News tagged performance at DIGITIMES

NEWS TAGGED PERFORMANCE

Tuesday 28 April 2026

Strong demand and advanced packaging execution drive Amkor's upbeat quarter

Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packa...

Tuesday 28 April 2026

DeepSeek V4 fails to close gap as US-China AI divide persists amid chip constraints

DeepSeek's latest flagship model, V4, has renewed debate over the trajectory of the US-China AI race, with analysts and industry voices suggesting that China's progress in model efficiency...

Tuesday 28 April 2026

AI lifts memory: SK Hynix hits 72% margin as Samsung nears 70%

SK Hynix reported record results for the first quarter of 2026, with operating margin reaching about 72% — among the highest globally — as artificial intelligence (AI)-driven...

Monday 27 April 2026

DIGITIMES: Enterprise AI shifts toward inference as computing architectures undergo structural realignment

As enterprise adoption of generative AI accelerates, a new phase of infrastructure demand is beginning to take shape. According to...

Monday 27 April 2026

Taiwan IPC players shift to edge AI solutions: Growth opportunities and supply chain challenges in 2026

Introduction

Monday 27 April 2026

Taiwan's Rapidtek establishes link with second IoT CubeSat in orbit

Rapidtek Technologies said its second 8U Internet-of-Things CubeSat, Black Kite-2, developed under a startup satellite program led by Taiwan...

Monday 27 April 2026

Formosa 2 secures NT$58.9 billion refinancing, marking Taiwan's offshore wind maturity

Formosa 2 Wind Power (Formosa 2) held a refinancing ceremony on April 24, announcing the successful completion of a refinancing agreement totaling approximately NT$58.9 billion (approx...

Monday 27 April 2026

TSMC's refusal of ASML's expensive High-NA EUV equipment, explained

ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...

Monday 27 April 2026

Innolux enters leading tier of advanced packaging with new RDL and TGV technology

Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...

Friday 24 April 2026

New Partner of the Year at HPE 2026 Partner Summit

NewPower Worldwide today announced it was recognized by Hewlett Packard Enterprise (HPE) at the HPE Operations Partner Summit 2026, receiving the Spares Supply Chain...

Friday 24 April 2026

Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure

At Google Cloud Next 26, Google Cloud announced a strategic shift in its AI hardware approach by introducing two distinct eighth-generation Tensor Processing Units: the TPU v8t for...

Friday 24 April 2026

M31 and TSMC complete eUSB2V2 tapeout on N2P process

IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely...

Friday 24 April 2026

DeepSeek previews V4 models with Huawei integration, signaling shift in China's AI stack

Chinese artificial intelligence startup DeepSeek has released preview versions of its latest models — DeepSeek-V4-Pro and V4-Flash — marking a closer integration with domestic...

Friday 24 April 2026

Tesla's hidden US$2 billion AI hardware deal points to deeper chip, compute ambitions

Tesla has quietly taken a significant step deeper into artificial intelligence (AI), disclosing a US$2 billion acquisition of an unnamed...

Friday 24 April 2026

SMIC returns to advanced packaging, scales team to boost AI chip strategy

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing...

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