TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
China's brain-computer interface (BCI) sector is accelerating, driven by strong state policy support and private-sector advances. The Ministry of Industry and Information Technology...
During its second quarter 2025 earnings call, Samsung Electronics addressed the outlook for its Mobile Experience (MX) division and unveiled strategic plans focused on AI innovation...
At the 2025 World Artificial Intelligence Conference (WAIC), Chinese AI chipmakers announced major advances in high-end chip design, manufacturing, and deployment. Lisuan Tech introduced...
South Korea has laid out an ambitious vision to become a major player in the new space economy, with a long-term goal of landing on the Moon using domestically developed rockets and...
The rise of AI and high-performance computing (HPC) is accelerating the adoption of RISC-V, the open-source instruction set architecture that is reshaping the global semiconductor...
Samsung Electronics is entering a period of introspection and recalibration in its semiconductor foundry business, shifting focus from speed-driven innovation to consolidating its...
Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
Apple is reportedly reevaluating its artificial intelligence (AI) roadmap, exploring the integration of external large language models (LLMs) from OpenAI and Anthropic to power future...
Samsung Electronics has delayed mass production of its 1.4nm process node to 2029, two years later than its original timeline and trailing TSMC's 2028 target. The shift reflects a...
Neuralink, the neurotechnology company co-founded by Elon Musk, announced during its summer showcase that seven patients have now received its brain-computer interface (BCI) implant...
Samsung Foundry is reportedly adjusting its roadmap by postponing development of its 1.4nm (SF1.4) node and reallocating resources to improve yield and service quality across its...
Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP), an emerging advanced packaging format poised to succeed...
Tesla's global sales have sharply declined, with the US and European markets experiencing the steepest drops. Sources cite multiple contributing factors, including public tensions...
