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Thursday 19 June 2025
Wistron chair urges Taiwan to lead in AI, calls it key to future national power
Wistron chairman Simon Lin emphasized AI as a symbol of national power during the opening of the company's global operations headquarters at its Zhubei AI Park in Hsinchu County,...
Thursday 19 June 2025
Low-level light therapy innovations are shaping the horizons of electronic healthcare
Low-powered, low-level light therapy with light-emitting diodes (LED) at some specific wavelengths has attracted attention in wound healing indications to accelerate wound healing...
Thursday 19 June 2025
Taiwanese aerospace supplier wins three-year Kawasaki engine parts deal
Aerospace Industrial Development Corp. (AIDC) secured a three-year contract with Kawasaki Heavy Industries Ltd. to supply Trent XWB-97K aircraft engine components at the Paris Air...
Thursday 19 June 2025
LG Display plans huge investment to boost OLED technology through 2027
LG Display announced a planned investment of approximately KRW1.26 trillion (around US$920 million) to boost its OLED technology capabilities and support its ongoing shift from LCD...
Thursday 19 June 2025
Texas Instruments plans over US$60 billion investment for US foundational chip manufacturing
On June 18, 2025, Texas Instruments (TI) announced it will invest over US$60 billion in seven semiconductor fabs across the US. This historic investment aims to boost TI's domestic...
Thursday 19 June 2025
FineMat accelerates transformation as Chinese rivals intensify AMOLED metal mask competition
Taiwan-based FineMat Applied Materials held its shareholders' meeting on June 17, approving all proposals and outlining its strategic direction amid increasing competition in China's...
Thursday 19 June 2025
Taiwan advances passwordless tech for secure chip design environments
SYSTEX Corporation's subsidiary uniXecure has been appointed as the exclusive agent for AuthenTrend in Taiwan, marking a strategic move to promote passwordless authentication services...
Thursday 19 June 2025
ICT energy demand grows, efficiency gains mitigate impact
Amid rapid global advances in artificial intelligence and digital transformation, concerns have mounted regarding the soaring energy consumption of the information and communications...
Wednesday 18 June 2025
Samsung advances 4nm chiplet technology to boost AI chip foundry position
Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...
Wednesday 18 June 2025
With multiple AI-powered vision software innovations, LITEON Technology drives vehicle safety forward to seize opportunities in automotive market
LITEON Technology (LITEON) is actively deploying new Artificial Intelligence (AI)-assisted vision software technologies enabling a wide variety of features for improved road safety...
Wednesday 18 June 2025
Trump tightens China chip curbs as Nvidia's H20 faces new export limits
The US expanded semiconductor restrictions to include Nvidia's H20 chip, previously the only compliant AI processor available to Chinese buyers, as the Trump administration deepens...
Wednesday 18 June 2025
Intel to cut up to over 10,000 jobs starting mid-July
Intel is preparing to lay off between 15% and 20% of its Intel Foundry workforce starting in mid-July, potentially impacting between 8,170 and 10,900 employees worldwide, according...
Wednesday 18 June 2025
CXMT targets 2027 HBM3E launch as China races to close HBM gap
China continues to lag behind memory giants SK Hynix, Micron, and Samsung Electronics in developing high bandwidth memory (HBM) technology. Although US export controls on semiconductor...
Wednesday 18 June 2025
Japan's AGC and University of Tokyo unveil laser tech 1 million times faster for AI chip manufacturing

AGC, a leading Japanese manufacturer of specialty glass and ceramics, has partnered with researchers at the University of Tokyo to develop...

Wednesday 18 June 2025
Canon Machinery targets 2026 launch for hybrid bonding tools amid surge in advanced packaging demand
Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment...