CONNECT WITH US
NEWS TAGGED PERFORMANCE
Tuesday 8 September 2026
Samsung speeds silicon photonics test plan with TSMC-vetted probe vendors
Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according...
Tuesday 8 September 2026
Kinko revenue climbs monthly, August sales jump 107%
Kinko announced its consolidated revenue for August 2026 on September 8, reaching NT$557 million, up 6.2% from NT$524 million in July and surging 106.8% from NT$269 million(US$17.58...
Tuesday 8 September 2026
Huawei holds the price line for new Kirin-powered Mate XT 2
Huawei held a product launch event on the afternoon of September 7, putting the tri-fold Mate XT 2 flagship smartphone and its Kirin 9050 Pro chipset in the spotlight while also rolling...
Tuesday 8 September 2026
Huawei Kirin 9050 Pro puts LogicFolding to the test with 55% density gain, 66% lower NPU power
Huawei's Kirin 9050 Pro is the first commercial test of its Tau Scaling Law, with the company claiming a 55% increase in transistor density at the same process node while cutting NPU,...
Tuesday 8 September 2026
Shining a Light on the Precision Behind AI and Data Infrastructure

Discussion around advances in AI will often focus on model performance, chip launches, and compute scale. In practice, however, progress increasingly depends on something...

Monday 7 September 2026
Smartphone lens shipments lift Genius Electronic Optical revenue 12% in August
Optical lens maker Genius Electronic Optical (GSEO) reported consolidated revenue of NT$2.72 billion (≈ US$86 million) for August 2026, up 12.26% from NT$2.42 billion in July...
Monday 7 September 2026
Huawei Kirin 9050 Pro revives flagship chip launches with reported LogicFolding architecture in Mate XT 2
Huawei has unveiled the Kirin 9050 Pro in its new Mate XT 2 tri-fold smartphone, marking the commercial debut of the LogicFolding architecture behind its Tau Scaling Law and Huawei's...
Monday 7 September 2026
Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
Monday 7 September 2026
AI is driving force behind 'Moore's Law on steroids,' says Merck's Benjamin Hein
AI is driving a new wave of technological demand and changing how the semiconductor industry innovates, according to Benjamin Hein, member of the executive board and CEO of the Electronics...
Friday 4 September 2026
Ennostar accelerates AI optical communications with micro LED
Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai,...
Thursday 3 September 2026
Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips
For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...
Thursday 3 September 2026
China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
Thursday 3 September 2026
TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling
As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
Wednesday 2 September 2026
Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...