SEMICON China 2024, which was held in Shanghai on March 20-22, attracted many Japanese semiconductor equipment manufacturers to showcase their front-end and backend mature node process...
TSMC founder Morris Chang on July 4 delivered a keynote speech titled "Redefining Globalization," presenting his views on the current geopolitics and posing a question to the audience,...
High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...
China faces an unprecedented chip shortages, and homegrown chipmakers can address their slow capacity expansions by seeking breakthroughs in mature specialty process nodes and pursuing...
Whenever Moore's Law has seemingly reached its physical limits, there have been always new tech innovations emerging to break the limits, with EUV process and advanced packaging technology...
SEMICON/FPD China 2020 and related events slated for March will be postponed in the wake of the coronavirus outbreak in the country, according to the organizer.
Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with Japan's ShibaSoku under which Spirox will sell ShibaSoku's semiconductor test...
SEMICON China 2019 will open March 20 for a three-day run at Shanghai New International Expo Center, with global semiconductor industrial chains to showcase their latest technologies,...
Leading semiconductor test equipment supplier Advantest Corporation will present more than a dozen of its newest, most advanced systems and services for the Chinese market at Semicon...
After soaring 22.3% on year to hit a 7-year annual high of US$420 billion in 2017, the global semiconductor revenues will enter a new round of growth mainly driven by AI and 5G technologies...
Bolstered by China's large population, solid mobile network infrastructures, and aggressive deployments in IoT and AI applications, the localization of its semiconductor industry...
At Semicon China 2017, executives at chip giant Intel, IC packager Advanced Semiconductor Engineering, equipment vendors ASML, Lam Research and Tokyo Electron (TEL), and nano-electronics...
Yangtze River Storage Technology's (YMTC) development of 3D NAND flash technology is well on track, and equipment for the production of 3D NAND chips will be installed at its fab...
