News tagged performance at DIGITIMES

NEWS TAGGED PERFORMANCE

Wednesday 2 September 2026

MediaTek pushes advanced packaging and supply chain to keep pace with AI

Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...

Wednesday 2 September 2026

Apple's M6 and M5 Ultra break rule tying process to chip strength

Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...

Tuesday 1 September 2026

SK Hynix touts up to 5.15x inference gains with custom HBM

SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

Tuesday 1 September 2026

Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain

Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...

Tuesday 1 September 2026

ASML says High NA EUV has reached its first high-volume logic product

ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...

Tuesday 1 September 2026

Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

Tuesday 1 September 2026

Samsung weighs HBM4 bonuses as memory, foundry teams align

Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...

Tuesday 1 September 2026

OpenAI compresses Jalapeno design to 9 months

OpenAI unveiled performance results for its in-house AI chip Jalapeno at Hot Chips 2026 ahead of Nvidia's latest earnings report, underscoring not whether it can beat GB200 or GB300,...

Tuesday 1 September 2026

SK Hynix explores Intel as second source for HBM base dies

SK Hynix is reportedly considering adding Intel Foundry as a second manufacturing source for high-bandwidth memory (HBM) base dies, a move that could reduce its reliance on TSMC as...

Monday 31 August 2026

Cook made sustainability an Apple feature; the ledger he leaves John Ternus is mixed

Tim Cook's most durable non-financial decision was to treat environmental and social performance as product attributes rather than corporate disclosure. It worked well enough that...

Friday 28 August 2026

Apple's M6 marks a transitional step before wider 2nm adoption

Apple on August 25 unveiled the M6 and M5 Ultra chips without holding a launch event, with the M6 becoming the company's first processor built on TSMC's 2nm process and debuting in...

Friday 28 August 2026

Insight: China's next AI frontier is silicon, not smarter models

For the past two years, China's AI companies have competed on a single axis: whose model performs best. That contest is starting to give way to a harder one — whether those models...

Thursday 27 August 2026

Driving measurable sustainability: CIDB Malaysia's blueprint for carbon accountability

At Sustainability Environment Asia Conference 2026, Suhaimi Mansor, deputy chief executive of the Construction Industry Development Board (CIDB) Malaysia, delivered a clear mandate...

Thursday 27 August 2026

TI's multiaxial sensor exposes the next EV inverter race: precision catches up with power density

As EV traction inverters increasingly migrate toward 800V architectures, demand for further technological upgrades designed to improve current-sensing performance has pushed the automotive...

Thursday 27 August 2026

SK Hynix questions PIM as thermal, packaging limits constrain HBM

South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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