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Wednesday 21 October 2026
AMD: Physical AI demands more than TOPS
Physical AI that can sense, reason, control machines and interact with people, Salil Raje, senior vice president of AMD's Embedded Computing Group, said TOPS (trillions of operations...
Wednesday 21 October 2026
Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup
PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...
Wednesday 21 October 2026
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Wednesday 21 October 2026
Samsung faces delays securing 2nm customers as 4nm capacity reaches full utilization
Samsung Electronics' foundry business has yet to finalize contracts with major global technology companies for its 2nm process, while demand has pushed its 4nm production lines close...
Wednesday 21 October 2026
Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
Wednesday 21 October 2026
Nvidia's Vera CPU signals a broader shift in AI infrastructure
Nvidia is positioning its Vera CPU as a central component of data-center infrastructure for agentic artificial intelligence, as multistep reasoning and tool calls increase demand for...
Tuesday 20 October 2026
Samsung eyes six foldables for 2027, including a rollable phone
Samsung Electronics is reportedly planning its largest-ever foldable smartphone lineup in 2027, expanding the Galaxy Z series to as many as six models. The broader portfolio, alongside...
Tuesday 20 October 2026
BYD's China EV battery market share slips as overseas installations surge 66.5%
BYD is facing declining market share in China's domestic electric vehicle (EV) battery market, even as its overseas business continues to expand, highlighting a growing divergence...
Tuesday 20 October 2026
Daeduck Electronics targets 2029 ceramic substrates for AI packaging
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...
Tuesday 20 October 2026
Hygon's revenue jumps 58% on AI chip demand, but growth slows amid 51% stock slump
China's Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and...
Tuesday 20 October 2026
Alibaba's XuanTie tops 6 billion RISC-V chip shipments, expands into AI servers with C950
Cumulative shipments of chips incorporating Alibaba DAMO Academy's RISC-V processor intellectual property (IP), branded XuanTie, have surpassed 6 billion, marking a milestone for the...
Tuesday 20 October 2026
ChatGPT hits 60,000 advertisers as OpenAI cuts prices
OpenAI is expanding its ChatGPT advertising business by cutting ad prices, adding campaign tools and recruiting advertising talent. ChatGPT has also emerged as one of the platforms...
Tuesday 20 October 2026
Analysis: China's proposed AI export controls target top-ranked foundation models, advanced agents
Chinese AI companies expanding overseas could face more clearly defined technology export restrictions under proposed regulations covering foundation models, AI agents, chip design,...
Monday 19 October 2026
DeepSeek updates V4.1 Flash to improve AI agent performance
DeepSeek released an updated version of its V4.1 Flash artificial intelligence (AI) model on October 17, improving coding and reasoning performance while reducing task execution time...
Monday 19 October 2026
Samsung targets Exynos 2700 expansion as Huawei advances Kirin chips
Samsung Electronics is developing the Exynos 2700 for broader use across its Galaxy S27 lineup in 2027, while Huawei has moved its next-generation Kirin chips into testing. The competing...