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    Applied Materials targets US$5 billion advanced packaging revenue
    2min ago
    South Korea's Hanwool wins Delta Electronics MLCC inspection equipment order, breaking Japanese dominance
    8min ago
    IBM, MeitY Startup Hub sign pact to boost India's deep tech startups
    13min ago
    ASML hints at new 'T'-titled customer for 2029-2030 as Musk's Terafab lines up EUV tools
    16min ago
    BYD targets 40,000 European employees by 2030
    18min ago
    Semiconductors to consume 30% of Taiwan's power by 2035
    22min ago
    Commentaty: Huawei’s Kirin's road to 2027
    Oct 14, 17:01
    Analysis: What's GlobalFoundries calculus behind its US$2 billion entry into TSMC’s CoWoS ecosystem
    Oct 14, 17:01
    Commentary: What is Musk's plan to catch up with TSMC
    Oct 14, 17:01
    Commentary: The many hurdles of Apple HomeView
    Oct 14, 17:01
    NEWS TAGGED PERFORMANCE
    Thursday 15 October 2026
    AI server tracker: Rail-kit growth turns uneven as cooling suppliers sustain expansion
    Taiwan's rail-kit and thermal suppliers posted broad year-over-year revenue growth in September 2026, but sequential performance revealed uneven shipment schedules. All eight tracked...
    Thursday 15 October 2026
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI

    The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...

    Wednesday 14 October 2026
    Cerebras CEO reveals the capacity shortfall behind OpenAI's turn to Nvidia GPUs
    Cerebras Systems' shortage of data centre capacity was a key reason OpenAI turned to Nvidia GPUs to expand services for its next-generation models, co-founder and CEO Andrew Feldman...
    Wednesday 14 October 2026
    Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
    Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
    Wednesday 14 October 2026
    AI chip competition shifts to data-center efficiency as memory, interconnect limits bite
    As demand for artificial intelligence computing accelerates, the competitive focus in semiconductors is shifting beyond single-chip speed to the efficiency of entire data centers....
    Wednesday 14 October 2026
    Broadcom executive says chipmakers must tackle packaging, power limits together
    Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
    Wednesday 14 October 2026
    Cisco, Nvidia target high-speed optical interconnects with 4x USFP density
    Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s...
    Wednesday 14 October 2026
    CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?
    China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
    Wednesday 14 October 2026
    SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration
    AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
    Wednesday 14 October 2026
    China's AI chipmakers target 3D packaging, optical interconnects and software ecosystems
    China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D...
    Tuesday 13 October 2026
    Meta's Muse Wonder challenges OpenAI, Anthropic, but frontier AI comes at a higher price
    Meta Platforms unveiled Muse Wonder and Muse Wonder Full on October 12, 2026, marking its strongest challenge yet to OpenAI and Anthropic in frontier AI. Developed by Meta Superintelligence...
    Tuesday 13 October 2026
    Foxconn partners on Taiwan-made battery storage systems for 2027 rollout
    Tun Green Power partnered with Foxconn, Billion Watts, NoonSpare Energy Technology, and Rich Electric to develop behind-the-meter energy storage systems (ESS) using Taiwan-made lithium...
    Tuesday 13 October 2026
    Samsung to pay chip workers special bonuses in stock, pending shareholder approval
    Samsung Electronics plans to pay its semiconductor employees special bonuses entirely in company shares in late March or early April 2027, with two-thirds of the stock subject to selling...
    Monday 12 October 2026
    Biren's BR20X GPU targets 1,024-chip AI systems, but US curbs cloud mass production

    China's Biren Technology has successfully powered on its next-generation BR20X GPU, advancing to post-tapeout validation while preparing for customer...

    Monday 12 October 2026
    Taiwan's UMT extends 50%-plus revenue growth streak as LEO satellite deployments accelerate
    Taiwan-based Universal Microwave Technology (UMT) reported September 2026 revenue of NT$292 million (US$9.15 million), up 52.49% year-over-year, extending its streak of monthly year-over-year...
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    GlobalExhibition
    BIZ FOCUS
    Oct 14, 08:00
    Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
    Wednesday 14 October 2026
    Practical Insights & Industry Ideas
    Wednesday 14 October 2026
    GMIF 2026 Awards: Samsung, SanDisk, BIWIN, and Others Honored
    Tuesday 13 October 2026
    Chenbro unveils AI rack-level solutions at 2026 OCP Summit