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Monday 27 April 2026
TSMC refuses ASML's expensive High-NA EUV equipment, explained
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...
Monday 27 April 2026
Innolux enters leading tier of advanced packaging with new RDL and TGV technology
Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies...
Friday 24 April 2026
New Partner of the Year at HPE 2026 Partner Summit

NewPower Worldwide today announced it was recognized by Hewlett Packard Enterprise (HPE) at the HPE Operations Partner Summit 2026, receiving the Spares Supply Chain...

Friday 24 April 2026
Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure
At Google Cloud Next 26, Google Cloud announced a strategic shift in its AI hardware approach by introducing two distinct eighth-generation Tensor Processing Units: the TPU v8t for...
Friday 24 April 2026
M31 and TSMC complete eUSB2V2 tapeout on N2P process
IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely...
Friday 24 April 2026
DeepSeek previews V4 models with Huawei integration, signaling shift in China's AI stack
Chinese artificial intelligence startup DeepSeek has released preview versions of its latest models — DeepSeek-V4-Pro and V4-Flash — marking a closer integration with domestic...
Friday 24 April 2026
Tesla's hidden US$2 billion AI hardware deal points to deeper chip, compute ambitions

Tesla has quietly taken a significant step deeper into artificial intelligence (AI), disclosing a US$2 billion acquisition of an unnamed...

Friday 24 April 2026
SMIC returns to advanced packaging, scales team to boost AI chip strategy

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing...

Friday 24 April 2026
Samsung labor unions rally 40,000 workers, prepares for 18-day strike in May
Three major labor unions at Samsung Electronics held a large-scale protest on the afternoon of April 23 in front of the Pyeongtaek semiconductor campus in South Korea. An estimated...
Friday 24 April 2026
Asia Optical and Frore Systems team up on AI data center cooling
Asia Optical has signed a memorandum of understanding with Frore Systems to jointly develop liquid-cooling solutions for artificial intelligence data centers, as surging computing...
Thursday 23 April 2026
SpaceX eyes GPU push as Tesla taps Samsung for chip upgrade

SpaceX is exploring in-house production of graphics processing units (GPUs) as it cites potential chip supply constraints, even as Tesla...

Thursday 23 April 2026
SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected...

Thursday 23 April 2026
Japan PC shipments peak on upgrade cycle, correction ahead
Japan's PC market delivered a standout performance in the fiscal year ending March 2026, but underlying demand signals point to a sharp reversal as upgrade-driven momentum fades.
Wednesday 22 April 2026
CATL unveils ultra-fast charging battery and expands push into full energy ecosystem

China's dominant battery manufacturer, CATL, is accelerating its push to reshape the global electric vehicle (EV) landscape with a sweeping...

Wednesday 22 April 2026
Flagship smartphone SoCs upgrade to 2nm drives cost surge and brand procurement shifts
Starting in the second half of 2026, all flagship smartphone SoCs will transition to the 2nm process node. While this promises enhanced performance for flagship devices, it also triggers...