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    Apple sets September 9 event for foldable iPhone and iPhone 18 Pro debut
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    AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
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    Google, MediaTek embrace advanced packaging diversification
    8min ago
    SK Hynix questions PIM as heat and packaging emerge as HBM limits
    Aug 26, 19:17
    Doosan develops 13µm ultra-thin CCL for memory chip substrates
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    2027 tri-fold phones enter a new phase as materials and durability become key battlegrounds
    Aug 26, 19:16
    NEWS TAGGED PROCESSOR
    Wednesday 3 September 2025
    Semicon India 2025: First homegrown chip, sights set on IP leadership
    At Semicon India 2025, the country's flagship semiconductor showcase, Prime Minister Narendra Modi urged global and domestic stakeholders to view India not just as a manufacturing...
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    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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