Taiwan OSAT (outsourced semiconductor assembly and test) firms are facing headwinds in striving for flip-chip packaging orders for cryptocurrency mining ASICs, as the sharp price...

The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...

Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...

ASE Embedded Electronics, a joint venture between Advanced Semiconductor Engineering (ASE) and TDK, has started operations.

Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...

IC substrate supplier Kinsus Interconnect Technology's net profits fell 78% on year to NT$491 million (US$16.8 million) in 2017. EPS for the year came to NT$1.10, down from NT$5.01...

IC substrate supplier Kinsus Interconnect Technology saw its October revenues climb to a record high of NT$2.48 billion (US$82.3 million).

IC substrate supplier Kinsus Interconnect Technology has reported net profits of NT$476 million (US$15.8 million) for the first three quarters of 2017, down 72.7% on year, with EPS...

IC substrate maker Kinsus Interconnect Technology is expected to enjoy an up to 20% sequential increase in fourth-quarter 2017 revenues, driven mainly by a ramp-up of orders for substrate-like...

IC substrate maker Kinsus Interconnect Technology has reported net profits for the first half of 2017 declined 82.1% from a year earlier to NT$199 million (US$6.6 million). EPS for...

Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, started shipments for 3D sensing products in small...

Intelligent Epitaxy Technology (IntelliEPI), which supplies epitaxy-based compound semiconductor epi-wafers to the electronics and optoelectronics industries, expects to post sequential...

One of the hottest areas of investment in the display panel industry in 2017 is coming from the AMOLED sector, with China being ground zero for capacity expansion. According to Digitimes...

JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, has expressed optimism about demand for smartphones...

Japan-based glass substrate maker Nippon Electric Glass (NEG) will cooperate with China-based Dongxu Optoelectronic Technology (DOT) to set up a glass substrate processing factory...