中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Commentary: EU tariff barrier may weaken as Japanese automakers lean on China EV tech
    8h 14min ago
    Hanmi Semiconductor expands Taiwan and US push for potential Terafab supply chain role
    8h 14min ago
    CXMT said to poach more than 200 South Korean engineers
    8h 14min ago
    Memory price surge hit low-end phones, putting Chinese brands under pressure
    8h 14min ago
    TSMC’s Wei says it will not raise prices aggressively as AI bottlenecks spread
    8h 14min ago
    China EV startups return to losses in 1Q26 amid price war and R&D pressure
    8h 14min ago
    NEWS TAGGED PERFORMANCE
    Thursday 4 June 2026
    Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
    Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
    Thursday 4 June 2026
    xMEMS tackles data center heat with chip-level cooling tech
    Surging demand for artificial intelligence computing has accelerated the buildout of data centers, pushing system cooling closer to its limits. As power consumption rises, heat-related...
    Thursday 4 June 2026
    Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
    Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal...
    Wednesday 3 June 2026
    Notebook shipment update, April 2026

    Introduction

    Tuesday 2 June 2026
    Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
    Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
    Tuesday 2 June 2026
    Analysis: With Xuanji A3, BYD bets on integration over specifications
    At a recent product launch, BYD Chairman and President Wang Chuanfu unveiled the company's first in-house autonomous driving system-on-chip, the Xuanji A3, marking a significant milestone...
    Tuesday 2 June 2026
    JMicron pioneers cutting-edge solutions for optimal storage performance

    JMicron Technology Corp., a global leader in high-speed Bridge IC solutions, today announced it will unveil its flagship innovations at COMPUTEX 2026. Building on years...

    Tuesday 2 June 2026
    COMUPTEX 2026: SSSTC Showcases Immersion-Cooling SSDs for AI Data Centers

    Solid State Storage Technology Corporation (SSSTC), a subsidiary of Kioxia Corporation and a leading global SSD provider, is showcasing its enterprise SSDs...

    Tuesday 2 June 2026
    Fibocom Showcases at COMPUTEX 2026: Accelerating 'Connectivity + AI' in High-Value Scenarios

    At COMPUTEX 2026, Fibocom outlined its perspective on the deployment path of edge AI: as AI moves from the cloud to end devices, the key to large-scale adoption lies...

    Tuesday 2 June 2026
    Huawei's Tau Law faces its hardest test: chip yield, not theory
    Huawei has introduced Tau Law, a semiconductor design framework built around LogicFolding, as a potential route for China to improve chip performance under US technology restrictions...
    Monday 1 June 2026
    Microsoft previews Surface Laptop Ultra and AI-focused Windows platform ahead of Build
    Microsoft used Nvidia GTC to preview Surface Laptop Ultra and its broader Windows platform strategy ahead of Build, highlighting a shift toward on-device AI agents and developer workloads...
    Friday 29 May 2026
    Quanta projects strong 2026 AI demand as it expands server and wearable production
    Quanta said demand for artificial intelligence (AI) infrastructure would be very strong in 2026 as the company pushed deeper into servers and wearable devices, and that it was expanding...
    Friday 29 May 2026
    Samsung begins shipment of HBM4E samples as AI memory competition intensifies
    Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI...
    Thursday 28 May 2026
    FuriosaAI and Broadcom partner on AI inference platform for agentic computing era
    South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as...
    Thursday 28 May 2026
    Lenovo bets on on-device AI to lift business PC upgrades
    Lenovo is betting that rising cloud AI costs and privacy risks will drive enterprises toward on-device AI, reshaping corporate PC buying and upkeep globally. The vendor's 2026 AI agent...
    1/64 pages
    Apacer
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook