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Monday 21 September 2026
Physical AI opens a new growth window for FD-SOI as China builds domestic supply chain

AI's shift from data centers into cars, robots, wearables, and connected devices is widening the market for fully depleted silicon-on-insulator...

Monday 21 September 2026
Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands

AI computing is changing how global hardware is designed, built, and deployed, with implications that extend well beyond Taiwan's tech...

Monday 21 September 2026
China sets first national perovskite solar testing standard

China has introduced its first national standard for perovskite photovoltaics, a move...

Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Friday 18 September 2026
China's AI data center token costs hinge on access to advanced GPUs
China's AI data centers are confronting a severe chip access bottleneck, with the cost of producing tokens shaped less by model design than by geopolitics, according to a recent Caijing...
Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
Micron: AI memory crunch rewrites the market with long-term deals and custom designs
As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits...
Friday 18 September 2026
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium...

Friday 18 September 2026
Huawei Connect 2026: Huawei scales supernodes into million-card AI systems

Huawei is extending its AI infrastructure strategy beyond individual accelerators and storage systems, unveiling an Agentic supercluster...

Friday 18 September 2026
Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI
Apple unveiled its iPhone 18 Pro series featuring its inaugural 2nm smartphone silicon, the A20 Pro, which was followed by MediaTek's announcement of its own 2nm Dimensity 9600 Pro...
Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
Thursday 17 September 2026
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with...

Thursday 17 September 2026
Samsung expands SRAM, IP to speed chip development

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster...

Thursday 17 September 2026
FIT ramps up optical interconnect push as AI race shifts to connectivity
At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...