Memory module firm Transcend Information has reported consolidated revenues of NT$1.62 billion (US$53.7 million) for May 2017, down 2.5% sequentially and 6.3% on year.
The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...
Memory device controller supplier Phison Electronics has reported net profits increased 38% from a year earlier to NT$1.28 billion (US$42.4 million) in the first quarter of 2017,...
Taiwan Semiconductor Manufacturing Company (TSMC) has secured 12nm chip orders from Nvidia, MediaTek, Silicon Motion Technology and HiSilicon for the fabless firms' different chip...
Quanta Storage has reported first-quarter 2017 consolidated revenues of NT$1.91 billion (US$63 million), growing 3.65% on year, net operating profit of NT$203.3 million, up 184.34%,...
Macronix International has been engaged in the development of 3D NAND technology, and expects to enter volume production of chips built using the technology for SSDs in 2018, according...
SK Hynix has reported operating profits of KRW2.47 trillion (US$2.2 billion) on consolidated revenues of KRW6.29 trillion for the first quarter of 2017, with both results hitting...
To meet the ever growing demands of the embedded and industrial storage market, Innodisk is launching the 3IE4 series with integrated Marvell controllers. Running on Innodisk's proprietary...
Toshiba achieved strong results for its hard disc drive (HDD) and solid state drive (SSD) businesses in 2016 with both product lines showing stronger on-year shipment growths than...
Memory module company Transcend Information has reported net profits fell 10.5% on year to NT$2.88 billion (US$92.8 million) in 2016. EPS for the year came to NT$6.69.
Hard disk drive (HDD) players such as Seagate, have been pushing into the solid state drive (SSD) market via acquisitions or forming strategic alliances with SSD partners for the...
Toshiba has unveiled the latest addition to its line-up of BiCS flash 3D flash memory with a stacked cell structure, a 64-layer device that achieves a 512-gigabit (64-gigabytes) capacity...