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Monday 29 June 2026
Apple reportedly seeks CXMT approval to secure DRAM supply amid memory crunch

DRAM and NAND Flash supplies are tightening as global AI data centers continue to expand. Apple is actively lobbying the Trump administration...

Monday 29 June 2026
Orbbec builds Vietnam factory to broaden global reach

Chinese 3D vision sensor maker Orbbec is expanding its global manufacturing network with a new production base in Vietnam, as robotics...

Monday 29 June 2026
SK Hynix sets up new strategy unit as HBM race intensifies
South Korean media report that SK Hynix has created a new memory strategy organization, a "Growth Strategy Department," to map out next-generation semiconductor strategy. The move...
Monday 29 June 2026
Rising lithium battery material prices trigger widespread inflation; Chinese battery makers forced to take action
China's electric vehicle (EV) and energy storage supply chains are undergoing a profound structural shift. Over the past year, prices of upstream battery materials have continued to...
Monday 29 June 2026
Onsemi's Synaptics acquisition intensifies competition for physical AI leadership
Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial...
Monday 29 June 2026
FIT consolidates EV charging brands, builds Saudi plant to localize supply
Foxconn Interconnect Technology (FIT) unveiled its global automotive platform brand One Mobility at The smarter E Europe 2026, the continent’s largest energy industry trade alliance,...
Monday 29 June 2026
LG expands data-center liquid cooling push, eyes Taiwan server partnerships amid AI infrastructure boom
As AI infrastructure pushes server power consumption to unprecedented levels, liquid cooling is rapidly moving from an alternative technology to a data-center necessity. Amid fragmented...
Monday 29 June 2026
Samsung slows next-gen memory push as price surge rewards existing lines

Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in...

Monday 29 June 2026
Qualcomm stirs AI data center competition with CPUs, ASICs, and accelerators
Qualcomm officially unveiled its Dragonfly data center platform at this week's annual investor day, laying out a four-pronged push into cloud AI that spans SerDes, PAM4 DSP, and other...
Monday 29 June 2026
Jih Lin rides AI power demand to clip packaging
Jih Lin is seeing stronger business momentum as higher power consumption per AI server rack drives data-center power management toward 800V high-voltage direct current (HVDC) architectures,...
Sunday 28 June 2026
LG Chem weighs CCL expansion as AI chip demand strains supply

LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as...

Sunday 28 June 2026
2nm advanced process waste surges 13x, Techzone targets semiconductor ESG waste treatment market
As advanced semiconductor processes rapidly transition from 28nm to 3nm and 2nm nodes, more frequent chemical cleaning procedures are driving an increase in demand for liquid chemical...
Sunday 28 June 2026
Smartwatch sales return to growth as AI and health features lift demand
Smartwatch sales slowed in 2024, but global demand has returned to growth in 2025, and first-quarter 2026 sales are still rising year on year. For consumers worldwide, the shift suggests...
Saturday 27 June 2026
Apple's reported 1.4nm roadmap signals prolonged race for advanced-node capacity
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could...
Saturday 27 June 2026
Hanmi targets advanced packaging market with FC Bonder 3.5

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...