Demand for ABF (ajinomoto build-up film) substrates continues to be strong while demand for other IC substrate and PCB products is being affected by seasonal factors, according to...

Chances are not high for leadframe suppliers to score double-digit revenue increases in 2019, and China leadframe supply chain can hardly emerge to threaten Taiwan peers, according...

PCB and IC substrate supplier Unimicron Technology swung to net profits of NT$982 million (US$31.8 million) in the third quarter of 2018 from losses in the prior quarter and a year...

JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, has enjoyed robust orders for Android smartphones...

LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...

Taiwan-based Flexium Interconnect and Unimicron Technology have both been fined for violating environmental regulations in Kunshan, China.

The supply of ABF (ajinomoto build-up film) substrates has become tight, thanks to growing demand for server and high-performance computing applications, according to industry sour...

Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...

Nanya Printed Circuit Board is striving to lower its operating losses by developing high-margin products such as those for automotive electronics, 5G and AI applications, according...

Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...

Unimicron Technology (Kunshan), a subsidiary of Taiwan-based PCB and IC substrate manufacturer Unimicron, has been fined CNY380,000 (US$55,520) for breaking local environmental laws,...

Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...

Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...

Taiwan leading passive component maker Yageo will still do its best to satisfy customer demand for standard-type MLCCs for consumer devices despite its enhanced deployments in niche-type...

Corning has unveiled its new 10.5G LCD glass substrate manufacturing facility co-located with the BOE Technology Group (BOE) plant in the Hefei Xinzhan Hi-Tech Industrial Development...