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    LG Electronics's three strategies to counter competition from Chinese brands
    Sep 1, 19:00
    China's SeeYA wins Meta’s MR panel order as BOE misses certification
    Sep 1, 19:00
    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
    Sep 1, 19:00
    InP enters a capacity race as TCL moves into indium phosphide laser chips
    Sep 1, 19:00
    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
    Sep 1, 19:00
    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
    Sep 1, 19:00
    NEWS TAGGED PERFORMANCE
    Tuesday 1 September 2026
    SK Hynix touts up to 5.15x inference gains with custom HBM

    SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

    Tuesday 1 September 2026
    Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
    Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
    Tuesday 1 September 2026
    ASML says High NA EUV has reached its first high-volume logic product
    ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...
    Tuesday 1 September 2026
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

    As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

    Tuesday 1 September 2026
    Samsung weighs HBM4 bonuses as memory, foundry teams align
    Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
    Tuesday 1 September 2026
    OpenAI compresses Jalapeno design to 9 months
    OpenAI unveiled performance results for its in-house AI chip Jalapeno at Hot Chips 2026 ahead of Nvidia's latest earnings report, underscoring not whether it can beat GB200 or GB300,...
    Tuesday 1 September 2026
    SK Hynix explores Intel as second source for HBM base dies
    SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
    Monday 31 August 2026
    Cook made sustainability an Apple feature; the ledger he leaves John Ternus is mixed
    Tim Cook's most durable non-financial decision was to treat environmental and social performance as product attributes rather than corporate disclosure. It worked well enough that...
    Friday 28 August 2026
    Apple's M6 marks a transitional step before wider 2nm adoption
    Apple on August 25 unveiled the M6 and M5 Ultra chips without holding a launch event, with the M6 becoming the company's first processor built on TSMC's 2nm process and debuting in...
    Friday 28 August 2026
    Insight: China's next AI frontier is silicon, not smarter models
    For the past two years, China's AI companies have competed on a single axis: whose model performs best. That contest is starting to give way to a harder one — whether those models...
    Thursday 27 August 2026
    Driving measurable sustainability: CIDB Malaysia's blueprint for carbon accountability
    At Sustainability Environment Asia Conference 2026, Suhaimi Mansor, deputy chief executive of the Construction Industry Development Board (CIDB) Malaysia, delivered a clear mandate...
    Thursday 27 August 2026
    TI's multiaxial sensor exposes the next EV inverter race: precision catches up with power density
    As EV traction inverters increasingly migrate toward 800V architectures, demand for further technological upgrades designed to improve current-sensing performance has pushed the automotive...
    Thursday 27 August 2026
    SK Hynix questions PIM as thermal, packaging limits constrain HBM
    South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...
    Thursday 27 August 2026
    CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%
    CXMT is narrowing the performance gap with SK Hynix in high-speed DDR5 memory, with new benchmark tests showing CXMT chips running stably at 8,000 MT/s and delivering productivity...
    Thursday 27 August 2026
    Apple unveils 2nm M6 Mac mini as workstation race heats up
    Apple unexpectedly opened preorders for its new Mac mini on August 25, introducing the M6, its first chip built on a 2nm process, while also offering a higher-end version powered by...
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    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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