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NEWS TAGGED SUBSTRATE
Wednesday 7 August 2019
PCB makers increasing ABF substrate capacity
IC substrate suppliers are moving to allocate part of their substrate-like PCBs (SLP) capacity to support production of ABF substrates that see robust demand, according to industry...
Wednesday 17 July 2019
PCB maker Dynamic denies report it will sell Taiwan plant
Rigid-flexible PCB maker Dynamic Electronics has dismissed a recent Chinese-language report indicating the company plans to sell its factory site in Taiwan to a fellow Taiwan-based...
Tuesday 16 July 2019
Taiwan backend houses to see Huawei orders pick up
Taiwan-based backend houses and COF substrate suppliers will see orders from Huawei pick up in July or August, according to industry sources.
Wednesday 10 July 2019
Order visibility for IC packaging materials clear throughout 3Q19
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
Tuesday 2 July 2019
TDDI IC supply chain turns optimistic about 2H19 on Huawei ban easing
Taiwan's handset TDDI IC supply chain for Huawei, including designers, backend COF service providers and substrate suppliers, have turned guardedly optimistic about their business...
Wednesday 26 June 2019
Unimicron, Na Ya to gain from high-specs ABF substrates in 2H19
The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end...
Wednesday 26 June 2019
COF substrate firm JMC to enjoy record sales in 2Q19
Chip-on-film (COF) substrate suppliers JMC Electronics is expected to see its revenue and profit climb to record-high levels in the second quarter of 2019, driven mainly by a rally...
Monday 24 June 2019
Yageo chairman takes helm of Tong Hsing
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...
Tuesday 18 June 2019
Chang Wah growing pre-mold QFN leadframe offering
Chang Wah Technology (CWTC) continues to enhance its pre-mold quad flat no-lead (QFN) leadframe offerings, and has developed pre-mold metal substrate (PMMS) technology for the emerging...
Friday 14 June 2019
Unimicron to build new IC substrate plant
Unimicron Technology is scheduled to break ground for a new plant in Taoyuan, northern Taiwan in July followed by equipment move-in a year later. The new facility is designed for...
Thursday 13 June 2019
JMC finds strength to compete with bigger rivals
Taiwan-based JMC Electronics, which uses both subtrative and semi-additive processes to manufacture chip-on-film (COF) substrates, has strength to better compete with its larger international...
Wednesday 12 June 2019
JMC expects flat growth or slight decrease in 3Q19 revenues
Chip-on-film (COF) substrate suppliers JMC Electronics expects to post flat growth or a slight decrease sequentially in third-quarter revenues, due to a cutback in orders in the wake...
Monday 10 June 2019
Shennan Circuits expanding IC substrate market presence
China's Shennan Circuit has managed to generate profits from its IC substrate business, and has expanded its IC substrate offerings to include those for handset-use application processors...
Monday 10 June 2019
CCL maker EMC optimistic about 2019
CCL firm Elite Materials (EMC) has expressed optimism about its revenue and profit performance in 2019, driven mainly by rising product ASPs.
Wednesday 5 June 2019
Unimicron, Kinsus to expand additional ABF substrate capacities
Unimicron Technology and Kinsus Interconnect Technology both have plans to expand additional new capacities for ABF (ajinomoto build-up film) substrates judging from robust demand...
TPCA
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research