The computational demand brought about by AI model training will be the key driving force for chip growth in the future, according to B. S. Liang, senior director of the strategic...
ASE Technology and other OSATs continue to experience low production utilization rates for flip-chip (FC) packaging, due to sluggish demand for handset ICs, according to industry...
Wistron has put an increased focus on high value-added products like digital signage solutions, and has launched the WiCanvas brand to promote its digital signage product line for...
Samsung Electronics has focused its output reduction efforts on DRAM, while striving to maintain its NAND flash chip output to further enhance its market leadership, according to...
A recent rebound in demand for LCD TDDI chips from the handset sector could be short-lived because the global consumer market has remained in the doldrums, according to industry so...
This week, MediaTek introduced Dimensity Auto, an automotive chip platform consisting of its existing automotive chips as well as future planned product lines, signaling the company's...
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Japan is attempting to revitalize its chipmaking sector and strengthen related industry supply chains. Its current focus is on logic ICs. As a result of this strategy, two new chipmaking...
System-level testing demand for advanced ICs has been rising. Foundries including TSMC, Intel and Samsung Electronics, as well as OSATs such as ASE Technology, are already involved,...
ASML reportedly has seen the first cutback in orders for EUV equipment from TSMC, its largest customer, which market insiders speculate is on track to slash such orders by over 40%...
