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    Commentary: Behind Micron's bet for a long memory demand cycles
    8h 30min ago
    Interview: Qnity's Taiwan investment to focus on advanced packaging, CPO and cooling
    8h 31min ago
    GPU and ASIC new platforms to drive stronger server shipments in 2H26
    8h 31min ago
    South Korean memory makers weigh stronger profits from general DRAM than HBM
    8h 31min ago
    MCU price hike expectations drive early 1H26 pull-ins
    8h 31min ago
    iPhone 18 Pro price hike: Memory costs or margin play?
    8h 31min ago
    NEWS TAGGED PERFORMANCE
    Monday 29 June 2026
    BYD's in-house smart driving chip reportedly faces long road to production vehicles despite vertical integration push
    BYD's newly unveiled Xuanji A3 autonomous driving chip may represent a major milestone in the company's semiconductor ambitions, but industry experts say bringing the processor into...
    Monday 29 June 2026
    US AI restrictions face scrutiny as Chinese models gain ground

    Chinese artificial intelligence developer Zhipu AI, also known as Z.ai, is narrowing the performance gap with leading US AI companies...

    Monday 29 June 2026
    Jih Lin rides AI power demand to clip packaging
    Jih Lin is seeing stronger business momentum as higher power consumption per AI server rack drives data-center power management toward 800V high-voltage direct current (HVDC) architectures,...
    Friday 26 June 2026
    Apple reportedly revamps Mac chip roadmap to accelerate AI push
    Apple is preparing its biggest shift yet to the release strategy for its in-house Mac processors, opting to skip high-end M6 Pro and M6 Max chips and instead bring more powerful AI-focused...
    Friday 26 June 2026
    IBM breaks sub-1nm barrier with 3D nanostack transistor platform
    On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
    Thursday 25 June 2026
    Qualcomm integrates Dragonfly data center systems into expanded Hugging Face AI partnership
    Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises...
    Thursday 25 June 2026
    Nvidia and AWS deepen push to simplify AI infrastructure at scale
    Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed,...
    Wednesday 24 June 2026
    Global market for advanced chip packaging set for rapid expansion
    The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
    Wednesday 24 June 2026
    AI robot paths split as humanoid prices plunge, industrial orders hit record

    China's Unitree Robotics has slashed its humanoid robot prices sharply, in stark contrast to the industrial robot market, where prices...

    Wednesday 24 June 2026
    JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
    JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
    Tuesday 23 June 2026
    Gogoro to unveil upgraded in-wheel motor scooter as Taiwan EV demand recovers
    Gogoro is preparing to launch a new electric scooter on June 23, 2026, that industry supply-chain sources said will feature an in-wheel motor, dual batteries and upgraded performance...
    Monday 22 June 2026
    Intel and AMD unveil ACE in x86 counteroffensive against Arm

    Intel and AMD have jointly introduced AI Compute Extensions (ACE), a new x86 instruction set specification designed to accelerate AI...

    Thursday 18 June 2026
    BMW opens Neue Klasse reservations early; car business margin forecast unexpectedly cut in half
    Although BMW's Neue Klasse BEV lineup is receiving strong market feedback and demand, it is also facing challenges due to weakness in the Chinese auto market and the conflict in the...
    Thursday 18 June 2026
    SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

    A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis...

    Thursday 18 June 2026
    Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027
    Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook