Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit...
In the second half of the 1990s, Samsung Electronics came to the forefront of Dataquest's DRAM manufacturer rankings. NEC and Toshiba were in second and third place, and other Japanese...
DIGITIMES recently interviewed Julian Hetherington, the director of the Advanced Propulsion Centre (APC), to understand the future of EV development in the UK and its potential benefits...
Taiwan's government-funded Industrial Technology Research Institute (ITRI) revealed its comprehensive 2035 technology strategy and roadmap on January 24, focusing on areas such as...
While the recent US CHIPS and Science Act, European Chips Act, and Japan's subsidy plan have enticed TSMC to build wafer fabs in the US, Germany, and Japan, Taiwan has responded with...
To counter the ban imposed by the US to slow down its development of advanced semiconductors while ensuring its dominance in general-purpose semiconductors, China is aggressively...
Taiwan-based Ventec Electronics, which specializes in niche-market copper-clad laminates (CCL) and thermal materials, has effectively penetrated the automotive industry supply chai...
Panel manufacturers on both sides of the Taiwan Strait plan to reduce production significantly during the Lunar New Year, encouraging a price rebound. This scheme has prompted white-box...
TCL CSOT CEO and COO Zhao Jun talked about automotive display tech breakthroughs and inkjet-printed OLED progress in an exclusive interview during CES 2024.
The Japanese-developed Perovskite Solar Cells (PSC) are the latest innovation in solar power technology. With enhanced practicality through technological evolution and strong government...
The Asahi Kasei Corporation, a prominent Japanese chemical company, is undergoing a strategic shift in response to the challenges posed by global economic downturns and the 2020 pandemic...
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
According to Nikkei, Japan-based semiconductor equipment provider Disco is anticipated to invest over JPY40 billion (US$273.8 million) to build a plant in Kure, Hiroshima...