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Friday 6 September 2024
Foxconn expects revenue growth in 3Q24
Hon Hai Technology Group (Foxconn) has disclosed that its revenue decreased sequentially by 4.2% in August. However, the company remains optimistic that its revenue will increase...
Friday 6 September 2024
Qualcomm CEO doubles down on AI PC chip pursuit
Qualcomm recently announced the expansion of the Snapdragon X series at the International Radio Exhibition Berlin (IFA Berlin 2024). Company CEO Cristiano Amon expressed confidence...
Thursday 5 September 2024
PSMC unveils Logic-DRAM and 2.5D interposer
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
Thursday 5 September 2024
Samsung and SK Hynix act on HBM4 for significant AI potential
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Thursday 5 September 2024
GaN emerges as key player in data center PSU market, driving competition among IDM brands
Artificial Intelligence (AI) is boosting rapid advancements in data center construction but with increasingly massive power demands. Research institutions predict that energy consumption...
Wednesday 4 September 2024
China SiC substrate manufacturer swings to profit amid decreasing prices
After two consecutive years of losses, SICC, China's leading SiC substrate manufacturer, achieved profitability in the first half of 2024.
Wednesday 4 September 2024
TSMC's 3/6nm tech shines as Intel Core Ultra 200V outperforms Qualcomm in AI pc benchmarks
At an event in Berlin on September 4, Intel introduced the Core Ultra 200V series processors, codenamed Lunar Lake. These new processors represent Intel's most efficient x86 architecture...
Wednesday 4 September 2024
Samsung's foldable devices under pressure amid rising sales competition
Despite Samsung Electronics' high expectations for the sales performance of its newly launched foldable smartphones, the Galaxy Z Fold 6 and Flip 6, intense competition from rivals...
Wednesday 4 September 2024
FOPLP gains momentum in advanced packaging as AI demand surges
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
Wednesday 4 September 2024
TSMC, other Taiwan firms form alliance to advance SiPh
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
Wednesday 4 September 2024
SK Hynix developing 16-layer HBM4 memory
SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...
Tuesday 3 September 2024
E Ink and Iris covets China's color e-paper market as its sales surge over 30% in 1H24
According to online monitoring data from Runto Technology (Runto), sales of color e-paper products in China's market grew by 318.2% year-on-year in the first half of 2024, with the...
Friday 30 August 2024
Netronix sees color e-readers and AI-equipped signage as growth drivers
E-reader manufacturer Netronix said it struggled to meet demands for color e-readers. The company views color e-readers and digital advertising signage as its two growth engines for...
Friday 30 August 2024
iPhone 16 sales performance to be affected by Apple Intelligence, among other variables
Apple has officially announced that the title of this year's fall product launch event will be "It's Glowtime." It will take place on September 9 at 10:00 am PT. The event is expected...
Friday 30 August 2024
Timely Blackwell shipments ease HBM supplier concerns
After Nvidia confirmed the on-schedule shipment of its latest Blackwell GPUs, high-bandwidth memory (HBM) providers, including SK Hynix and Samsung Electronics, expressed relief as...