As infrastructure upgrades, rail decarbonization, and the reshaping of critical materials supply chains accelerate, the steel industry...

ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor...

Apple's decision to extend its wireless transmission and RF chip supply agreement with Broadcom through 2031 signals that its shift...

MiTAC is set to enter a new phase of growth in the second half of 2026 as new production facilities begin mass production, providing a meaningful...

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...