Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...
Nvidia's US$3.5 billion investment in MediaTek's overseas convertible bonds marks more than a financial bet. It underscores how the chip leader is trying to anchor its AI infrastructure...
Nvidia and MediaTek are widening a global AI partnership that could reshape data center, edge, and PC hardware markets. MediaTek's US$3.9 billion overseas convertible bond sale, largely...
MediaTek has completed pricing on US$3.9 billion of overseas convertible bonds, more than NT$120 billion and what the company says is the largest overseas CB ever issued in Taiwan's...
Chip design company Agentrys announced last week that it raised US$24.5 million in funding from backers including MediaTek. It is one among an emerging crop of startups using agentic...
Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
Samsung Electronics launched its Galaxy S26 Fan Edition in the second half of 2026 with a starting price of 1.045 million won in South Korea, or about US$714, as it sought to round...
Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
Advances in low-latency and zero-latency wireless communications are seen as a critical foundation for physical AI, remote control, virtual reality (VR), augmented reality (AR), and...
Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...
Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full...
Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...
Taiwan's IC design industry is set to keep growing strongly in 2026, with revenue expected to rise 10%, driven mainly by companies involved in AI and AI ASIC projects such as MediaTek,...
