LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...

Taiwan-based Flexium Interconnect and Unimicron Technology have both been fined for violating environmental regulations in Kunshan, China.

The supply of ABF (ajinomoto build-up film) substrates has become tight, thanks to growing demand for server and high-performance computing applications, according to industry sour...

Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products,...

Nanya Printed Circuit Board is striving to lower its operating losses by developing high-margin products such as those for automotive electronics, 5G and AI applications, according...

Driver IC backend specialists have inked supply deals with several of their fabless clients, and have promised sufficient capacity for COF (chip-on-film) packaging over the next three...

Unimicron Technology (Kunshan), a subsidiary of Taiwan-based PCB and IC substrate manufacturer Unimicron, has been fined CNY380,000 (US$55,520) for breaking local environmental laws,...

Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second...

Copper clad laminate (CCL) supplier Ventec International plans to apply for listing on the Taiwan Stock Exchange (TWSE) mainboard in the first quarter of 2019, according to company...

Taiwan leading passive component maker Yageo will still do its best to satisfy customer demand for standard-type MLCCs for consumer devices despite its enhanced deployments in niche-type...

Corning has unveiled its new 10.5G LCD glass substrate manufacturing facility co-located with the BOE Technology Group (BOE) plant in the Hefei Xinzhan Hi-Tech Industrial Development...

Taiwan OSAT (outsourced semiconductor assembly and test) firms are facing headwinds in striving for flip-chip packaging orders for cryptocurrency mining ASICs, as the sharp price...

The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...

Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according...

ASE Embedded Electronics, a joint venture between Advanced Semiconductor Engineering (ASE) and TDK, has started operations.