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Tuesday 25 August 2026
TSMC, Intel, and Samsung battle over backside power delivery below 2nm
As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
Tuesday 25 August 2026
SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems...

Monday 24 August 2026
AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
Monday 24 August 2026
Samsung DX hits first quarterly loss on chip inflation

Samsung Electronics' Device eXperience (DX) division posted its first-ever quarterly operating loss in the second quarter of 2026, hit...

Friday 21 August 2026
Vecow eyes robotics growth as North America, EMEA account for 65% of business
Taiwan industrial computer supplier Vecow is stepping up its push into robotics and edge AI, with North America and Europe, the Middle East and Africa (EMEA) together accounting for...
Friday 21 August 2026
Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

Friday 21 August 2026
Research Insight: 2028 key year for optical interconnects in AI racks
Optical communications will likely enter AI server racks in 2028, DIGITIMES analyst Joyce Chen said on August 20 at a semiconductor industry forum in Taipei, as rising AI cluster scale...
Friday 21 August 2026
SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
Friday 21 August 2026
Unitree chief says humanoid robots are not yet ready for mass real-world work
Unitree Technology's soaring debut underscored investor enthusiasm for humanoid robots, but the company's founder said the industry still faces key limits before machines can perform...
Thursday 20 August 2026
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
Thursday 20 August 2026
AI chip strategies echo StarCraft factions as memory bottleneck reshapes the race

The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained...

Thursday 20 August 2026
Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape

As demand for AI servers, high performance computing (HPC), and data center infrastructure accelerates, the semiconductor and power electronics test equipment market...

Thursday 20 August 2026
Henkel Launches LOCTITE ABLESTIK CDF900 Series Conductive Die Attach Film

Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026...

Wednesday 19 August 2026
China-backed quantum standards proposals advance as industry shifts toward commercialization
Quantum technologies are moving closer to commercial use. China says new international proposals on quantum measurement, randomness testing, and computing have advanced, underscoring...
Wednesday 19 August 2026
Samsung moves ahead of SK Hynix in 1d DRAM development race

Samsung Electronics is reportedly on track to complete development of 10-nanometer-class seventh-generation DRAM, also known as 1d DRAM,...