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    NEWS TAGGED TONGFU
    Friday 17 April 2026
    Tongfu Microelectronics profit jumps on AI chip packaging, AMD demand

    Tongfu Microelectronics posted strong 2025 results, supported by AI and automotive chip demand, while reinforcing its position in the...

    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

    Monday 3 November 2025
    Tongfu Microelectronics taps AMD synergy to command the AI packaging frontier
    Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...
    Friday 31 October 2025
    AMD ties pay off: Tongfu Microelectronics reaps AI-driven profit surge
    Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters...
    Wednesday 3 September 2025
    China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
    Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
    Monday 10 February 2025
    Weekly news roundup: ASML CEO signals US advantage; Tongfu reportedly begins HBM2 trial assembly
    These are the most-read DIGITIMES Asia stories from February 3 – February 8.
    Monday 3 February 2025
    China's Tongfu Microelectronics reportedly begins HBM2 trial assembly
    According to a report by Nikkei, Tongfu Microelectronics is rumored to have commenced trial production of high bandwidth memory (HBM2). This development follows fellow Chinese...
    Monday 23 December 2024
    TSMC's wafer manufacturing 2.0 reshapes advanced packaging market
    TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...
    Monday 30 September 2024
    China's top OSATs invest big in advanced packaging to compete globally
    China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
    Thursday 26 September 2024
    Tongfu Microelectronics and Tianshui Huatian invest in advanced packaging in China
    Tongfu Microelectronics and Tianshui Huatian, two major ATMP/OSAT providers in China, have announced fresh investments in their advanced packaging businesses.
    Friday 6 September 2024
    Chinese OSATs continue stepping up high-end packaging deployment
    Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
    Wednesday 28 August 2024
    Chinese OSAT eyes advanced packaging opportunities
    In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
    Friday 21 June 2024
    Chinese OSATs gear up for advanced packaging
    Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
    Wednesday 3 January 2024
    Chinese chip firms' valuations outperform local market in 2023; equipment shines
    China's semiconductor firms in the IC packaging & testing, equipment, foundry, and IC design industries performed much better than their IDM, materials, optoelectronics, and memory...
    Tuesday 19 December 2023
    Why would China send GPUs to Malaysia for advanced packaging?
    A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US would...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook