Tape COF substrate demand has been falling thanks partly to insufficient foundry support for LCD driver ICs, and may not pick up until the first quarter of 2021, prompting some makers...
The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to...
PCB and IC substrate maker Unimicron Technology has expressed caution about its performance in the fourth quarter of 2020, despite a pick-up in demand for handsets.
IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology have reported impressive revenue increases for the third quarter of 2020 on strong shipments of diverse substrate...
Taiwan-based IC substrate makers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are being discouraged from making further investments in China by the...
Both Intel and AMD reportedly have resumed shipments to Huawei after obtaining export permits from US authorities, but Taiwan's IC substrates do not expect their revenues to receive...
Taiwan-based Unimicron, Nan Ya PCB and Kinsus Interconnect Technology have seen their ABF substrate capacities fully booked throughout the first half of 2021 thanks to strong demand...
Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...
IC substrate maker Kinsus Interconnect Technology expects to post a revenue increase of 5-10% sequentially in the third quarter, followed by another 5-10% growth in the fourth.
TSMC, ASE Technology, IC substrate makers including Unimicron Technology as well as international materials and equipment suppliers are all gearing up for the SiP (system-in-package)...
A fire broke out at Unimicron Technology's factory in Kunshan, China on September 7, with details of the losses still being evaluated and cause of the fire under police investigation,...
China is aggressively building its own SiC components supply chain for EV and other emerging applications, and as many as 14 makers are engaged in the development and production of...
PCB and IC substrate suppliers have seen their shipments for TWS earbuds pick up significantly since the start of second-half 2020, and expect the shipment pull-in momentum to last...
IC substrate maker Kinsus Interconnect Technology will build ABF substrate production lines at a plant it recently acquired from the bankrupt Chunghwa Picture Tubes (CPT) in Yangmei,...
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
