BenQ Materials showcased its eco-friendly performance fabric brand Xpore at the Taipei Innovative Textile Application Show (TITAS) 2026, marking the brand's second appearance at the...
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
As AI computing clusters continue to expand, performance requirements for scale-out interconnects between racks are rising rapidly. This is pushing traditional pluggable optical transceivers...
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...
Hotai Motor said Taiwan's auto market should remain stable in the fourth quarter, after September sales came in better than expected and the company kept its full-year 2026 forecast...
Correction, Oct. 6, 2026: An earlier version of this story, citing Bloomberg, reported that Qualcomm had agreed to license patents related to Huawei's LogicFolding...
Google's new flagship AI model, Gemini 4 Argon, has drawn strong results in multiple benchmark tests, but some employees still say its coding performance is not stable enough. According...
China's leading AI models have narrowed their performance gap with US rivals to a record low, while DeepSeek's latest advances in memory efficiency and its deepening work with Huawei...
Samsung Electronics has reportedly begun front-end wafer mass production of its next-generation Exynos 2700 mobile application processor, with production volume planned at more than...
Magnetic components maker LinkCom Manufacturing posted September consolidated revenue of NT$44.18 million (approx. US$1.39 million), up 32.53% from a month earlier and down 10.24%...
Huawei is increasingly framing its semiconductor strategy around a simple constraint: if advanced process nodes remain limited, more performance must come from architecture, interconnect...
Applied Materials and BE Semiconductor Industries (Besi) are expanding their partnership to address the increasingly complex connections between AI chips, extending joint development...
As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
Biren Technology is preparing its next-generation GPU for mass production, advancing a domestic AI accelerator roadmap built around broader low-precision support and locally available...
MediaTek announced on September 30 that its flagship Dimensity 9500 chip powers Samsung's new Galaxy Tab S12 Ultra and Galaxy Tab S12+ tablets. The deal continues a long-running partnership...
