On November 14, Foxlink Group (formerly Cheng Uei Precision Industry) inaugurated Ubilink, establishing Taiwan's largest AI supercomputing center and first platform utilizing Nvidia...
South Korea's thriving AI industry has catalyzed growth across its materials, components, and equipment sectors, particularly within the AI memory supply chain. South Korean manufacturer...
ASML Holding NV, the Dutch maker of advanced chip-making machines that are critical to global supply chains, reaffirmed its long-term revenue outlook as it bets on an artificial intelligence-driven...
Taiwan's AI computing power vendor ENLight Corp has teamed up with Bulky Animation Studio to establish an AI audiovisual technology center tailored to the growing AI needs of the...
With Nvidia planning GB300 after GB200, scheduled for launch in the first quarter of 2025, industry sources believe liquid cooling demand is poised to surge in 2025.
Maeil Business Newspaper reports that Samsung Electronics (Samsung) is set to finish the development of its sixth-generation high bandwidth memory (HBM4) by 2025 to secure...
SoftBank Group will be the first to build a supercomputer with chips using Nvidia's new Blackwell design, a demonstration of the Japanese company's ambitions to catch up on AI.
Nvidia is gearing up to debut its next-gen "Rubin" GPU in 2025, featuring eight HBM4 chips, with a Rubin Ultra version to follow, packing twelve. In a strategic bid to reclaim HBM...
Recent negative media coverage of US AI server companies ZT and Supermicro, both Nvidia clients, has raised supply chain concerns. Sources suggest that transferring AI server orders...
As we enter the era of artificial intelligence, major companies such as Nvidia, Microsoft, Apple, AWS, and Tesla are seizing vast resources, aiming for market dominance. However,...
The competition in the high bandwidth memory (HBM) market intensifies between South Korea's two major DRAM giants, Samsung Electronics (Samsung) and SK Hynix. Meanwhile, US manufacturer...
TSMC saw its monthly revenue top NT$300 billion (approx. US$9.4 billion) for the first time in October 2024, driven by a rise in significant orders from important clients such as...
The Ultra Accelerator Link (UALink) Consortium has officially become a legal entity, establishing itself to set a new high-speed, low-latency communication standard for AI data center...
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
