The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...
Chip-on-film (COF) substrate suppliers JMC Electronics is expected to see its revenue and profit climb to record-high levels in the second quarter of 2019, driven mainly by a rally...
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...
Chang Wah Technology (CWTC) continues to enhance its pre-mold quad flat no-lead (QFN) leadframe offerings, and has developed pre-mold metal substrate (PMMS) technology for the emerging...
Unimicron Technology is scheduled to break ground for a new plant in Taoyuan, northern Taiwan in July followed by equipment move-in a year later. The new facility is designed for...
Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...
Chip-on-film (COF) substrate suppliers JMC Electronics expects to post flat growth or a slight decrease sequentially in third-quarter revenues, due to a cutback in orders in the wake...
China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors...
Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...
Suppliers engaged in the supply chain for chip-on-film (COF) packaging remain optimistic about demand coming from the smartphone sector, citing the rising popularity of bezel-less...
The supply of ajinomoto build-up film (ABF) substrates has been tight, and will continue to fall short of demand in the second half of 2019, according to industry sources.
PCB and IC substrate maker Nanya Printed Circuit Board saw its net loss improve to NT$278 million (US$8.9 million) in the first quarter from loss of NT$677.9 million during the same...
Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates...
Huawei has demanded more supplies from Taiwan-based chip-on-film (COF) substrate manufacturers including JMC Electronics and Chipbond Technology (formerly Simpal Electronics), and...
