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NEWS TAGGED TICP
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Tuesday 13 July 2021
Taiwan 2nd-tier OSATs to embrace bright prospects for 2H21
Taiwan's second-tier IC backend houses are set to embrace brisker business results for the second half of the year thanks to a significant surge in customer orders, after posting...
Tuesday 12 March 2019
TICP to downsize capital 57.7%
Backend firm Taiwan IC Packaging (TICP) has disclosed plans to reduce paid-in capital by 57.7% to amend losses and strengthen its financial structure.
Friday 9 March 2018
Transcend posts EPS of NT$6.17 for 2017
Memory module firm Transcend Information has reported net profits of NT$2.66 billion (US$90.7 million) on consolidated revenues of NT$21 billion for 2017. The profits and revenues...
Monday 14 March 2016
TICP eyeing return to profits
Taiwan IC Packaging (TICP) expects to return to profitability in the second half of 2016. TICP swung to net losses of NT$110 million (US$3.37 million) in 2015 from profits of NT$62...
Friday 24 May 2013
Phison warns several backend firms of possible patent infringement
IC design house Phison Electronics has warned several Taiwan-based backend service providers that products being shipped to Silicon Motion Technology may infringe on its NAND flash...
Thursday 25 November 2010
Second-tier IC packagers 4Q10 sales to decline amid seasonal factors
Second-tier Taiwan-based IC packaging and testing companies Greatek Electronics, Lingsen Precision Industries and Taiwan IC Packaging (TICP) will likely see their revenues for the...
Wednesday 24 November 2010
ASE grabs copper wirebonding orders from second-tier players
With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...
Thursday 11 February 2010
Greatek and TICP to step into copper-wire bonding in 2Q10
With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...
Thursday 17 December 2009
Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman
The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...
Wednesday 19 November 2008
TICP sees memory card packaging orders pick up
Taiwan IC Packaging (TICP) has remarked that its overall performance in the fourth quarter of 2008 will be hit by the ongoing economic downturn. But orders for memory card packaging...
Thursday 28 August 2008
TICP conservative about memory card assembly demand
After seeing weak profits in the first half of 2008 and a declining utilization rate for memory card packaging, Taiwan IC Packaging (TICP) remains conservative about company prospect...
Thursday 3 July 2008
Packaging house TICP likely to trim its sales guidance
Taiwan IC Packaging (TICP) is likely to fall short of its sales guidance for 2008 and its profitability guidance for the second quarter, according to sources at the company.
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research