's...
Wednesday 25 December 2024
Xiaomi announces Turbo 4 featuring Dimensity 8400
MediaTek held a Dimensity product launch event in Beijing, China, on the 23rd, with Xiaomi executives attending as partners and Vivo and Oppo showing support through videos. Xiaomi's...
Friday 20 December 2024
Foxconn quashes delay rumors: GB200 NVL72 server shipments set for 4Q24
Despite market speculations about potential delays in Nvidia's GB200 NVL72 series server shipments, industry sources confirm that Foxconn Technology (Hon Hai) is maintaining its original...
Thursday 19 December 2024
Vueroid sets new standard for 4K dash cam video clarity with AI & ISP technology
VUEROID, a leading high-resolution dash cam technology brand, announced today that it will launch its latest model at CES 2025, the S1 Infinite...
Wednesday 18 December 2024
Wistron to open second Victory plant in Vietnam in 1Q25, eye existing facility expansion
Taiwan-based Wistron, a leading electronics manufacturer and Apple supplier is set to begin operations for its US$24.5 million investment in Ha Nam Province, Vietnam.
Monday 16 December 2024
Huawei's new Mate 70 faces uphill battle despite domestic chip push
Huawei is preparing to launch its Mate 70 series amid industry skepticism over its ability to compete with mainstream rivals, despite trumpeting an all-Chinese semiconductor supply...
Friday 13 December 2024
TSMC to integrate CoWoS and SiPh in 2026, sources say
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...