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Friday 29 November 2024
Huawei expands EV presence with new trademark filings in China
Huawei has registered several new trademarks for electric vehicles (EVs) in China, signaling deeper collaboration with Chinese automakers.
Friday 29 November 2024
Likelihood of widespread OLED TV adoption is decreasing, says TCL exec
South Korean companies have increasingly focused on OLED technology to differentiate themselves from Chinese competitors in the television market. However, recent comments from Jun...
Friday 29 November 2024
India to double 5G subscription by 2030
A recent Ericsson Mobility Report published on November 26 indicates that 5G subscriptions in India, Bhutan, and Nepal will surpass 270 million by the end of 2024, accounting for...
Friday 29 November 2024
India and Siemens offers IC design resources with ChipIN Centre
India's Centre for Development of Advanced Computing (C-DAC) has launched the ChipIN Centre as a central hub for semiconductor design, providing comprehensive tools and resources...
Thursday 28 November 2024
SK Hynix's NAND production reportedly accelerates, increasing competitive pressure on Samsung
SK Hynix has reportedly begun mass production of its 321-layer 1Tb TLC 3D NAND Flash products, posing a potential threat to Samsung Electronics' (Samsung) leading position. This development...
Thursday 28 November 2024
Taiwanese firms target wireless charging chip opportunities amid prospects of wearable technology
When the Wireless Power Consortium (WPC) announced the Qi2 wireless charging standard in 2023, attention was on its integration progress into smartphones. Supply chain members, however,...
Thursday 28 November 2024
Funding cuts, layoffs, and reorganization common in China's competitive chip industry
In 2024, major Chinese semiconductor businesses continue to announce closures or severe layoffs, according to industry sources. Xiangdixian Computing Technology, commonly referred...
Thursday 28 November 2024
Equipment supplier gives hints at FOPLP development progress among Taiwanese companies
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
Thursday 28 November 2024
Apple's AI revolution: From Macintosh to Silicon mastery in 40 years
Since unveiling Apple Silicon in 2020, Apple has redefined Mac chip technology through three transformative shifts. While the company initially planned a two-year transition from...
Thursday 28 November 2024
Onsemi targets China's automotive and energy storage growth
Onsemi's leadership has been increasing its presence in China recently. After Felicity Carson, SVP of global operations at Onsemi, attended PCIM Asia 2024 in Shenzhen at the end of...
Wednesday 27 November 2024
TSMC's CoWoS far from secure: Etron CEO flags Intel EMIB's rising threat
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
Wednesday 27 November 2024
Samsung hires new foundry CTO amidst leadership changes
Samsung Electronics has enacted changes to its management, including the appointment of a new chief technology officer (CTO) for its foundry operations.
Wednesday 27 November 2024
US sanctions threaten to snuff out China's nascent HBM development
While the US has not yet imposed sanctions on China's high-bandwidth memory (HBM) chips and manufacturing equipment, industry sources expect such restrictions are inevitable. This...
Wednesday 27 November 2024
Speculation arises about AMD developing AI mobile chip; insiders remain doubtful
Recent market speculation suggests that AMD has developed an AI processor (APU/NPU) suitable for mobile devices. With its exclusive GPU technology, it is expected to compete in the...
Tuesday 26 November 2024
Intel secures US$7.865 billion in CHIPS Act subsidies, lower than initial memorandum amount
Revised Award Provides Up to $7.865 Billion in Direct Funding, Down from $8.5 Billion, to Support Intel's $100+ Billion Expansion Plan Across Four U.S. States
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research