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Wednesday 30 August 2017
Qualcomm, Himax jointly develop 3D depth sensing solution
Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...
Tuesday 22 August 2017
TowerJazz and Tacoma announce partnership for 8-inch fab in China
Specialty foundry TowerJazz, Tacoma Technology, and Tacoma (Nanjing) Semiconductor Technology have announced that TowerJazz has received a first payment of US$18 million, rendering...
Tuesday 22 August 2017
Mitac to invest in India-based IT manufacturer
Mitac Holding has announced a plan to invest in India-based Infopower Technologies and will become a major shareholder of the firm. Infopower is a manufacturer of printed circuit...
Friday 18 August 2017
Dialog looking to extend partnership with Spreadtrum
Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...
Wednesday 16 August 2017
Globalfoundries demos 2.5D HBM solution
Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
Wednesday 2 August 2017
Qualcomm, Win Semi reportedly to team up for 5G mobile infrastructure
Qualcomm has recently approached GaAs IC foundry Win Semiconductors to cooperate in an infrastructure project for 5G mobile networks, according to market sources.
Wednesday 26 July 2017
Shuttle may turn profitable in 2Q17, says paper
Taiwan-based barebone system vendor Shuttle is expected to have achieved strong revenues in the second quarter of 2017, which may help the company turn profitable, according to a...
Tuesday 25 July 2017
TPK, O-film alliance plan in limbo
A planned partnership announced early 2017 by Taiwan-based TPK Holding and China-based Shenzhen O-film Tech may not be realized due to financial issues at O-film, according to industry...
Friday 14 July 2017
Compal reportedly to recruit ex-Inventec manager to lead server business
Compal Electronics reportedly has recruited an executive from Inventec to lead its server department and has also integrated its server team's resources, looking to land orders from...
Wednesday 12 July 2017
Brewer Science, Arkema partner to develop high-chi DSA materials for advanced node patterning
Brewer Science has announced the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copo...
Tuesday 4 July 2017
Sale of Micron shares to buoy Nanya profitability in 2Q17
Nanya Technology's sale of Micron Technology shares since mid-June is expected to buoy the Taiwan-based DRAM makers' profitability for the second quarter of 2017, which has been already...
Monday 3 July 2017
AMobile forms partnership with Konka to tap China market
AMobile Intelligent has disclosed it has formed a strategic partnership with Konka Group for tapping the China market of IoT-based smart city solutions.
Thursday 29 June 2017
MediaTek unveils NB-IoT SoC, partnership with China Mobile
MediaTek has unveiled its first narrow band Internet of Things (NB-IoT) system-on-chip (SoC), the MT2625, and announced a collaboration with China Mobile to build what the companies...
Thursday 22 June 2017
Compal evaluating partnership with LeEco
Commenting on its relationship with China-based LeEco, Compal Electronics president Ray Chen has said the company will complete an evaluation of LeEco at the end of June and will...
Thursday 22 June 2017
IOC and Intel announce worldwide TOP partnership through 2024
The International Olympic Committee (IOC) and Intel have announced a long-term technology partnership at an official signing ceremony in New York with IOC President Thomas Bach and...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research