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NEWS TAGGED PACKAGING
Tuesday 23 September 2025
Hanwha Semitech reportedly courts Foxconn, ASE in OSAT race
Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...
Tuesday 23 September 2025
Henkel Adhesives highlights portfolio of Semiconductor Packaging Materials to foster collaboration with Taiwan
As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled...
Tuesday 23 September 2025
TSMC extends lead in foundry market as Samsung loses ground
The global boom in artificial intelligence is creating a stark divide in the semiconductor industry, with Taiwan's TSMC solidifying its dominance while rival Samsung Electronics falls...
Tuesday 23 September 2025
12-inch SiC substrates poised for two-phase entry onto CoWoS packaging
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...
Tuesday 23 September 2025
Yole Group CEO interview (Part 1): TSMC dominates AI era as supply chain dynamics undergo massive shifts
The semiconductor industry is experiencing its most dramatic transformation in decades, driven by artificial intelligence's relentless demand for computing power. Traditional boundaries...
Monday 22 September 2025
Sunengine enters CPO advanced packaging supply chain
The explosive growth in AI computing demand is driving increased needs for GPUs, ASICs, and other components, accelerating the rapid development of global data center infrastructure...