VIA Technologies has announced the VIA EPIA-T700, the first motherboard based on the recently announced Mobile-ITX form factor. Measuring 6×6cm, the VIA EPIA-T700 is a compact...

VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices.

VIA Technologies has noted that it is planning to launch a new form factor – Mobile-ITX – between the end of 2008 and the first quarter of 2009. The form factor's size...