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Thursday 5 September 2024
Merck steps up investment in Taiwan
Merck continues to increase its investment in Taiwan, believing that essential materials are the most lacking element in Taiwan's AI industry supply chain and that it is well-positioned...
Thursday 5 September 2024
EML technology to reach market faster than SiPh, says Broadcom exec
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
Wednesday 4 September 2024
AI chip development still faces interconnect and other tech constraints, says MediaTek CEO
During a recent public discussion with Imec CEO Luc Van den Hove, MediaTek CEO Rick Tsai highlighted that there are still technical barriers to AI chip development, such as chip interconnect...
Wednesday 4 September 2024
Iris Optronics sets up first overseas subsidiary in Shanghai
Iris Optronics, a cholesteric liquid crystal display (ChLCD) technology provider, has established its first overseas subsidiary in Qingpu District, Shanghai.
Wednesday 4 September 2024
FOPLP gains momentum in advanced packaging as AI demand surges
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
Wednesday 4 September 2024
TSMC, other Taiwan firms form alliance to advance SiPh
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
Wednesday 4 September 2024
SEMICON Taiwan 2024: AI chipmaking, HBM in spotlight
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
Wednesday 4 September 2024
SEMICON Taiwan 2024 to feature TSMC, Samsung, SK Hynix
SEMICON Taiwan 2024 will feature more than 1,000 firms and up to 3,700 booths, including Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and SK Hynix.
Wednesday 4 September 2024
SK Hynix developing 16-layer HBM4 memory
SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...
Tuesday 3 September 2024
SiC surge amid growing investment and demand uncertainty
As electronic products demand higher power density, driven by rising energy needs, third-generation semiconductors have become crucial. Among these, silicon carbide (SiC), known for...
Tuesday 3 September 2024
Geely EVs use Rohm new-gen SiC MOSFET bare chips
Rohm Semiconductor has announced the use of power modules equipped with the company's fourth-generation SiC MOSFET bare chips for traction inverters in three ZEEKR EV models manufactured...
Tuesday 3 September 2024
AUO's LTPS and OLED test results revealed power-efficient panels to be crucial for AI PCs
AUO believes that power-saving technology for panels will play a key role in advancing AI PCs. The company is optimistic that LTPS technology is more power-efficient than dual-layer...
Tuesday 3 September 2024
E Ink and Iris covets China's color e-paper market as its sales surge over 30% in 1H24
According to online monitoring data from Runto Technology (Runto), sales of color e-paper products in China's market grew by 318.2% year-on-year in the first half of 2024, with the...
Tuesday 3 September 2024
At SEMICON Taiwan 2024, the AI focus turns to memory and network chipmakers
After more than a year of insight into AI models and hardware, the market has a better understanding of the upcoming bottlenecks facing cloud-based generative AI: high bandwidth memory...
Monday 2 September 2024
As GenAI transforms semiconductor technology, materials also need to become 'smart'
SEMICON Taiwan 2024 is fast approaching, and this year's event focuses on key industry topics such as advanced processes, heterogeneous integration, compound semiconductors, silicon...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research