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Tuesday 21 July 2026
China's EUV gap keeps semiconductor catch-up in check
As the US continues to tighten export controls on advanced semiconductor equipment to China, questions are mounting over whether China can narrow the gap with leading-edge manufacturing...
Tuesday 21 July 2026
Eko Agentic: AI-driven data analytics for optimising retail performance

Artificial intelligence is just an interesting theoretical problem for many scientists and engineers, but it is at its most useful when it directly responds to the needs...

Tuesday 21 July 2026
LGES accelerates sodium-ion battery plans while CATL secures early ESS lead
LG Energy Solution plans to establish a sodium-ion battery mother line at its Ochang Energy Plant in South Korea in 2026, seeking to narrow CATL's early commercial lead in energy storage...
Tuesday 21 July 2026
Hyundai labor unrest ripples through Kia, GM Korea supply chains
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Monday 20 July 2026
Samsung to cut over 800 US jobs amid market headwinds

Samsung Electronics is cutting over 800 jobs in the US from its smartphone, display, and consumer electronics business units. The division,...

Monday 20 July 2026
Cloud competition in SEA shifts toward AI, sovereignty, and cost

Singapore's relatively neutral stance on cloud adoption is helping make performance, compliance, and value the main factors in global...

Friday 17 July 2026
TSMC says A14 process on track for 2028 volume production
TSMC said at its earnings call on July 16 that its A14 process technology is developing as planned, with risk production set for 2027 and volume production slated to begin in 2028.
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
China's AI chips hit three walls — and bet on 3D memory to break through
China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
Friday 17 July 2026
KAI and Hyundai target joint AAM development to close South Korea's aircraft body gap
South Korea is accelerating efforts to build an advanced air mobility industry, but the sector is still struggling to produce a workable aircraft body. As US and Chinese rivals move...
Thursday 16 July 2026
TSMC says 2nm has four times as many tape-outs as 3nm at the same stage
Customer tape-outs for TSMC's N2 process have reached four times the number recorded by its 3nm technology at the same stage, showing faster design activity as the foundry ramps production...
Thursday 16 July 2026
Gotion High-Tech expects 1H26 profit to more than triple on market gains and expansion

Gotion High-Tech said its first-half earnings are set to rise sharply, a result that could matter for battery investors and electric-vehicle...

Wednesday 15 July 2026
AI server tracker: Power and thermal suppliers lead June revenue growth

Taiwan's AI server component suppliers generally maintained healthy revenue momentum in June, with power supply, thermal solution and baseboard...

Wednesday 15 July 2026
Apple reportedly explores PrismML's AI compression technology to bring larger models onto iPhones

Apple is reportedly evaluating AI model compression technology from Silicon Valley startup PrismML as it seeks to run more capable AI models...

Wednesday 15 July 2026
Intel sends its most advanced 18A node into orbit with Starfire space chip

Intel has unveiled Starfire, a space-grade processor that leverages its leading-edge 18A manufacturing process for satellites and other...