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NEWS TAGGED TEXAS INSTRUMENTS
Wednesday 15 June 2011
TI reportedly cuts wafer starts at TSMC, UMC
Texas Instruments (TI) has cut its orders to Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), according to sources in the industry...
Thursday 2 June 2011
Microsoft postpones IDP for 2 weeks to re-consult with chip players
Microsoft has postponed its Integrated Development Program (IDP) for Windows 8 as the plan created significant dissatisfaction within the upstream supply chain. Microsoft is set to...
Friday 13 May 2011
TSMC receives more requests to produce analog chips using 12-inch, advanced processes
A number of international analog IC companies have been in talks with Taiwan Semiconductor Manufacturing Company (TSMC) for allocation of 12-inch wafer production capacity to put...
Tuesday 10 May 2011
Hard drive industry to continue facing shortage in May
Japan's earthquake in March has significantly impacted the supply status of the hard drive industry and the effect is expected to persist in May with two of the top-5 makers - Western...
Tuesday 26 April 2011
Low-priced Android handset shipments to boom in 2011, says Digitimes Research Special Report
Taipei, Taiwan, April 26, 2011 - A number of smaller handset vendors are rushing to launch low-priced (sub US$150) Android handsets targeting users in emerging markets in 2011, with...
Friday 15 April 2011
TI certifies 8-inch wafers from SAS, says paper
Eight-inch epitaxy wafers by Taiwan-based Sino-American Silicon Products (SAS) has been certified by Texas Instruments (TI), according to a Chinese-language Commercial Times...
Wednesday 13 April 2011
Yole lists top-30 MEMS companies in 2010: Big-4 capture one third of total market
The worldwide MEMS industry enjoyed a growth of 25% in 2010, according to a recent Yole Developpement report. Major players Texas Instruments (TI), Hewlett-Packard (HP), Robert Bosch...
Wednesday 13 April 2011
TI announces first USB-IF certified four-port host controller
Texas Instruments (TI) has announced that it is the first semiconductor company to receive certification from the USB Implementer's Forum (USB-IF) for its SuperSpeed USB (USB 3.0)...
Thursday 7 April 2011
IC packager Lingsen shares up on increased InvenSense orders, says report
InvenSense, which supplies MEMS gyroscopes for the Nintendo 3DS, is expected to increase its orders to backend partner Lingsen Precision Industries due to strong demand for the recently-launched...
Thursday 7 April 2011
Commentary: TI triggers new competition in analog IC market
After dedicating its own 12-inch wafer fab to the production of analog ICs, TI has taken over National Semiconductor (NS), with the aim of boosting its share in the global market...
Wednesday 6 April 2011
TI to acquire National Semiconductor for US$6.5 billion
Texas Instruments (TI) has signed a definitive agreement to purchase National Semiconductor in an all-cash transaction of about US$6.5 billion. Both companies will operate independently...
Wednesday 30 March 2011
Spansion increases outsourcing proportion to SMIC, says paper
NOR chip vendor Spansion will increase the proportion of its outsourcing to Semiconductor Manufacturing International Corporation (SMIC) to avoid potential supply chain disruptions,...
Thursday 24 March 2011
Japan earthquake impacts auto industry, says IHS
The earthquake and subsequent tsunami have impacted the entire automotive industry supply chain in Japan, including the infotainment segment, according to IHS iSuppli. This will have...
Wednesday 23 March 2011
Digitimes Insight: Sony, Renesas, TI impacted by earthquake for supply of ODD components
Sony, Renesas Electronics and Texas Instruments (TI), among makers of components of optical disc drives (ODDs) in Japan, have suffered the most impact of the large earthquake hitting...
Wednesday 16 March 2011
Integrated mobile processors to challenge standalone application processors, says Petrov Group (part 2)
Recently several handset IC companies have announced integrated mobile processors – products that integrate baseband processor and application processor together with graphics...