As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand...
Tong Yang Industry expects capacity utilization to reach 90%–95% in the fourth quarter of 2026, as North American aftermarket orders recover and support margins during the seasonal...
Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
Onsemi has said its latest EliteSiC hybrid power module is now being used in Sungrow's PowerTitan 3.0 energy storage platform, a move aimed at improving efficiency, power density,...
AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...
Taiwan's rail-kit and thermal suppliers posted broad year-over-year revenue growth in September 2026, but sequential performance revealed uneven shipment schedules. All eight tracked...
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...
Cerebras Systems' shortage of data centre capacity was a key reason OpenAI turned to Nvidia GPUs to expand services for its next-generation models, co-founder and CEO Andrew Feldman...
Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
As demand for artificial intelligence computing accelerates, the competitive focus in semiconductors is shifting beyond single-chip speed to the efficiency of entire data centers....
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
Cisco and Nvidia announced at the 2026 OCP Global Summit that they are jointly developing an ultra-dense small form factor pluggable (USFP) optical module designed to support 400Gb/s...
