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Wednesday 24 May 2023
Global outsourced manufacturing smartwatch shipments rose 15% in 2H22
Global smartwatch outsourced manufactured shipments increased 15% on year and accounted for 69% of overall global shipments in the second half of 2022, according to Counterpoint Re...
Thursday 18 May 2023
UK announces Japan chips partnership as fears grow over Taiwan
Rishi Sunak announced £18 billion ($22.5 billion) of new investment by Japanese businesses in the UK, mostly in clean energy, as well as a bilateral "semiconductor partnership"...
Tuesday 16 May 2023
Samsung develops DRAM supporting CXL 2.0
Samsung Electronics has developed what the company claims is the industry's first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Intel and Samsung collaborated...
Friday 12 May 2023
Silicon Catalyst announces "Silicon Startups Contest" in partnership with Arm
On May 10, 2023, Silicon Catalyst, the world's only incubator focused exclusively on accelerating semiconductor solutions, announced a "Silicon Startups Contest" in partnership with...
Thursday 4 May 2023
US foundry SkyWater expands engagement with PsiQuantum to develop silicon photonics-based quantum computer
US-based SkyWater Technology, a Category 1A Trusted Foundry accredited by the Defense Microelectronics Activity (DMEA) under the US Department of Defense, announced on May 2 that...
Friday 21 April 2023
eMemory security-enhanced OTP qualifies on TSMC N5
NeoFuse, a security-enhanced version of eMemory's one-time programmable (OTP) non-volatile memory (NVM) technology, has been qualified on the TSMC N5 process. Another design tape-out...
Thursday 13 April 2023
Honda and Posco expand partnership into EV battery materials
Honda Motor and Posco Holding are looking to form a comprehensive partnership to facilitate the former's EV ambition. The duo said on April 11 that they are exploring possible collaboration...
Friday 7 April 2023
Intel delivers MCP prototypes to US Department of Defense
Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program.
Thursday 6 April 2023
Kioxia, Western Digital intro 218-layer 3D flash memory
Kioxia and Western Digital have revealed details of their latest 3D flash memory technology, showing their ongoing innovation collaboration. The 218-layer 3D flash memory uses advanced...
Thursday 30 March 2023
Primax announced reference design partnership with Qualcomm in IoT gateway platform
Following Qualcomm's Embedded World 2023 announcement of new IoT processors designed to support four major operating systems, Primax is announcing a reference design partnership for...
Wednesday 22 March 2023
Infineon and Delta Electronics sign MoU to extend long-term partnership from industrial to automotive applications
Infineon Technologies and Delta Electronics are expanding their long-term cooperation from industrial to automotive applications. On March 21, both companies signed a Memorandum of...
Tuesday 7 March 2023
Infineon and UMC extend automotive partnership with long-term agreement for 40nm eNVM microcontroller production
Infineon Technologies and United Microelectronics Corporation (UMC) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon...
Friday 3 March 2023
Innolux sees collaboration with Vedanta as critical to transformation
Innolux is pushing ahead with the second phase of its double-pronged transformation by partnering with the India-based Vedanta Group, having reached a milestone in its first phase...
Monday 20 February 2023
Amkor, GF team up for at-scale IC backend services in Europe
Amkor Technology and GlobalFoundries (GF) have formed a strategic partnership that will enable a comprehensive EU/US supply chain from semiconductor wafer production at GF to OSAT...
Monday 13 February 2023
GF, GM strike long-term direct supply agreement
General Motors (GM) and GlobalFoundries (GF) have jointly announced a strategic, long-term agreement establishing a dedicated capacity corridor exclusively for GM's chip supply. Through...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research