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Thursday 28 May 2026
Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link

Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering...

Wednesday 27 May 2026
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
Tuesday 26 May 2026
Huawei Tau Law series 1: How China's chip industry is pivoting beyond Moore's Law
When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious...
Tuesday 26 May 2026
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
Monday 25 May 2026
Huawei reveals post-Moore semiconductor roadmap targeting 1.4nm-equivalent chip performance
As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect,...
Monday 25 May 2026
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
Friday 22 May 2026
Intel's foundry reset: 14A, 10A and tougher engineering rules
Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on...
Thursday 21 May 2026
Nvidia prices rivals out of AI factory race with Blackwell, Vera CPU, and Rubin
Nvidia used its first quarter of fiscal year 2027 earnings call on May 20, 2026 to lay out a three-tier silicon cadence that should make any rival roadmap look thin: a Blackwell ramp...
Wednesday 20 May 2026
Tech Forum 2026: AI server racks push liquid cooling into mainstream
META Green Cooling Technology (MGC) president Clyde Chu said Nvidia's chip roadmap shows that cooling requirements are doubling in less than a year, with the NVL72 rack based on the...
Friday 8 May 2026
Samsung reportedly testing 1.4nm Exynos 2800 with 96MB cache

Samsung is reportedly testing a next-generation Exynos processor that could push the company's chip ambitions beyond smartphones, with...

Tuesday 5 May 2026
Intel PC chip roadmap takes shape as Razor Lake, Titan Lake stay on track
Intel is gaining momentum in both chip design and foundry operations. Its PC platform roadmap for the next two years is coming into sharper focus as process technology and yield improve,...
Thursday 30 April 2026
Intel kills three projects in two months as Kechichian launches multi-year reset
Intel's reorganization under Kevork Kechichian, backed by CEO Lip‑Bu Tan, aims to reposition amid Nvidia's AI dominance and Arm's rise, signaling a shift to CPU-centric orchestration...
Wednesday 29 April 2026
Samsung doubles down on 2nm as TSMC pushes toward 1nm
Samsung Electronics and TSMC have taken increasingly different approaches to advanced semiconductor manufacturing as the industry moves beyond the 3nm generation. Although being the...
Tuesday 21 April 2026
Qualcomm Chief reportedly seeks memory and manufacturing deals in South Korea

Qualcomm Chief Executive Cristiano Amon is expected to meet senior executives from Samsung Electronics and SK Hynix during a recent visit...

Friday 17 April 2026
Spanish startup Openchip targets 2028 launch on agentic AI wave
Openchip's growth and product roadmap could reshape AI computing supply chains and deployment costs globally, offering lower-power alternatives and CPU-independent modules that could...