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Friday 5 June 2026
HBM is too expensive, DRAM can't scale — Kioxia tells Computex SSDs are the answer for agentic AI
Koichi Fukuda, technology executive for applied SSD technology at Kioxia, used a Computex 2026 forum session on June 4 to argue that as enterprise AI shifts toward agentic systems,...
Friday 5 June 2026
Marvell says SerDes and packaging are key hurdles in switch chip development
Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...
Friday 5 June 2026
Qualcomm says Wi-Fi 8 prioritizes reliability over speed
Qualcomm recently outlined its vision for Wi-Fi 8, saying the next-generation standard is designed to improve overall reliability, lower latency, and expand coverage. The company said...
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
Thursday 4 June 2026
xMEMS tackles data center heat with chip-level cooling tech
Surging demand for artificial intelligence computing has accelerated the buildout of data centers, pushing system cooling closer to its limits. As power consumption rises, heat-related...
Thursday 4 June 2026
Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal...
Wednesday 3 June 2026
Notebook shipment update, April 2026

Introduction

Tuesday 2 June 2026
Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
Tuesday 2 June 2026
Analysis: With Xuanji A3, BYD bets on integration over specifications
At a recent product launch, BYD Chairman and President Wang Chuanfu unveiled the company's first in-house autonomous driving system-on-chip, the Xuanji A3, marking a significant milestone...
Tuesday 2 June 2026
JMicron pioneers cutting-edge solutions for optimal storage performance

JMicron Technology Corp., a global leader in high-speed Bridge IC solutions, today announced it will unveil its flagship innovations at COMPUTEX 2026. Building on years...

Tuesday 2 June 2026
COMUPTEX 2026: SSSTC Showcases Immersion-Cooling SSDs for AI Data Centers

Solid State Storage Technology Corporation (SSSTC), a subsidiary of Kioxia Corporation and a leading global SSD provider, is showcasing its enterprise SSDs...

Tuesday 2 June 2026
Fibocom Showcases at COMPUTEX 2026: Accelerating 'Connectivity + AI' in High-Value Scenarios

At COMPUTEX 2026, Fibocom outlined its perspective on the deployment path of edge AI: as AI moves from the cloud to end devices, the key to large-scale adoption lies...

Tuesday 2 June 2026
Huawei's Tau Law faces its hardest test: chip yield, not theory
Huawei has introduced Tau Law, a semiconductor design framework built around LogicFolding, as a potential route for China to improve chip performance under US technology restrictions...
Monday 1 June 2026
Microsoft previews Surface Laptop Ultra and AI-focused Windows platform ahead of Build
Microsoft used Nvidia GTC to preview Surface Laptop Ultra and its broader Windows platform strategy ahead of Build, highlighting a shift toward on-device AI agents and developer workloads...