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    LG Electronics reportedly moves into ASIC design services leveraging TSMC ties
    11h 3min ago
    Apple's iPhone market share fell in China as domestic brands held ground
    11h 3min ago
    BOE advances glass substrates and prepares 12-inch fab for volume production
    11h 3min ago
    Europe heat wave drives air conditioner demand and boosts power component orders
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    USMCA review and post-Brexit rules cloud the auto supply chain
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    NEWS TAGGED PERFORMANCE
    Wednesday 1 July 2026
    Tenstorrent's Jim Keller says startup will outpace Cerebras as AI chip competition intensifies

    AI chip competition is widening beyond raw performance, a shift that matters for global cloud providers, device makers, and investors...

    Wednesday 1 July 2026
    Anthropic's Sonnet 5 delivers near-Opus performance at 60% lower cost as export ban lifts
    The US Commerce Department on June 30 removed export restrictions on two of Anthropic's most advanced AI models, ending a roughly three-week freeze that had disrupted enterprise and...
    Wednesday 1 July 2026
    SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

    SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than...

    Monday 29 June 2026
    BYD's in-house smart driving chip reportedly faces long road to production vehicles despite vertical integration push
    BYD's newly unveiled Xuanji A3 autonomous driving chip may represent a major milestone in the company's semiconductor ambitions, but industry experts say bringing the processor into...
    Monday 29 June 2026
    US AI restrictions face scrutiny as Chinese models gain ground

    Chinese artificial intelligence developer Zhipu AI, also known as Z.ai, is narrowing the performance gap with leading US AI companies...

    Monday 29 June 2026
    Jih Lin rides AI power demand to clip packaging
    Jih Lin is seeing stronger business momentum as higher power consumption per AI server rack drives data-center power management toward 800V high-voltage direct current (HVDC) architectures,...
    Friday 26 June 2026
    Apple reportedly revamps Mac chip roadmap to accelerate AI push
    Apple is preparing its biggest shift yet to the release strategy for its in-house Mac processors, opting to skip high-end M6 Pro and M6 Max chips and instead bring more powerful AI-focused...
    Friday 26 June 2026
    IBM breaks sub-1nm barrier with 3D nanostack transistor platform
    On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
    Thursday 25 June 2026
    Qualcomm integrates Dragonfly data center systems into expanded Hugging Face AI partnership
    Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises...
    Thursday 25 June 2026
    Nvidia and AWS deepen push to simplify AI infrastructure at scale
    Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed,...
    Wednesday 24 June 2026
    Global market for advanced chip packaging set for rapid expansion
    The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
    Wednesday 24 June 2026
    AI robot paths split as humanoid prices plunge, industrial orders hit record

    China's Unitree Robotics has slashed its humanoid robot prices sharply, in stark contrast to the industrial robot market, where prices...

    Wednesday 24 June 2026
    JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
    JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
    Tuesday 23 June 2026
    Gogoro to unveil upgraded in-wheel motor scooter as Taiwan EV demand recovers
    Gogoro is preparing to launch a new electric scooter on June 23, 2026, that industry supply-chain sources said will feature an in-wheel motor, dual batteries and upgraded performance...
    Monday 22 June 2026
    Intel and AMD unveil ACE in x86 counteroffensive against Arm

    Intel and AMD have jointly introduced AI Compute Extensions (ACE), a new x86 instruction set specification designed to accelerate AI...

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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook