Samsung Electronics recently disclosed its next-generation memory solution technology roadmap on Memory Con 2024.

SK Hynix is expanding the High Bandwidth Memory (HBM) contribution to its DRAM revenues and expects a deepening effect of the customization trend of HBM.

SK Hynix is slated to officially break ground in March 2025 for a new advanced memory plant in Yongin, South Korea.

Samsung Electronics announced an increase in its 2024 HBM shipping volume and disclosed more details about the development of its HBM4 product, showing that its specifications are...

Longsys Electronics' recent acquisitions of Zilia (formerly SMART Brazil) and Longforce Technology Suzhou (formerly Powertech Technology Suzhou) mark the Chinese memory module specialist's...

ASML's future may be decided by Beethoven.

Following the plan to construct an advanced semiconductor packaging facility in Indiana, United States, SK Hynix recently detailed its site selection in West Lafayette, as reported...

Industrial memory module specialist Innodisk has voiced optimism about its operations in 2024, citing solid demand for AI device applications.

According to Randy Chien,...

Tax incentives promised for South Korean semiconductor companies by its version of the Chips Act may fall through the fingers.

Micron Technology has seen its orders for High Bandwidth Memory (HBM) wait to be fulfilled throughout 2025.

Samsung is building a virtual fab

Reports suggest that Samsung Electronics may soon become the sole supplier of 12-layer HBM products for Nvidia.

Support from Taiwan's supply chain was behind US memory IDM Micron's successful mass production of its latest-generation high bandwidth memory (HBM) product – HBM3E –...

Chinese exhibitors went full native.

Synopsys recently kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by company...