Amazon.com Inc. plans to spend US$9 billion expanding its cloud computing infrastructure in Singapore, the latest global tech company to boost investment in Southeast Asia.
Malaysia's Johor state has emerged as a main hub for data center construction in the country, attributed to its proximity to Singapore, relatively, inexpensive land, water, and electricity...
UnaBiz, a Massive Internet of Things (IoT) service provider and integrator, announces performance evolution on Sigfox 0G technology, reducing device energy consumption by up to 18...
Microsoft Corp. will invest $2.2 billion to build digital infrastructure in Malaysia, the latest in a series of big-ticket bets on Asia's rising prominence as a technology market.
Taiwan's PCB and semiconductor equipment manufacturers are poised to enhance their footprint in Southeast Asia by establishing manufacturing operations or bolstering their customer...
The international maritime logistics sector has faced multiple challenges, including the 2023 Red Sea crisis and the recent conflict between Israel and Iran. The regional tension...
Apple CEO Tim Cook recently concluded his most extensive Southeast Asia (SEA) tour in years, visiting Vietnam, Indonesia, and Singapore from April 15-19.
Apple Inc. Chief Executive Officer Tim Cook is meeting Singapore's leader at the tail end of his most extensive Southeast Asia tour in years, searching for new growth markets and...
In recent years, Taiwan-based IPC (Industrial PC) manufacturers have accelerated their production diversification, driven by geopolitical factors and local manufacturing incentive...
After experiencing inventory adjustments and a downturn in demand in the semiconductor market from the second half of 2022 to the end of 2023, Fang Leuh, the Chairman of Vanguard...
In the face of an impending climate crisis, the global carbon compliance and voluntary credit market are projected to soar to unprecedented heights, reaching a staggering US$2.68...
Japan-based Toppan announced a plan to build a plant in Singapore for producing FC-BGA substrates used in chip packaging, with operations expected to begin by the end of 2026. If...