MediaTek announced on September 30 that its flagship Dimensity 9500 chip powers Samsung's new Galaxy Tab S12 Ultra and Galaxy Tab S12+ tablets. The deal continues a long-running partnership...
Semiconductor startup Volantis has raised US$88 million in Series A funding to develop an AI inference architecture that uses photonic interconnect technology to address memory bottlenecks...
Nvidia is testing glass-free PCB material systems for its next-generation AI server platforms, evaluating polytetrafluoroethylene (PTFE) and hydrocarbon (HC) resin formulations for...
Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have...
Facing a prolonged memory supply crunch, Tesla CEO Elon Musk has announced steep cuts to the memory specifications of the company's AI5 and AI6 chips to secure enough memory for Optimus...
Huawei Technologies has unveiled its Mate 90 smartphone series, expanding the use of self-developed Kirin processors and HarmonyOS 7 as it looks to sustain flagship performance under...
Samsung Electronics on October 1 unveiled its next-generation premium Galaxy Tab S12 series, its first clip-on wireless earbuds, the Galaxy Buds On, and the Galaxy SmartTag3, which...
Champ-Ray Industrial is stepping up efforts to expand in Japan's drone market, using a recent sponsorship tie-in with the Oita Trinita professional football team in Japan's J2 League...
Huawei unveiled its Mate 90 smartphone series on October 1, with Richard Yu, Huawei executive director and chairman of the Consumer BG, introducing the new devices alongside a new...
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
China's humanoid robot market continued to expand rapidly in the first half of 2026, with shipments exceeding 19,000 units and accounting for about 77.9% of the global total. Chinese...
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
Qualcomm's senior vice president and general manager of the compute and gaming business, Kedar Kondap, said the biggest challenge facing the PC industry is not component shortages,...
Financial institutions routinely process massive volumes of operational data, turning complex analysis into executive presentations for trend tracking, performance evaluations,...
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
