E-reader manufacturer Netronix said it struggled to meet demands for color e-readers. The company views color e-readers and digital advertising signage as its two growth engines for...

Samsung Display (SDC), which has long exited the LCD business, has reportedly purchased 107 US LCD patents from Taiwanese company AUO.

According to Gogoro's press release, Nebula Energy and Gogoro have announced the upcoming launch of Gogoro's battery-swapping technology and Smartscooters in the Kathmandu Valley,...

Samsung Display (SDC) has reportedly achieved a breakthrough in tandem OLED yield rates, positioning the company to increase its supply of OLED panels for tablets and to aggressively...

AMOLED is steadily gaining ground over LCD in the display market, a shift that Taiwan Perovskite Solar Corp believes mirrors the early days of perovskite solar cells. Just as AMOLED...

Hyperscale data center operators are adopting large volumes of high-end Ethernet chips to ensure all high-end GPUs in data centers can be connected to form a massive supercomputer,...

Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence (AI), and high-performance computing (HPC).

As AI technology continues to permeate various industries, the demand for AI servers is seeing steady growth. With Nvidia's Blackwell GB200 set to begin mass production, a surge in...

Taiwan Perovskite Solar Corp. (TPSC) has invested more than NT$200 million (US$6.3 million) to build Taiwan's first carbon-free perovskite plant, which has delivered the first batch...

In a significant leap forward for semiconductor manufacturing, ifm, a global leader in sensor technology, exhibited a comprehensive suite of smart sensing solutions at SEMICON Taiwan...

Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...

Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging.

SK Hynix announced today that it has developed the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.

In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...