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Thursday 30 July 2026
GlobalFoundries lands US$300M CHIPS backing for AI silicon photonics

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Thursday 30 July 2026
India launches homegrown silicon photonics tools to widen access for researchers and industry

India has launched two indigenously developed silicon photonics solutions to strengthen local chip design and testing capabilities...

Wednesday 29 July 2026
Corning bets on SiPh and CPO to drive AI data center growth

Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond...

Saturday 25 July 2026
Taiwan's chip partnerships widen beyond fabs to AI, photonics and quantum
Taiwan's semiconductor industry is expanding overseas while deepening cooperation with the US, Europe, and Asia across advanced packaging, AI infrastructure, research, talent, cybersecurity,...
Thursday 23 July 2026
WAIC 2026: Lightelligence maps AI's optical future with CPO, NPO, photonic computing

Lightelligence is positioning optical interconnects, optical switching, and optical computing as the next foundation of AI infrastructure,...

Thursday 23 July 2026
IQE lifts 2026 outlook as AI data centers accelerate indium phosphide demand

IQE has raised its 2026 revenue outlook as demand for artificial intelligence (AI) infrastructure and data centers continues to strengthen,...

Tuesday 21 July 2026
Zeiss accelerates push into AI chip advanced packaging, CPO

Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...

Monday 20 July 2026
Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

Thursday 16 July 2026
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...
Wednesday 15 July 2026
Tower Semiconductor bets on Japan to ride the AI data center shift from copper to light
Tower Semiconductor is placing a roughly US$3 billion wager that the artificial-intelligence buildout will force data centers to move data with light rather than electricity, anchoring...
Tuesday 14 July 2026
UMC pushes into silicon photonics in Singapore to ride AI's connectivity crunch
United Microelectronics Corp (UMC) is moving into silicon photonics, positioning itself to address one of the defining bottlenecks in artificial-intelligence data centers: the speed...
Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Sunday 12 July 2026
SmartSens targets 2027 commercialization of Micro LED optical interconnects for AI infrastructure
The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the...
Wednesday 8 July 2026
Msscorps posts record 2Q revenue on AI and chip testing demand

Msscorps reported record consolidated revenue in June, and for the first half of 2026, as demand from AI and semiconductor customers...

Sunday 5 July 2026
Advantest and OpenLight join forces on silicon photonics test platform for mass production
Advantest said it has partnered with OpenLight to develop a scalable silicon photonics (SiPh) test solution for mass production environments. The announcement comes as artificial intelligence...