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Friday 26 December 2025
Huawei details Ascend AI chip roadmap built around in-house HBM, massive clusters
Huawei is clarifying how it intends to compete in global AI computing despite being cut off from leading-edge foundries and US-origin GPUs. Instead of chasing rivals on single-chip...
Friday 26 December 2025
Samsung, SK Hynix reportedly accelerate HBM4 production to early 2026
Samsung Electronics and SK Hynix are pushing forward their production schedules for sixth-generation high-bandwidth memory to February 2026. Industry sources and South Korean media...
Friday 26 December 2025
SK Hynix targets February HBM4 ramp-up with TSMC, ships final samples to Nvidia
SK Hynix is scheduled to deliver final samples of its next-generation high-bandwidth memory to Nvidia in early January 2025. This comes as the South Korean chipmaker nears a February...
Wednesday 24 December 2025
Microsoft CEO reportedly expresses dissatisfaction with Copilot's AI integration with Gmail and Outlook
Microsoft CEO Satya Nadella has openly criticized the integration performance of the company's AI assistant, Copilot, especially its connection with email platforms such as Gmail...
Wednesday 24 December 2025
Taiwan cable maker rides US$3.7 billion grid overhaul wave with orders booked through 2028
Taiwanese cable giant Ta Tun Electric Wire and Cable (TEWC) held a pre-listing performance briefing on December 23, 2025, revealing that revenue for the first 11 months of 2025 reached...
Wednesday 24 December 2025
2D materials: from memory entry to logic's future
Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable...
Wednesday 24 December 2025
AI chips run too hot: Engineers race to reinvent cooling
The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end...
Tuesday 23 December 2025
Windows handheld gaming device specs and shipments

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Tuesday 23 December 2025
Moore Threads takes on CUDA with MUSA as China's GPU race shifts to developer ecosystems
Competition in the GPU industry ultimately comes down to developer ecosystems. Against that backdrop, Moore Threads' inaugural MUSA Developer Conference (MDC 2025) on December 20-21...
Tuesday 23 December 2025
Taiwan's motherboard makers balance AI gains with inflation, PC market headwinds in 2025
Taiwan's leading motherboard manufacturers—AsusTek, GIGABYTE, Micro-Star International (MSI), and ASRock—have navigated a turbulent global economic environment in 2025...
Monday 22 December 2025
Samsung taps former AMD exec to reboot Exynos from Austin
Samsung has recruited semiconductor veteran John Rayfield, formerly a vice president at AMD, to bolster its Exynos GPU and system IP roadmap, signaling a renewed effort to regain...
Monday 22 December 2025
Amtran's pivot from TVs to high-value products delivers revenue and profit gains
Taiwan's Amtran Technology is reshaping its growth trajectory, pivoting from scale-driven contract manufacturing to a profit-focused strategy built around high-value products—a...
Saturday 20 December 2025
Samsung reveals sub-10nm DRAM breakthrough targeting 0a, 0b nodes
Samsung Electronics has unveiled a key technology pathway for sub-10nm DRAM, offering a rare public look at how the company plans to push memory scaling beyond current 10nm-class...
Friday 19 December 2025
US scrutinizes Nvidia H200 chip exports to China as risks mount
The Trump administration has launched an interagency review to determine whether to authorize the first exports of Nvidia's H200 artificial intelligence chips to China, Reuters...
Friday 19 December 2025
Samsung to supply SOCAMM2 LPDDR modules to Nvidia
Samsung Electronics has moved ahead in the race to supply next-generation AI server memory, providing Nvidia with samples of its SOCAMM2 LPDDR-based modules. The development signals...