Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...

Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...

Taiwan leading passive component maker Yageo will still do its best to satisfy customer demand for standard-type MLCCs for consumer devices despite its enhanced deployments in niche-type...

Corning has unveiled its new 10.5G LCD glass substrate manufacturing facility co-located with the BOE Technology Group (BOE) plant in the Hefei Xinzhan Hi-Tech Industrial Development...

Taiwan OSAT (outsourced semiconductor assembly and test) firms are facing headwinds in striving for flip-chip packaging orders for cryptocurrency mining ASICs, as the sharp price...

The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...

Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...

ASE Embedded Electronics, a joint venture between Advanced Semiconductor Engineering (ASE) and TDK, has started operations.

Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...

IC substrate supplier Kinsus Interconnect Technology's net profits fell 78% on year to NT$491 million (US$16.8 million) in 2017. EPS for the year came to NT$1.10, down from NT$5.01...

IC substrate supplier Kinsus Interconnect Technology saw its October revenues climb to a record high of NT$2.48 billion (US$82.3 million).

IC substrate supplier Kinsus Interconnect Technology has reported net profits of NT$476 million (US$15.8 million) for the first three quarters of 2017, down 72.7% on year, with EPS...

IC substrate maker Kinsus Interconnect Technology is expected to enjoy an up to 20% sequential increase in fourth-quarter 2017 revenues, driven mainly by a ramp-up of orders for substrate-like...

IC substrate maker Kinsus Interconnect Technology has reported net profits for the first half of 2017 declined 82.1% from a year earlier to NT$199 million (US$6.6 million). EPS for...

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, started shipments for 3D sensing products in small...