DRAM and NAND Flash supplies are tightening as global AI data centers continue to expand. Apple is actively lobbying the Trump administration...
Chinese 3D vision sensor maker Orbbec is expanding its global manufacturing network with a new production base in Vietnam, as robotics...
Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in...
LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as...
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...
