News tagged roadmap at DIGITIMES

NEWS TAGGED ROADMAP

Monday 1 September 2025

China's ICT push: embedding AI across smartphones, PCs, and wearables by 2026

The US has tightened controls on China's semiconductor and artificial intelligence (AI) sectors under the banner of national security...

Friday 15 August 2025

Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp

TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...

Tuesday 12 August 2025

China eyes 2027 BCI breakthrough as it races to build its own chips

China's brain-computer interface (BCI) sector is accelerating, driven by strong state policy support and private-sector advances. The Ministry of Industry and Information Technology...

Thursday 31 July 2025

Samsung outlines mobile growth and AI strategy amid tariff concerns, highlights 2nm Exynos roadmap

During its second quarter 2025 earnings call, Samsung Electronics addressed the outlook for its Mobile Experience (MX) division and unveiled strategic plans focused on AI innovation...

Wednesday 30 July 2025

Lisuan, Intellifusion unveil SMIC-based GPUs and NPUs to anchor China's AI stack

At the 2025 World Artificial Intelligence Conference (WAIC), Chinese AI chipmakers announced major advances in high-end chip design, manufacturing, and deployment. Lisuan Tech introduced...

Friday 25 July 2025

Rebellions partners with CoAsia SEMI to deliver AI chiplets to data centers worldwide

South Korean AI semiconductor startup Rebellions has inked a strategic partnership with system-on-chip (SoC) design house CoAsia SEMI...

Wednesday 23 July 2025

Big moon plans, few rocket orders: South Korea's aerospace ambition faces reality check

South Korea has laid out an ambitious vision to become a major player in the new space economy, with a long-term goal of landing on the Moon using domestically developed rockets and...

Tuesday 22 July 2025

Tenstorrent pushes RISC-V into AI's fast lane with open chiplet strategy

The rise of AI and high-performance computing (HPC) is accelerating the adoption of RISC-V, the open-source instruction set architecture that is reshaping the global semiconductor...

Friday 11 July 2025

Samsung recalibrates chip strategy as 2nm becomes the new battleground

Samsung Electronics is entering a period of introspection and recalibration in its semiconductor foundry business, shifting focus from speed-driven innovation to consolidating its...

Wednesday 9 July 2025

Hanmi's HBM4 tools go live, but is 2029 too late for hybrid bonding?

Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...

Thursday 3 July 2025

Apple AI falls from grace: Claude in, engineers out, strategy in flux

Apple is reportedly reevaluating its artificial intelligence (AI) roadmap, exploring the integration of external large language models (LLMs) from OpenAI and Anthropic to power future...

Wednesday 2 July 2025

Samsung lags a year behind TSMC in 1.4nm race, shifts focus to 2nm reset

Samsung Electronics has delayed mass production of its 1.4nm process node to 2029, two years later than its original timeline and trailing TSMC's 2028 target. The shift reflects a...

Wednesday 2 July 2025

Neuralink implants BCI in 7 patients, unveils roadmap for whole brain interface by 2028

Neuralink, the neurotechnology company co-founded by Elon Musk, announced during its summer showcase that seven patients have now received its brain-computer interface (BCI) implant...

Friday 27 June 2025

Samsung slows the node race: yield over speed at 2nm, 4nm

Samsung Foundry is reportedly adjusting its roadmap by postponing development of its 1.4nm (SF1.4) node and reallocating resources to improve yield and service quality across its...

Thursday 26 June 2025

TSMC, ASE close ranks on PLP, 310x310mm emerges as the format to watch

Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP), an emerging advanced packaging format poised to succeed...

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Aug 5, 11:49

Cultivating OCP, embracing open source

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