Despite Nvidia's absence at the 2025 OCP APAC Summit, rival factions within the anti-NVLink camp clashed over competing interconnect strategies for next-generation AI infrastructure...
At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
With the rapid rise of generative AI (GenAI) and immersive applications, traditional network technologies are struggling to meet the surging data transmission demands. At the Open...
Broadcom has introduced its next-gen Ethernet switch chip, Jericho4, at the 2025 OCP APAC Summit, marking a key move toward scaling AI data center connectivity across regions. The...
Broadcom has unveiled Jericho4, its latest AI fabric router chip designed to connect geographically dispersed data centers, reinforcing the company's belief that Ethernet—not...
Taiwan plays a uniquely strategic role in Google's global operations and its expanding artificial intelligence infrastructure, according to Chris Verne, a longtime Google executive...
As AI infrastructure continues to reshape global supply chains, the Open Compute Project (OCP) APAC Summit held in Taipei on August 5, 2025, highlighted the Asia-Pacific region's...
As cloud computing and data center industries accelerate the adoption of open architecture and open firmware, the traditional firmware ecosystem is undergoing deep restructuring.
AI data center chipmaker Astera Labs will showcase its next-gen interconnect technologies at this week's Open Compute Project (OCP) APAC event. In an exclusive interview with DIGITIMES,...
The Open Compute Project APAC Summit (OCP APAC) will officially open in Taipei in early August 2025. American IC design giant Broadcom, which holds a critical position in cloud AI...
The rapid increase in power consumption by AI servers is fueling a surge in demand for backup battery units (BBUs). Market expectations indicate that key Taiwanese players such as...
With the 2025 OCP APAC Summit set to kick off next week in Taipei, industry attention is turning toward the next wave of AI and high-performance computing (HPC) infrastructure.
As generative AI pushes data center infrastructure to new limits, pressure is mounting on thermal management, interconnect design, and ecosystem interoperability. Ahead of the 2025...
