DeepSeek released an updated version of its V4.1 Flash artificial intelligence (AI) model on October 17, improving coding and reasoning performance while reducing task execution time...
Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing...
IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance,...
Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating...
The European Union is strengthening its response to cybersecurity risks posed by artificial intelligence, planning to use automated measures to accelerate incident response while testing...
MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech, offering process chemicals,...
Chinese battery giant CATL is deploying sodium-ion technology to expand into Europe's energy storage system (ESS) market. The company recently signed a strategic agreement with German...
As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand...
Tong Yang Industry expects capacity utilization to reach 90%–95% in the fourth quarter of 2026, as North American aftermarket orders recover and support margins during the seasonal...
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Onsemi has said its latest EliteSiC hybrid power module is now being used in Sungrow's PowerTitan 3.0 energy storage platform, a move aimed at improving efficiency, power density,...
AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...
