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Thursday 23 September 2021
Military applications rising as niche market for GaN-on-SiC RF components, says Transcom
GaAs device and foundry company Transom expects military-use radars and other defense systems to emerge as niche application outlet for GaN-on-SiC RF components and modules including...
Thursday 16 September 2021
Monolithic/heterogeneous integration to drive Silicon 4.0: Q&A with Etron chairman Nicky Lu
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
Tuesday 14 September 2021
SMIC to build additional, considerable 28nm and above process capacity
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Wednesday 18 August 2021
China top-3 OSATs hike quotes by 20-30% for rush orders
China's top-3 backend houses JCET, Tongfu Microelectronics, and Tianshui Huatain Technology are all set to gain big from robust packaging demand in the second half of the year, having...
Wednesday 4 August 2021
Taiwan backend houses bracing for robust China mature-node chips demand
Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...
Monday 26 July 2021
TSMC in early stage talks over new German fab possibility
TSMC is in the early stages of discussions with clients over the feasibility of setting up a new fab in Germany, chairman Mark Liu told shareholders at the company's annual general...
Monday 19 July 2021
Highlights of the day: China keen to improve IC self-sufficiency
China, which has been relying heavily on semiconductor imports, is keen to improve it IC self-sufficiency. But DIGITIMES Asia president Colley...
Wednesday 7 July 2021
TSMC under US pressure over expansion at China fab
TSMC is coming under pressure from the US over its plan to expand foundry capacity in China, according to industry sources.
Thursday 18 February 2021
TSMC could set up fab in Europe
TSMC could set up an advanced wafer fab in Europe, where demand for leading-edge chip fabrication is promising, according to industry observers.
Thursday 7 January 2021
China to fall far short of IC self-sufficiency goal by 2025, says IC Insights
IC Insights has forecast that China-produced ICs will represent only 19.4% of the country's IC market in 2025, a fraction of the country's "Made in China 2025" goal of 70%.
Thursday 24 December 2020
Longsys preps for IPO
Memory module firm Longsys Electronics has filed an application for its A-shares IPO and expects to trade on the Shenzhen Stock Exchange (SZSE).
Wednesday 16 December 2020
China IC foundry output to continue growth in 2021, says Digitimes Research
China's IC foundry industry will register another growth in output next year, driven by the country's efforts in boosting its IC self-sufficiency, as well as international chipmakers'...
Thursday 10 December 2020
China gearing up for homegrown EDA solutions
China is stepping up the development of homegrown EDA (electronic design automation) software and systems as part of its efforts to boost self-sufficiency in semiconductor, and many...
Friday 6 November 2020
Taiwan backend houses see surging CIS orders from OmniVision
Taiwan's backend houses including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC) and Xintec have seen orders from China-based CMOS image sensor (CIS) vendor OmniVision...