CONNECT WITH US
NEWS TAGGED MANZ
Tuesday 22 October 2024
Manz pushing CoPoS to drive up AI chip capacity
Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...
Tuesday 27 August 2024
Manz AG anticipates growth in advanced packaging amid CoWoS shortage
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
Tuesday 4 June 2024
Laying groundwork for panel-level packaging processes, Manz deepens deployment in advanced semiconductor packaging blue ocean
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
Thursday 7 September 2023
Innovative technology and exclusive service mechanisms - Manz Taiwan helps customers adopt FOPLP
Fan-out panel level packaging (FOPLP) offers advantages in cost control, high-density integration, and high reliability. After years of research and development, the technology has...
Wednesday 24 May 2023
Manz AG develops breakthrough production solution of panel-level packaging to seize growth of automotive semiconductors
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia...
Thursday 6 October 2022
Manz AG takes leading market position of FOPLP equipment by fast transitioning from concept to mass production
In 2022, the demand of semiconductor chips is facing an uncertain outlook, apart from the strong surge in orders of previous year. Especially in consumer electronics sectors, the...
Tuesday 28 December 2021
Providing one-stop service for FOPLP RDL, Manz helps consumer electronics companies develop new opportunities
With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network...
Wednesday 21 April 2021
Manz intelligent production solutions enable new business growth
Manz AG is the wet chemistry process leader in Taiwan and China for production of displays panels, printed circle boards and advanced semiconductor packaging technology. The product...
Tuesday 26 August 2014
Manz and other equipment suppliers to showcase latest production solutions at Touch Taiwan 2014
Germany-based Manz AG and a number of Taiwan-based PCB and LCD panel equipment suppliers will showcase their latest production equipment for the PCB and flat panel industries at Touch...
Thursday 15 May 2014
Manz to set up PCB equipment experimental factory in China
Germany-based equipment maker Manz AG will invest CNY8.0 million (US$1.3 million) to establish a PCB production equipment experimental factory at its existing plant in Suzhou, eastern...
Thursday 31 October 2013
Demand for high-end PCBs promising: Q&A with Manz executive Alex Liu
Disappointing sales of high-end smartphones and other unfavorable factors have discouraged PCB makers from spending money on capacity building since the the second half of 2013. However,...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research