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Wednesday 25 March 2026
With Hua Hong partnership, STMicro builds 'China for China' supply chain
STMicroelectronics said this week that its STM32 microcontrollers, produced in partnership with Hua Hong Semiconductor, have entered volume production in China and are now being shipped...
Wednesday 25 March 2026
Xiaomi flags memory pressure, sees Apple user conversions, and pushes embodied AI strategy
Xiaomi executives outlined the group's 2025 performance and strategic priorities during an investor earnings call and webcast on March 24. Management highlighted record annual revenue...
Wednesday 25 March 2026
Agentic AI shift puts CPUs at the core as Arm rolls out first chip
Arm has officially launched the Arm AGI CPU, a new class of mass-production-ready processor built on its Neoverse platform and designed to power next-generation AI infrastructure....
Wednesday 25 March 2026
Arm unveils AGI CPU aimed at scaling agentic AI, promising higher rack performance and lower data center costs
Arm on March 24, 2026, announced the Arm AGI CPU, its first mass-produced chip product, designed specifically for AI data centers and built on TSMC's 3nm process. The company presented...
Wednesday 25 March 2026
SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech
SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin...
Tuesday 24 March 2026
Hanwha Semitech's SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee
Hanwha Semitech's supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained...
Tuesday 24 March 2026
China's AI GPUs face equipment and software constraints, but system-level design boosts self-reliance
Although it may appear that China's AI GPU development is behind the US by one or more generations, a recent Morgan Stanley report reveals the actual gap is smaller than widely per...
Tuesday 24 March 2026
Alibaba unveils XuanTie C950 and C925, advancing RISC-V into AI and edge computing

Alibaba's DAMO Academy has introduced two new RISC-V processors—the flagship XuanTie C950 and the energy-efficient C925—marking...

Tuesday 24 March 2026
Huawei's Ascend 950PR debuts with nearly 3x H20 performance, targets China's AI compute gap
Huawei has officially launched its Ascend 950PR processor and introduced the Atlas 350 AI accelerator card equipped with this chip, marking the commercial debut of its next-generation...
Tuesday 24 March 2026
Commentary: From chip performance to inference economics, Jensen Huang rewrites AI industry trends at GTC
Over the past three years, Nvidia founder and CEO Jensen Huang has returned to the same two-axis chart at each annual GTC conference — but the story that chart tells has shifted...
Monday 23 March 2026
SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...
Monday 23 March 2026
At Cheonan, Samsung is rewriting HBM's bonding playbook
Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
Monday 23 March 2026
Research insight: F1's 2026 regulations reshape powertrain competition and accelerate low-carbon transition
With the 2026 Formula One (F1) season opener in Australia, the first competitive validation of the sport's new regulatory framework has already highlighted the impact of a fundamental...
Sunday 22 March 2026
Samsung union votes to strike, risking Nvidia HBM4 supply disruption
Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to...
Saturday 21 March 2026
Analysis: Samsung's Exynos chip rebounds with mixed performance in 2nm era
Samsung Electronics' self-developed mobile application processor (AP) series, Exynos, long criticized for poor performance and overheating issues, is showing signs of revival. The...