中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike
    2h 55min ago
    Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens
    2h 55min ago
    AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem
    2h 55min ago
    AI buildout lifts demand for China high-speed optical module makers
    2h 55min ago
    SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips
    2h 55min ago
    NEWS TAGGED PERFORMANCE
    Wednesday 2 September 2026
    Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
    Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
    Wednesday 2 September 2026
    DRAM giants target 3D stacking to break memory wall and power bottlenecks
    At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
    Wednesday 2 September 2026
    World's first legged robot standard sets global benchmark for humanoids, robot dogs
    China-led experts have released what CCTV described as the world's first international standard for legged robots, creating a common framework for evaluating humanoid robots,...
    Wednesday 2 September 2026
    Indium CEO: packaging, cooling and power are next AI bottlenecks
    As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
    Wednesday 2 September 2026
    MediaTek pushes advanced packaging and supply chain to keep pace with AI
    Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...
    Wednesday 2 September 2026
    Apple's M6 and M5 Ultra break rule tying process to chip strength
    Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
    Tuesday 1 September 2026
    SK Hynix touts up to 5.15x inference gains with custom HBM

    SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

    Tuesday 1 September 2026
    Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain
    Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...
    Tuesday 1 September 2026
    ASML says High NA EUV has reached its first high-volume logic product
    ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...
    Tuesday 1 September 2026
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

    As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

    Tuesday 1 September 2026
    Samsung weighs HBM4 bonuses as memory, foundry teams align
    Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
    Tuesday 1 September 2026
    OpenAI compresses Jalapeno design to 9 months
    OpenAI unveiled performance results for its in-house AI chip Jalapeno at Hot Chips 2026 ahead of Nvidia's latest earnings report, underscoring not whether it can beat GB200 or GB300,...
    Tuesday 1 September 2026
    SK Hynix explores Intel as second source for HBM base dies
    SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...
    Monday 31 August 2026
    Cook made sustainability an Apple feature; the ledger he leaves John Ternus is mixed
    Tim Cook's most durable non-financial decision was to treat environmental and social performance as product attributes rather than corporate disclosure. It worked well enough that...
    Friday 28 August 2026
    Apple's M6 marks a transitional step before wider 2nm adoption
    Apple on August 25 unveiled the M6 and M5 Ultra chips without holding a launch event, with the M6 becoming the company's first processor built on TSMC's 2nm process and debuting in...
    1/65 pages
    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
    reportAIglasses