Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry so...
CMOS image sensor (CIS) packaging specialist Tong Hsing Electronic Industries is poised to see revenue contribution ratio for automotive applications climb to over 45% in 2022, and...
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has enjoyed strong demand for automotive...
It seems that CMOS image sensor (CIS) demand momentum for mainstream handset applications has become stagnant amid unclear market prospects, but the automotive CIS segment is emerging...
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Different IC segments will be experiencing mixed levels of price downward pressure at least in the first half of the year, according to industry sources.
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has expressed optimism that its strong shipments...
Amid the ongoing Russian-Ukraine war, SpaceX CEO Elon Musk responded to a public request from a Ukrainian politician to provide Starlink satellite internet services to Ukraine. Ukraine...
Automotive CMOS image sensor (CIS) packaging capacity at Taiwan-based OSATs such as Tong Hsing Electronic Industries and Xintec remains fully loaded, and they can easily carry out...
GEM Services and Lingsen Precision Industries, which specialize in power component and module backend services, and RF component and module packagers Tong Hsing Electronic Industries...
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has held a beam-raising ceremony for its...
