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    SK Hynix questions PIM as heat and packaging emerge as HBM limits
    6min ago
    Doosan develops 13µm ultra-thin CCL for memory chip substrates
    7min ago
    Apple reportedly seeks lower OLED panel prices through larger orders
    7min ago
    Huawei and Apple foldable phones set off a supply chain rush in September
    7min ago
    2027 tri-fold phones enter a new phase as materials and durability become key battlegrounds
    7min ago
    NEWS TAGGED PERFORMANCE
    Wednesday 26 August 2026
    Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
    At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
    Wednesday 26 August 2026
    TCL, Asus drop China OLED as LGD gains edge
    TCL has reportedly stopped using OLED panels from its own TCL CSOT unit as it expands its monitor lineup, instead turning again to LG Display (LGD), while Asus is said to have halted...
    Wednesday 26 August 2026
    Nvidia earnings hinge on Rubin ramp and Vera CPU
    Nvidia will release its fiscal second-quarter 2027 financial results on August 26, US time. Given Nvidia's performance pattern in recent quarters, Wall Street has come to expect a...
    Wednesday 26 August 2026
    Apple gives 2nm debut to Mac, not iPhone: M6 leads TSMC node transition
    Apple on Aug. 25 introduced M6 in a new Mac mini and M5 Ultra in a new Mac Studio, framing both chips around AI compute and memory bandwidth rather than conventional CPU headline numbers...
    Wednesday 26 August 2026
    Nvidia unveils Jetson Orin Nano 2 for edge AI robots and drones
    Nvidia has introduced Jetson Orin Nano 2, a compact robotics computer aimed at entry-level edge AI, with implications for developers building autonomous machines worldwide. The system...
    Wednesday 26 August 2026
    OpenAI says Jalapeño cuts latency up to 3.6x, targeting the bottleneck that slows agents
    OpenAI said its first custom inference chip, Jalapeño, delivered faster responses and better power efficiency than competing systems in tests across several large language models...
    Wednesday 26 August 2026
    Xiaomi launches Xring O3 SoC, yet its low adoption limits threat to MediaTek, Qualcomm
    Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...
    Wednesday 26 August 2026
    Waymo's 320 million-km milestone exposes the next robotaxi challenge: scaling the silicon
    As robotaxi services expand beyond individual cities into wider regions, the growing appeal of AI-assisted driving and the technological vision that AV developers are eager to realize...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Tuesday 25 August 2026
    SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

    SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems...

    Monday 24 August 2026
    AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
    AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
    Monday 24 August 2026
    Samsung DX hits first quarterly loss on chip inflation

    Samsung Electronics' Device eXperience (DX) division posted its first-ever quarterly operating loss in the second quarter of 2026, hit...

    Friday 21 August 2026
    Vecow eyes robotics growth as North America, EMEA account for 65% of business
    Taiwan industrial computer supplier Vecow is stepping up its push into robotics and edge AI, with North America and Europe, the Middle East and Africa (EMEA) together accounting for...
    Friday 21 August 2026
    Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

    At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

    Friday 21 August 2026
    Research Insight: 2028 key year for optical interconnects in AI racks
    Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale...
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    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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