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Friday 12 September 2025

SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar

At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...

Friday 12 September 2025

SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans

Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...

Friday 12 September 2025

Intel to continue semiconductor glass substrate commercialization despite market rumors

Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...

Wednesday 10 September 2025

SEMICON Taiwan 2025: Zeiss hits milestone of 10 High NA optic systems shipped as TSMC probes future of Hyper NA EUV

At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...

Friday 5 September 2025

Made in China: 5nm GPU clears tape-out, 6nm now sampling

On September 3, 2025, Anhui Anfu Battery Technology announced its portfolio company Xiangdi Xian Computing Technology (XDXCT) had completed tape-out validation of its next-generation...

Monday 1 September 2025

China's ICT push: embedding AI across smartphones, PCs, and wearables by 2026

The US has tightened controls on China's semiconductor and artificial intelligence (AI) sectors under the banner of national security...

Friday 15 August 2025

Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp

TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...

Tuesday 12 August 2025

China eyes 2027 BCI breakthrough as it races to build its own chips

China's brain-computer interface (BCI) sector is accelerating, driven by strong state policy support and private-sector advances. The Ministry of Industry and Information Technology...

Thursday 31 July 2025

Samsung outlines mobile growth and AI strategy amid tariff concerns, highlights 2nm Exynos roadmap

During its second quarter 2025 earnings call, Samsung Electronics addressed the outlook for its Mobile Experience (MX) division and unveiled strategic plans focused on AI innovation...

Wednesday 30 July 2025

Lisuan, Intellifusion unveil SMIC-based GPUs and NPUs to anchor China's AI stack

At the 2025 World Artificial Intelligence Conference (WAIC), Chinese AI chipmakers announced major advances in high-end chip design, manufacturing, and deployment. Lisuan Tech introduced...

Friday 25 July 2025

Rebellions partners with CoAsia SEMI to deliver AI chiplets to data centers worldwide

South Korean AI semiconductor startup Rebellions has inked a strategic partnership with system-on-chip (SoC) design house CoAsia SEMI...

Wednesday 23 July 2025

Big moon plans, few rocket orders: South Korea's aerospace ambition faces reality check

South Korea has laid out an ambitious vision to become a major player in the new space economy, with a long-term goal of landing on the Moon using domestically developed rockets and...

Tuesday 22 July 2025

Tenstorrent pushes RISC-V into AI's fast lane with open chiplet strategy

The rise of AI and high-performance computing (HPC) is accelerating the adoption of RISC-V, the open-source instruction set architecture that is reshaping the global semiconductor...

Friday 11 July 2025

Samsung recalibrates chip strategy as 2nm becomes the new battleground

Samsung Electronics is entering a period of introspection and recalibration in its semiconductor foundry business, shifting focus from speed-driven innovation to consolidating its...

Wednesday 9 July 2025

Hanmi's HBM4 tools go live, but is 2029 too late for hybrid bonding?

Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...

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Sep 9, 12:48

Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads

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