The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained...
As demand for AI servers, high performance computing (HPC), and data center infrastructure accelerates, the semiconductor and power electronics test equipment market...
Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026...
Samsung Electronics is reportedly on track to complete development of 10-nanometer-class seventh-generation DRAM, also known as 1d DRAM,...
China's humanoid robot industry is entering a larger real-world test of AI, mobility and performance, with 2,056 robots set to compete...
Data analytics firm Dun & Bradstreet released its "Taiwan Enterprise AI Momentum Index" for the third quarter of 2026, revealing...
Chinese AI chipmaker Biren expects first-half 2026 revenue to reach CNY1.15-1.3 billion (US$171-193 million), up about 1,852% to 2,107%...
Horizon Robotics is preparing its next-generation Journey 7 (J7) automotive AI chip family for mass production in 2027, aiming to extend...
On February 20, 2026, Canadian AI chip startup Taalas unveiled its HC1 inference chip. Taalas said the chip ran the Llama 3.1 8B model...
Humanoid robots are moving from demonstrations toward mass production, changing the priorities of chip design. Instead of simply chasing...
China is accelerating construction of its national computing network, and a growing share of new capacity is likely to use supernodes...
