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Friday 26 June 2026
Apple reportedly revamps Mac chip roadmap to accelerate AI push
Apple is preparing its biggest shift yet to the release strategy for its in-house Mac processors, opting to skip high-end M6 Pro and M6 Max chips and instead bring more powerful AI-focused...
Friday 26 June 2026
IBM breaks sub-1nm barrier with 3D nanostack transistor platform
On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
Thursday 25 June 2026
Qualcomm integrates Dragonfly data center systems into expanded Hugging Face AI partnership
Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises...
Thursday 25 June 2026
Nvidia and AWS deepen push to simplify AI infrastructure at scale
Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed,...
Wednesday 24 June 2026
Global market for advanced chip packaging set for rapid expansion
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Wednesday 24 June 2026
AI robot paths split as humanoid prices plunge, industrial orders hit record

China's Unitree Robotics has slashed its humanoid robot prices sharply, in stark contrast to the industrial robot market, where prices...

Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
Tuesday 23 June 2026
Gogoro to unveil upgraded in-wheel motor scooter as Taiwan EV demand recovers
Gogoro is preparing to launch a new electric scooter on June 23, 2026, that industry supply-chain sources said will feature an in-wheel motor, dual batteries and upgraded performance...
Monday 22 June 2026
Intel and AMD unveil ACE in x86 counteroffensive against Arm

Intel and AMD have jointly introduced AI Compute Extensions (ACE), a new x86 instruction set specification designed to accelerate AI...

Thursday 18 June 2026
BMW opens Neue Klasse reservations early; car business margin forecast unexpectedly cut in half
Although BMW's Neue Klasse BEV lineup is receiving strong market feedback and demand, it is also facing challenges due to weakness in the Chinese auto market and the conflict in the...
Thursday 18 June 2026
SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis...

Thursday 18 June 2026
Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin...
Thursday 18 June 2026
Nuvoton partners Qualcomm to advance tethered XR glass SoC business

Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered...

Thursday 18 June 2026
Cincoze showcases Edge AI and Automation at Automate 2026.

Rugged edge computing brand – Cincoze will participate in Automate 2026 in Chicago, USA, from June 22–25 (Booth #861). Under the theme of "Empowering Smart...

Thursday 18 June 2026
UC San Diego researchers turn retired Pixel phones into low-cost computing cluster

Backed by Google, researchers at the University of California, San Diego, are repurposing retired Pixel phones into a computing cluster...