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    NEWS TAGGED SOW
    Thursday 25 April 2024
    TSMC debuts A16 technology at 2024 North America Technology Symposium
    At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
    TPCA
    BIZ FOCUS
    Sep 26, 09:48
    SK Hynix begins volume production of the world's first 12-Layer HBM3E
    Thursday 26 September 2024
    Quebec's strategy for closing America's semiconductor talent gap
    Wednesday 25 September 2024
    SHARE WELL Intelligent Technology: Unleashing smart strength, pioneering industry with cutting-edge solutions
    Tuesday 24 September 2024
    GUC announces adoption of HBM3E IP by CSP data center
    RESEARCH INSIGHTS
    Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
    SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
    Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research