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Monday 29 June 2026
Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong...

Monday 29 June 2026
Kyocera to invest JPY650 billion in chip equipment and data center components

Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment...

Monday 29 June 2026
Taiwan's first homegrown submarine enters dive trials ahead of handover; shipbuilder eyes unmanned boat contracts

Taiwan's first domestically built submarine, Haikun, has entered submergence testing and is on track to be handed over to the navy...

Monday 29 June 2026
BOE's military designation hands South Korean panel makers a strategic opening

The US government's move to add Chinese panel makers BOE and Tianma to a military-related list is raising concerns that Washington's...

Monday 29 June 2026
Taiwan optics makers eye humanoid robot vision market as deployments accelerate
As physical AI enters a pivotal growth phase in 2026, deployment of robotic systems is rapidly accelerating across the industry. Beyond established applications such as inspection,...
Monday 29 June 2026
Taiwan smartphone shipments rose in May despite higher component costs
Taiwan's smartphone market saw shipments expand in May as Mother's Day buying and demand for AI-enabled premium models offset rising upstream component costs, industry participants...
Monday 29 June 2026
AI demand drives Foundry 2.0 market revenue up 23% in 1Q26, says Counterpoint
Global revenue for the semiconductor industry's "Foundry 2.0" market reached US$86 billion in the first quarter of 2026, up 23% year-over-year, driven by strong demand for AI accelerators...
Monday 29 June 2026
Samsung could become HBM market share leader in 2027
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers...
Monday 29 June 2026
Apple reportedly seeks CXMT approval to secure DRAM supply amid memory crunch

DRAM and NAND Flash supplies are tightening as global AI data centers continue to expand. Apple is actively lobbying the Trump administration...

Monday 29 June 2026
Orbbec builds Vietnam factory to broaden global reach

Chinese 3D vision sensor maker Orbbec is expanding its global manufacturing network with a new production base in Vietnam, as robotics...

Monday 29 June 2026
SK Hynix sets up new strategy unit as HBM race intensifies
South Korean media report that SK Hynix has created a new memory strategy organization, a "Growth Strategy Department," to map out next-generation semiconductor strategy. The move...
Monday 29 June 2026
Rising lithium battery material prices trigger widespread inflation; Chinese battery makers forced to take action
China's electric vehicle (EV) and energy storage supply chains are undergoing a profound structural shift. Over the past year, prices of upstream battery materials have continued to...
Monday 29 June 2026
Onsemi's Synaptics acquisition intensifies competition for physical AI leadership
Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial...
Monday 29 June 2026
FIT consolidates EV charging brands, builds Saudi plant to localize supply
Foxconn Interconnect Technology (FIT) unveiled its global automotive platform brand One Mobility at The smarter E Europe 2026, the continent’s largest energy industry trade alliance,...
Monday 29 June 2026
LG expands data-center liquid cooling push, eyes Taiwan server partnerships amid AI infrastructure boom
As AI infrastructure pushes server power consumption to unprecedented levels, liquid cooling is rapidly moving from an alternative technology to a data-center necessity. Amid fragmented...