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Wednesday 23 September 2026
Taiwan tire maker Cheng Shin turns 'virtual tires' into an EV development weapon

Taiwanese tire maker Cheng Shin Rubber, best known for its Maxxis brand, is nearing its 60th anniversary and using AI and digital twins...

Wednesday 23 September 2026
Nvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment

As AI computing workloads surge, demand for higher GPU and CPU performance is triggering exponential growth in data center power density...

Wednesday 23 September 2026
Qualcomm launches dual Snapdragon flagship platforms for Xiaomi, Honor

Qualcomm unveiled two flagship mobile platforms, Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Extreme Gen 6, at Snapdragon Summit...

Wednesday 23 September 2026
SK hynix's venture arm moves beyond memory into optical interconnect and system software
SK hynix has launched a corporate venture capital (CVC) brand, SK hynix Ventures, and widened its investment scope beyond semiconductors and emerging technology to include AI computing,...
Wednesday 23 September 2026
Taiwan uses AI to close drone thermal imaging gap
As drones, smart vehicles, and autonomous platforms advance, the ability to accurately identify people, vehicles and heat sources in darkness and low-visibility conditions has become...
Tuesday 22 September 2026
SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the...
Tuesday 22 September 2026
Acer debuts first Googlebook with 360-degree hinge
Acer has launched its first Googlebook, a new flagship notebook equipped with Gemini Intelligence that combines premium materials, strong performance, smart features, and seamless...
Tuesday 22 September 2026
DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN
South Korean AI semiconductor company DEEPX is reportedly conducting a proof of concept with a US smart glasses company to test whether its low-power neural processing unit (NPU) can...
Tuesday 22 September 2026
MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices

MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery...

Tuesday 22 September 2026
MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook
MediaTek has launched the Dimensity CX C10 Max, the first chip in a new family called Dimensity Compute Experiences (CX), and is aiming it at Googlebook laptops.
Monday 21 September 2026
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

Monday 21 September 2026
Physical AI opens a new growth window for FD-SOI as China builds domestic supply chain

AI's shift from data centers into cars, robots, wearables, and connected devices is widening the market for fully depleted silicon-on-insulator...

Monday 21 September 2026
Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands

AI computing is changing how global hardware is designed, built, and deployed, with implications that extend well beyond Taiwan's tech...

Monday 21 September 2026
China sets first national perovskite solar testing standard

China has introduced its first national standard for perovskite photovoltaics, a move...

Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...