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    Commentary: Taiwan's tech giants stuck between Beijing and Taipei's defense push
    1h 4min ago
    Could Nvidia reshuffling of Asia’s AI map weaken Taiwan supply chain's dominance?
    1h 4min ago
    Panel supply chain earnings calls spotlight transformation and new businesses
    1h 4min ago
    LG's 600kW CDU wins Nvidia validation and North American CSP project
    1h 4min ago
    BOE shifting away from low-price competition
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    Samsung and SK Hynix seek workarounds as semiconductor equipment lead times double
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    NEWS TAGGED PERFORMANCE
    Monday 27 July 2026
    Samsung to use 2nm process for HBM5 base die as heat challenge grows

    Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process,...

    Monday 27 July 2026
    Pegatron unveils AMD EPYC server platform for AI and HPC
    Pegatron unveiled a new server platform powered by AMD's sixth-generation EPYC processors at AMD Advancing AI 2026, targeting enterprise AI, agentic AI, high-performance computing...
    Monday 27 July 2026
    Rebellions readies Rebel100 shipments as AI inference demand grows
    South Korean AI chip designer Rebellions plans to begin shipping its next-generation Rebel100 accelerator in the second half of 2026, betting that wider use of AI agents and commercial...
    Monday 27 July 2026
    Nokia says AI spending is driving optical networking demand
    AI data center spending is pushing high-speed networking higher on enterprise procurement lists, and Nokia said its optical and IP networks have become major growth engines. The company...
    Saturday 25 July 2026
    Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
    Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
    Saturday 25 July 2026
    Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
    Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
    Friday 24 July 2026
    AMD launches ROCm.ai to accelerate agentic AI development, reporting up to 3.3x inference gains
    Alongside its expanding AI hardware portfolio, AMD is stepping up efforts to strengthen its AI software ecosystem in a bid to challenge NVIDIA's CUDA dominance. At its Advancing AI...
    Friday 24 July 2026
    AMD redraws server chip strategy as AI workloads evolve
    AMD has launched its sixth-generation EPYC Venice server processor as the foundation of its next-generation AI data center platform, while CEO Lisa Su said the company is reshaping...
    Friday 24 July 2026
    AMD unveils Helios rack-scale AI platform to target hyperscale buildouts
    AMD has formally introduced Helios, a next-generation rack-scale AI infrastructure platform designed for the fast-growing market of global AI factories and hyperscale data centers...
    Friday 24 July 2026
    AMD splits next-generation data center GPUs for specialized AI demand
    AMD unveiled its Instinct MI400 series at its Advancing AI 2026 conference, broadening its push into data center chips with products aimed at different users. For global readers, the...
    Friday 24 July 2026
    Amkor, Nvidia widen AI packaging partnership as US capacity expands
    Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms...
    Friday 24 July 2026
    Kimi K3 under fire, part 3: China's AI industry questions success story
    Chinese officials have embraced Kimi K3 as evidence of indigenous innovation and a maturing open-model ecosystem. Some Chinese developers and technology commentators are far less c...
    Friday 24 July 2026
    Realme exits China smartphone market, Oppo hands domestic focus to OnePlus

    Realme has stopped producing smartphones for China and will launch no new models there, ending its domestic expansion as parent company...

    Thursday 23 July 2026
    Intel 18A adopts High-NA EUV in dual-certification push
    Intel Foundry has moved high numerical aperture (High-NA) EUV lithography into production on its Intel 18A process, with ASML confirming in a recent press release that Intel is using...
    Thursday 23 July 2026
    Samsung unveils new foldables and smartwatches to sharpen health and sports focus
    Samsung Electronics on July 22 introduced new Galaxy Z foldable phones and two smartwatches aimed at distinct users, underscoring how global demand is pushing wearables toward clearer...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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