The year 2026 is set to mark the commercial debut of 2nm mobile SoCs, with Qualcomm, Apple, and MediaTek among the first to release 2nm process chips for smartphones. The market expects...
Due to memory shortages and price hikes, Chinese smartphone brands are expected to reduce their 2026 inventory by at least 10%, mainly affecting cost-sensitive mid-to-low-end models...
Supply chain sources report that Chromebook shipments have stabilized under Google's support. Despite facing a memory market turmoil, Google has set a full-year shipment target of...
Apple Inc., Qualcomm Inc., and MediaTek are all set to advance their smartphone system-on-chip (SoC) offerings to the 2nm process node in 2026. This coordinated move signals the three...
Leading smartphone system-on-chip (SoC) manufacturers will fully adopt the 2nm process node in 2026, a move expected to significantly increase production costs and reshape competitive...
MediaTek has launched the Dimensity 9500s and Dimensity 8500 mobile processors, both carrying over key technologies from the company's flagship Dimensity platform. The new chips deliver...
MediaTek recently announced its December 2025 and full-year revenue results. December revenue reached NT$51.266 billion (approx. US$1.6 billion), up 9.32% month-over-month and 22.99%...
Market sources say Xiaomi is expanding its in-house XRing chip lineup. Beyond developing the next-generation XRing O2 on TSMC's N3P process, the company also plans to extend these...
Taiwan and Europe will continue to strengthen collaboration in advanced fields such as drones, robotics, and low Earth orbit (LEO) satellites in 2026, according to Chao-chung Kuo,...
Sporton International announced that it has completed the world's first Wi-Fi 8-core chip testing project to obtain certification from the US Federal Communications Commission (FCC)...
The Taiwanese Executive Yuan's 2026 Science and Technology Advisory Meeting concluded with Taiwan's top technology firms represented by new leaders, including TSMC's Cliff Hou and...
MediaTek is preparing to commence large-scale manufacturing of its new Wi-Fi 8 solution, the Filogic 8000, by the end of 2026, in response to heightened demand from telecom operators...
At CES 2026, MediaTek unveiled its next-generation Wi-Fi 8 chipset platform, the Filogic 8000 series, moving ahead of rivals by declaring its position early in the next wireless standards...
Taiwan's integrated circuit (IC) design sector faces intensified challenges as 2026 begins that may push its global revenue ranking to third place, largely due to competitive pressures...
