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Tuesday 29 September 2026
Samsung bonus plan to lift South Korea talent race

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance...

Tuesday 29 September 2026
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

Tuesday 29 September 2026
Meta's Muse raises questions about AI model leadership, product moats
Meta's Muse AI agent has become a fresh example in the debate over whether frontier model performance still determines commercial success. In a new Stratechery article, founder...
Sunday 27 September 2026
Keysight pushes design-to-deployment standard for AI cluster validation

As AI applications expand rapidly across industries, testing and validation have become essential to moving innovation from R&D...

Saturday 26 September 2026
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles

Samsung Electronics' foundry recovery is gaining pace as higher utilization, firmer pricing, and stronger advanced-node demand improve...

Friday 25 September 2026
China's autonomous-driving suppliers confront the limits of software moats

Chinese autonomous-driving software specialist Momenta posted a strong first-half performance, with gross margin reaching 73.2% and...

Friday 25 September 2026
Bright LED Electronics rides PCBA rebound to double-digit growth

Bright LED Electronics said its core profit rebounded in the first half of 2026, helped by recovering printed circuit board assembly...

Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...
Thursday 24 September 2026
Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap
Alibaba has formally unveiled its self-developed Zhenwu V900 AI chip at the 2026 Apsara Conference, with CEO Eddie Wu describing the T-Head Semiconductor-designed processor as "China's...
Wednesday 23 September 2026
Taiwan tire maker Cheng Shin turns 'virtual tires' into an EV development weapon

Taiwanese tire maker Cheng Shin Rubber, best known for its Maxxis brand, is nearing its 60th anniversary and using AI and digital twins...

Wednesday 23 September 2026
Nvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment

As AI computing workloads surge, demand for higher GPU and CPU performance is triggering exponential growth in data center power density...

Wednesday 23 September 2026
Qualcomm launches dual Snapdragon flagship platforms for Xiaomi, Honor

Qualcomm unveiled two flagship mobile platforms, Snapdragon 8 Elite Gen 6 and Snapdragon 8 Elite Extreme Gen 6, at Snapdragon Summit...

Wednesday 23 September 2026
SK hynix's venture arm moves beyond memory into optical interconnect and system software
SK hynix has launched a corporate venture capital (CVC) brand, SK hynix Ventures, and widened its investment scope beyond semiconductors and emerging technology to include AI computing,...
Wednesday 23 September 2026
Taiwan uses AI to close drone thermal imaging gap
As drones, smart vehicles, and autonomous platforms advance, the ability to accurately identify people, vehicles and heat sources in darkness and low-visibility conditions has become...
Tuesday 22 September 2026
SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the...