Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...

A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...

The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...

TSMC filed the most invention patent applications in Taiwan in the third quarter of 2023, with 443 cases, topping the domestic list for the same period for eight consecutive years,...

Japan-based Resonac, formerly Showa Denko, kicked off volume production of its new-generation 6-inch SiC epi-wafers on March 1, aiming to serve the needs of EVs and other high-end...