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    Foxconn, Mitsubishi Electric form alliance in automotive equipment business
    5min ago
    IBM and Siemens collaborate to advance nanostack chip architecture
    17min ago
    NEWS TAGGED PERFORMANCE
    Monday 19 October 2026
    Micron develops robot memory as Samsung, SK Hynix target physical AI
    Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating...
    Monday 19 October 2026
    EU eyes AI defense as it tests China's open-weight models
    The European Union is strengthening its response to cybersecurity risks posed by artificial intelligence, planning to use automated measures to accelerate incident response while testing...
    Monday 19 October 2026
    MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026

    MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech, offering process chemicals,...

    Saturday 17 October 2026
    CATL targets 70GWh in sodium-ion ESS orders with European push
    Chinese battery giant CATL is deploying sodium-ion technology to expand into Europe's energy storage system (ESS) market. The company recently signed a strategic agreement with German...
    Friday 16 October 2026
    Analysis: TSMC-GF deal moves mature nodes into AI packaging: What it means for China
    As global wafer capacity expands rapidly, TSMC and GlobalFoundries (GF) are highlighting a fast-growing market for mature processes serving advanced applications. In particular, demand...
    Friday 16 October 2026
    Tong Yang sees stronger 4Q26 margins, but shipping, costs remain risks
    Tong Yang Industry expects capacity utilization to reach 90%–95% in the fourth quarter of 2026, as North American aftermarket orders recover and support margins during the seasonal...
    Friday 16 October 2026
    Nvidia unveils PTFE switch board at OCP, names Taiwan partners
    Nvidia showcased the latest developments in its MGX server platform ecosystem at the OCP Global Summit 2026, unveiling for the first time a switch board sample using polytetrafluoroethylene...
    Friday 16 October 2026
    China's YMTC targets 9,600 MT/s with 4F² DRAM design
    China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
    Thursday 15 October 2026
    SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips
    SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
    Thursday 15 October 2026
    Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?
    On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding...
    Thursday 15 October 2026
    Onsemi and Sungrow deepen battery storage tie-up as demand rises for grid power
    Onsemi has said its latest EliteSiC hybrid power module is now being used in Sungrow's PowerTitan 3.0 energy storage platform, a move aimed at improving efficiency, power density,...
    Thursday 15 October 2026
    AI chip complexity is widening opportunities for semiconductor equipment makers
    AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...
    Thursday 15 October 2026
    AI server tracker: Rail-kit growth turns uneven as cooling suppliers sustain expansion
    Taiwan's rail-kit and thermal suppliers posted broad year-over-year revenue growth in September 2026, but sequential performance revealed uneven shipment schedules. All eight tracked...
    Thursday 15 October 2026
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI

    The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...

    Wednesday 14 October 2026
    Cerebras CEO reveals the capacity shortfall behind OpenAI's turn to Nvidia GPUs
    Cerebras Systems' shortage of data centre capacity was a key reason OpenAI turned to Nvidia GPUs to expand services for its next-generation models, co-founder and CEO Andrew Feldman...
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    Oct 19, 08:00
    MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026
    Monday 19 October 2026
    GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking
    Monday 19 October 2026
    Breaking free from keyword constraints: How GeoGraph elevates job matching
    Thursday 15 October 2026
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI