IC packager Advanced Semiconductor Engineering (ASE) has announced plans to acquire up to 107 million shares of Power ASE Technology, a joint venture with memory chipmaker Powerchip...

Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...

Advanced Semiconductor Engineering (ASE) expects June revenues to increase sequentially, according to the company. The chip packaging and testing house also expressed optimism that...

IC packaging and testing house Advanced Engineering Semiconductor (ASE) has announced that its board of directors has approved a NT$450 million (US$13.7 million) loan to DRAM maker...

Memory IC packaging and testing houses ChipMOS Technologies, Formosa Advanced Technologies Company (FATC), Power ASE Technology and United Test and Assembly Center (UTAC) are said...

Taiwan-based memory IC packaging and testing companies are likely to benefit from the Micron-Qimonda deal, according...

Despite a listless memory industry status in 2008, Power ASE Technology managed to maintain its gross margin above 40% in the first half of 2008 thanks to aggressive expansion of...