Japanese electronics component manufacturers such as Murata, Taiyo Yuden, and TDK are mostly conservative about the recovery of smartphone demand and are now placing their hope on...
Radio-frequency (RF) and power amplifier (PA) chip suppliers have noticed a slight pick-up in orders for Android smartphones as related brand vendors prepare for China's approaching...
Japan's leading electronics components maker Murata Manufacturing will deliver its first batch of automotive inertial navigation sensors by the end of March 2024, and has decided...
MLCC shipments for consumer applications have shown signs of rebounding since mid-January, and suppliers are expected to see their inventory fall to regular levels in the second...
The worst moment for the passive components industry has passed and suppliers are expected to see signs of market recovery in the second quarter of the year, with automotive applications,...
Murata Manufacturing Co., a leading Japanese manufacturer of ceramic passive electronic components, particularly Multi-layer Ceramic Capacitors (MLCCs), plans to invest JPY 45 billion...
China's fast-growing multilayer ceramic capacitor (MLCC) market will see the country account for 43.5% of global MLCC demand by 2025, making it the largest, according to the Chinese...
China-based Maxscend Microelectronics, dedicated to supplying RF frontend chips such as RF switches and low-noise amplifiers, is set to kick off trial production of SAW (surface acoustic...
A slowdown in demand for consumer electronics devices has prompted Taiwan-based MLCC suppliers to cut commodity MLCC prices, but their larger Japan-based peers continue to keep prices...
Taiwan's leading passive component vendor Yageo will continue to advance its business transformation in 2022 by expanding its product lines and optimizing its shipment portfolios...
While the auto chip shortage is easing, some electronic components suppliers continue delaying delivery. The situation prompted carmakers like Nissan to adjust the design to use different...
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Apple is expected to significantly increase the adoption of IPD (integrated passive devices) for new iPhones and other iOS products, providing robust business opportunities for manufacturing...
