News tagged performance at DIGITIMES

NEWS TAGGED PERFORMANCE

Thursday 3 September 2026

Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips

For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...

Thursday 3 September 2026

China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration

Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...

Thursday 3 September 2026

TRUMPF targets advanced packaging as AI chip makers chase higher density and better cooling

As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...

Wednesday 2 September 2026

Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth

Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...

Wednesday 2 September 2026

DRAM giants target 3D stacking to break memory wall and power bottlenecks

At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...

Wednesday 2 September 2026

World's first legged robot standard sets global benchmark for humanoids, robot dogs

China-led experts have released what CCTV described as the world's first international standard for legged robots, creating a common framework for evaluating humanoid robots,...

Wednesday 2 September 2026

Indium CEO: packaging, cooling and power are next AI bottlenecks

As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...

Wednesday 2 September 2026

MediaTek pushes advanced packaging and supply chain to keep pace with AI

Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...

Wednesday 2 September 2026

Apple's M6 and M5 Ultra break rule tying process to chip strength

Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...

Tuesday 1 September 2026

SK Hynix touts up to 5.15x inference gains with custom HBM

SK Hynix is pushing computation deeper into high-bandwidth memory (HBM), saying a custom HBM architecture that places compute functions...

Tuesday 1 September 2026

Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain

Samsung Electronics is targeting mass production of its LPDDR5X processing-in-memory (PIM) solution in late 2026 or early 2027, moving the technology closer to commercialization as...

Tuesday 1 September 2026

ASML says High NA EUV has reached its first high-volume logic product

ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...

Tuesday 1 September 2026

Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law. Technologies such as...

Tuesday 1 September 2026

Samsung weighs HBM4 bonuses as memory, foundry teams align

Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...

Tuesday 1 September 2026

OpenAI compresses Jalapeno design to 9 months

OpenAI unveiled performance results for its in-house AI chip Jalapeno at Hot Chips 2026 ahead of Nvidia's latest earnings report, underscoring not whether it can beat GB200 or GB300,...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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