Recent industry sources indicate that major mobile SoC providers like Apple and Qualcomm are delaying the adoption of TSMC's 2nm technology until 2026 due to high costs. While some...
The world's leading memory module and flash memory brand, ADATA Technology, will be participating in CES 2025 with its gaming brand XPG and industrial-grade embedded storage brand...
The Indian competition regulator is reportedly poised to charge Apple with engaging in anti-competitive practices related to its App Store operations. This impending case draws parallels...
Despite the fact that Huawei employs mobile processors manufactured by China's SMIC, the company continues to rely on non-Chinese memory manufacturers for its premium smartphones,...
While Samsung Electronics (Samsung) can breathe a sigh of relief as Qualcomm's close collaborator following the US semiconductor manufacturer's victory in its lawsuit against UK semiconductor...
Qualcomm is doubling down on smart terminals, eyeing the automotive and Internet of Things (IoT) sectors to fuel its next growth phase. At two events in November, the company revealed...
A report by Nikkei Asia reveals that Sony Semiconductor Manufacturing, operating mainly from four factories in Kyushu, Japan, has shipped over 20 billion image sensors. To...
Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience...
While Samsung Electronics has integrated its own Exynos 2400 chip in some models of the Galaxy S24 series, the foldable Galaxy Z Flip6 and Fold6 series are still entirely equipped...
Taiwan's entry into the 5G era began in February 2020 with the licensing of 1.8 GHz, 3.5 GHz, and 28 GHz frequency bands. The 28 GHz band was positioned as a gateway for millimeter...
Multiple media sources have reported that MediaTek's 5G modem chips may soon replace Intel's products in upcoming Apple Watch models. If true, it will mark MediaTek's first entry...
Samsung Electronics is exploring the development of discrete package low-power DRAM (LPDDR) for Apple's iPhones to meet the tech giant's evolving requirements, though Samsung has...
Innolux Corporation's mass production of fan-out panel-level packaging (FOPLP) has been postponed to the first half of 2025, as shifting demand and complex verification processes...
Arm CEO Rene Haas has openly expressed his aspirations for AI, envisioning that all future AI applications will run on Arm technology in some form. This strategic shift suggests that...
Recently, Huawei's executive director and chairman of the board of directors of the consumer business group (BG), Richard Yu, announced that the new foldable flagship smartphone,...
