News tagged performance at DIGITIMES

NEWS TAGGED PERFORMANCE

Friday 18 September 2026

Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026

Micron: AI memory crunch rewrites the market with long-term deals and custom designs

As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits...

Friday 18 September 2026

GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium...

Friday 18 September 2026

Huawei Connect 2026: Huawei scales supernodes into million-card AI systems

Huawei is extending its AI infrastructure strategy beyond individual accelerators and storage systems, unveiling an Agentic supercluster...

Friday 18 September 2026

Apple and MediaTek's latest SoCs address overkill performance by reserving space for agentic AI

Apple unveiled its iPhone 18 Pro series featuring its inaugural 2nm smartphone silicon, the A20 Pro, which was followed by MediaTek's announcement of its own 2nm Dimensity 9600 Pro...

Thursday 17 September 2026

Samsung bets on zHBM as 2.5D memory nears its limits

Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...

Thursday 17 September 2026

Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with...

Thursday 17 September 2026

Samsung expands SRAM, IP to speed chip development

Memory shortages and pricing pressures are reshaping Samsung Electronics' foundry intellectual property (IP) development, as faster...

Thursday 17 September 2026

FIT ramps up optical interconnect push as AI race shifts to connectivity

At the FIT Tech Day 2026 on September 16, Foxconn Interconnect Technology (FIT) chairman Sidney Lu noted that as artificial intelligence (AI) advances rapidly, the industry's focus...

Thursday 17 September 2026

Foxconn links FII and FIT to tackle AI infrastructure beyond the chip

Foxconn Industrial Internet (FII) chairman Brand Cheng said Foxconn is integrating four core capabilities — technology, manufacturing, management and vertical integration —...

Thursday 17 September 2026

Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV

China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA)...

Wednesday 16 September 2026

Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging

Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...

Wednesday 16 September 2026

SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses,...

Wednesday 16 September 2026

Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026

Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

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