Taiwan is a semiconductor manufacturing powerhouse, but it relies heavily on foreign equipment suppliers. Now the country's president has vowed to improve Taiwan's...
Taiwan will be accelerating its push for semiconductor equipment self-sufficiency, because of robust demand from its local chipmaking sector, according to president Tsai Ing-wen.
ACM Research, a supplier of wafer cleaning technologies for advanced semiconductor devices, has had its Shanghai-based subsidiary start trading on the science and technology innovation...
China has been aggressively developing its domestic third-generation semiconductor supply chain with government subsidies, which Taiwan-based makers regard as unfair competition challenging...
With Intel announcing plans to adopt ASML's high-NA EUV machines in its post-nanometer process technology that is expected to be ready for production by 2025, ASML has disclosed it...
Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...
The impact of government-led power restrictions on China's local industry supply chains is threatening to prolong delivery lead times for ICs, according to industry sources in Chin...
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
GaAs device and foundry company Transom expects military-use radars and other defense systems to emerge as niche application outlet for GaN-on-SiC RF components and modules including...
While global chip shortages can hardly ease in the short term and prices continue to rise further, regional semiconductor fleets are quietly taking shape as the US, EU, South Korea,...
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
China's top-3 backend houses JCET, Tongfu Microelectronics, and Tianshui Huatain Technology are all set to gain big from robust packaging demand in the second half of the year, having...
Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...
TSMC is in the early stages of discussions with clients over the feasibility of setting up a new fab in Germany, chairman Mark Liu told shareholders at the company's annual general...
