STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...
Taiwan Semiconductor Manufacturing Company (TSMC) has recently reshuffled its management teams in Taiwan, China and Singapore to prepare for future deployment in the China market,...
Singapore's STATS ChipPAC has posted sales of US$324.6 million for the fourth quarter of 2008, down 31.3% sequentially and 31.9% from 2007. For the full year 2008, the packaging and...
HTC (High Tech Computer) and Singapore Telecommunications (SingTel) on February 5 jointly unveiled the first Android-powered mobile phone, the HTC Dream, in Singapore and Australia...
France-based Soitec, the world's leading supplier of silicon-on-insulator (SOI) wafers, recently held an inauguration ceremony for its new wafer fab in Singapore. Located in the new...
Chunghwa Telecom (CHT) on August 26 announced it will add investment of NT$3.3 billion (US$105 million) in Chunghwa Teleocm Singapore Pte., its wholly owned subsidiary in Singapore,...
Chunghwa Telecom (CHT) will reduce its cumulative legally required capital surplus by NT$19.116 billion (US$629 million) by shifting the fund to paid-in capital and then downsizing...
