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Tuesday 22 September 2026
SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the...
Tuesday 22 September 2026
Acer debuts first Googlebook with 360-degree hinge
Acer has launched its first Googlebook, a new flagship notebook equipped with Gemini Intelligence that combines premium materials, strong performance, smart features, and seamless...
Tuesday 22 September 2026
DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN
South Korean AI semiconductor company DEEPX is reportedly conducting a proof of concept with a US smart glasses company to test whether its low-power neural processing unit (NPU) can...
Tuesday 22 September 2026
MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices

MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery...

Tuesday 22 September 2026
MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook
MediaTek has launched the Dimensity CX C10 Max, the first chip in a new family called Dimensity Compute Experiences (CX), and is aiming it at Googlebook laptops.
Monday 21 September 2026
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

Monday 21 September 2026
Physical AI opens a new growth window for FD-SOI as China builds domestic supply chain

AI's shift from data centers into cars, robots, wearables, and connected devices is widening the market for fully depleted silicon-on-insulator...

Monday 21 September 2026
Wiwynn chair says AI hardware is being reshaped by power, cooling, interconnect demands

AI computing is changing how global hardware is designed, built, and deployed, with implications that extend well beyond Taiwan's tech...

Monday 21 September 2026
China sets first national perovskite solar testing standard

China has introduced its first national standard for perovskite photovoltaics, a move...

Monday 21 September 2026
Syensqo showcased advanced materials enabling AI-era semiconductor manufacturing at SEMICON Taiwan 2026

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing,...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Friday 18 September 2026
China's AI data center token costs hinge on access to advanced GPUs
China's AI data centers are confronting a severe chip access bottleneck, with the cost of producing tokens shaped less by model design than by geopolitics, according to a recent Caijing...
Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
Micron: AI memory crunch rewrites the market with long-term deals and custom designs
As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits...
Friday 18 September 2026
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium...