Touch sensor maker HannsTouch Solution, due to growing demand for touch sensors used in AMOLED panels, will invest NT$1.8 billion (US$58.3 million) to expand production capacity from...
Fingerprint sensor maker Egis Technology (Egistec) has reported revenues of NT$387 million (US$12.53 million) for February, down 16.41% on month but up 427.5% on year.
Demand for fingerprint-recognition ICs, power management chips and touch with display driver IC (TDDI) solutions is set to be brisk in 2017, according to Charles Hsu, chairman for...
ShunSin Technology, a subsidiary of Foxconn Electronics specializing in assembly and test of system-in-package (SiP) modules, plans to focus more on fingerprint sensor and telematics...
IC foundries will continue to see a pull-in of orders for fingerprint-recognition sensor chips to fill their 8-inch fab capacity in 2017, according to industry sources. Meanwhile,...
Taiwan-based MediaTek and Egis Technology (Egistec) have both cut into the supply chain for Samsung Electronics' Galaxy smartphones, and are expected to see the orders bring in new...
High-resolution automative panels and handsets with dual-lens camera modules will spur demand for CMOS image sensors, particularly high-end ones, according to industry sources.
Himax Imaging, a subsidiary of Himax Technologies, has announced the HM5530 UltraSenseIR product, a low-power and low-noise 5.5-megapixel backside-illuminated (BSI) CMOS image sensor...
Taiwan-based fingerprint sensor supplier Egis Technology (Egistec) has reported October revenues surged 84.7% on month to NT$301 million (US$9.4 million).
CIS module maker Asia Tech Image has reported net profits of NT$113 million (US$3.579 million) for the third quarter of 2016, increasing 51% from a quarter earlier. EPS for the quarter...
More than 30 IC design houses will vie for the growing fingerprint sensor market in 2017 due to the increasing penetration of the identification chips in the high-end smartphone segment,...
Taiwan Semiconductor Manufacturing Company (TSMC) has received orders from Fingerprint Cards (FPC) with production set to kick off in the first quarter of 2017, according to a recent...
China-based BOE has teamed up at least 100 engineers engaged in R&D for bio-sensors, according to industry sources. A business unit has also been set up under BOE to focus on...
Advanced Semiconductor Engineering (ASE), through its Shanghai-based subsidiary Universal Scientific Industrial (USI), has obtained SiP (system-in-package) backend orders for Wi-Fi,...
