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Thursday 17 September 2026
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with...

Thursday 17 September 2026
Samsung expands SRAM, IP to speed chip development

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster...

Thursday 17 September 2026
FIT ramps up optical interconnect push as AI race shifts to connectivity
At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...
Thursday 17 September 2026
Foxconn links FII and FIT to tackle AI infrastructure beyond the chip
Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, manufacturing, management and vertical integration —...
Thursday 17 September 2026
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA)...
Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
Wednesday 16 September 2026
SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses,...

Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

Wednesday 16 September 2026
AI server tracker: BMC, cable, case suppliers post August 2026 gains

Taiwan's AI server supply chain continued to show strong year-over-year growth in August, although performance varied significantly...

Wednesday 16 September 2026
DIGITIMES Insight: Google scales TPU systems to 1 million chips as power becomes the bottleneck

At SEMICON Taiwan 2026, Google outlined the direction of its AI infrastructure, and DIGITIMES notes that the discussion extended well...

Tuesday 15 September 2026
Tesla's rare-earth-free Cybercab challenges China's grip on EV magnets
With Tesla's EV ambitions growing amid a years-long push toward full electrification, the deployment of the Cybercab has emerged as a major experiment testing the boundaries of autonomous...
Tuesday 15 September 2026
Beyond H100: China's GPU makers chase scale, not just parity

China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must...

Tuesday 15 September 2026
AI server tracker: OEM/EMS August revenue trends, operational outlook

Taiwan's original equipment manufacturer/electronics manufacturing services (OEM/EMS) sector is witnessing a structural split between...

Tuesday 15 September 2026
XPeng's Turing chip expands beyond cars
XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...