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Monday 15 September 2025
Energy and intelligence: a new benchmark in AI competition
AI giants are shifting the global competition in large language models (LLMs) away from benchmark dominance toward sustainability and real-world applicability, signaling a new phase...
Monday 15 September 2025
Topview Optronics poised to benefit from growing security integration demand
Topview Optronics, a subsidiary of Taiwan's Qisda Group, reported that integration efforts in the security control industry are gaining momentum. While customers previously focused...
Monday 15 September 2025
Arm raises stakes in mobile AI with Lumex CSS; debuts C1 CPU and Mali G1-Ultra GPU
Arm unveiled its Lumex Compute Subsystem (CSS) on September 10 at the Unlocked Summit in Shanghai, signaling its boldest step yet to elevate AI and gaming on flagship smartphones...
Sunday 14 September 2025
Intel outlines 2026 PC roadmap: Arrow Lake refresh to hold the line before Nova Lake overhaul

Intel is tightening its PC processor roadmap, confirming it will roll out an Arrow Lake Refresh in 2026 and follow with the next-generation...

Friday 12 September 2025
Advantest tops TEL in market value after 19 years, driven by AI chip testing boom
Japanese chip testing equipment giant Advantest has overtaken Tokyo Electron (TEL) in market capitalization for the first time in nearly two decades, signaling a shift in the balance...
Friday 12 September 2025
SEMICON Taiwan 2025: Nvidia shifts optical roadmap from co-packaged to co-integrated optics
Nvidia is advancing its optical interconnect research to support the growing scale of "AI factories" and accelerated computing clusters.
Friday 12 September 2025
OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
OneXPlayer unveiled its annual flagship 3-in-1 AI PC—the X1 Air, a versatile smart terminal that seamlessly transforms between a tablet, mini notebook, and handheld gaming console...
Friday 12 September 2025
SK hynix Completes World's First HBM4 Development and Readies Mass Production
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
Friday 12 September 2025
Nitto Denko and IBM collaborate on advanced semiconductor packaging materials
Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...
Thursday 11 September 2025
Advanced vapor chamber design positions Apple for ultra-thin iPhones and wearable devices
Apple has introduced its self-developed vapor chamber (VC) cooling technology for the first time in the iPhone 17 Pro series, aiming to maintain high performance during extended use...
Thursday 11 September 2025
Winbond sees nearly 90% DRAM price increase, aims for 4Q25 peak
Winbond Electronics has implemented significant price increases for its DDR4 DRAM products beginning in the third quarter of 2025, with contract prices for the fourth quarter finalized...
Thursday 11 September 2025
Taiwan Mobile forecasts 30% rise in iPhone 17 sales, driven by upgrade replacements from older models
Apple officially unveiled its latest iPhone 17 series on September 10, and Taiwan Mobile's Chief Consumer Business Officer, Tony Lin, expressed strong confidence in the new models,...
Thursday 11 September 2025
SK hynix begins supplying mobile NAND solution ZUFS 4.1
SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this soluti...
Thursday 11 September 2025
Samsung eyes xAI chip partnership following major Tesla deal
After securing orders from electric vehicle maker Tesla for autonomous driving AI chips, Samsung Electronics' foundry division is reportedly in talks with xAI, an artificial intelligence...
Wednesday 10 September 2025
Baidu launches ERNIE X1.1, claiming to rival OpenAI GPT-5 and Google Gemini 2.5 Pro benchmarks
Baidu has launched the upgraded inference model ERNIE X1.1, claiming it rivals US models like OpenAI GPT-5 and Google Gemini 2.5 Pro in benchmark tests and surpasses the DeepSeek...