Taiwan-based Shenmao Technology, which manufactures solder materials for IC packaging, plans to set up new plants in China in order to sustain future growth, according to the compa...
Shares of Taiwan-based solder material supplier Chernan Technology made their debut on the OTC (over-the-counter) stock market with an initial price of NT$50 (US$1.674) on December...
Shenmao Technology, a solder bumping paste supplier, has said revenues for the second quarter are expected to hold level or grow from the first quarter. Revenues for the ongoing first...
Taiwan-based solder material maker Shenmao Technology posted record net profits of NT$148 million (US$4.5 million) in the third quarter of 2009 mainly due to orders for BGA spheres...
Taiwan-based ball-grid array (BGA) solder sphere maker Shenmao Technology saw its consolidated revenues increase 6.4% sequentially to hit a year-high of NT$575 million (US$17.86 million)...
Shenmao Technology has expanded its production capacity of ball-grid array (BGA) solder spheres, its main product line, by 70% to meet orders from new clients, according to the com...
Shenmao Technology is optimistic about its second-quarter outlook, and market watchers expect its revenues to grow 40-50% in the quarter, with strong sales of solder paste and ball-grid...
Material supplier Shenmao Technology received orders for ball-grid array (BGA) solder spheres from two connector customers earlier in March and will begin volume shipments in April,...
Shenmao Technology anticipates a double-digit sequential sales growth in the third quarter thanks to sales contributions from new solder spheres and applications.
